Geological controls on initial failure mechanisms of rock avalanches in central Apennines (Italy)

Author(s):  
G Fasani ◽  
C Esposito ◽  
A Maffei ◽  
G Mugnozza ◽  
S Evans
2021 ◽  
Author(s):  
Maria Luisa Putignano ◽  
Emiliano Di Luzio ◽  
Luca Schilirò ◽  
Andrea Pietrosante ◽  
Salvatore Ivo Giano

<p>In the last two decades large clastic deposits in Central Apennines with specific morphological and sedimentological features have been interpreted as the result of Quaternary rock avalanche events (e.g., Di Luzio et al., 2004; Bianchi Fasani et al., 2014; Schilirò et al., 2019; Antonielli et al., 2020). The analysis of such deposits, that are located within intermontane basins and narrow valleys bounded by high mountain ridges, have improved the knowledge about this kind of massive rock slope failures, also clarifying their relationship with Deep-seated Gravitational Slope Deformations.</p><p>The present study then describes a multidisciplinary analysis carried out on a huge rock block deposit which crops out within the Pretare-Piedilama Valley, in the piedmont junction area of the Sibillini Mountain range (Central Italy), where Mesozoic basinal carbonates overthrust Miocene foredeep deposits.</p><p>Specifically, we performed sedimentological, stratigraphical and morphometric analyses on the clastic deposit; results support the interpretation of the event as a rock avalanche body. The accumulation area shows a T-like shape with a wide, E-W-oriented, proximal part and a N-S channelization in the central and lower sectors. The evidence suggests erosional events and tectonics as controlling factors on rock flow deposition. In this respect, the area was involved in the 2016 central Italy seismic sequence and was tectonically active during Quaternary times<strong> </strong>(Tortorici et al., 2009).</p><p>As regards on the deposit genesis, considering the geometric characteristics of a sub-rectangular detachment area located on the southern edge of the Sibillini Range, an original mechanism of rockslide failure involving about 8·10<sup>6</sup>m<sup>3</sup> of Early Jurassic limestone was inferred. Here, the post-failure geomorphic features behind the main scarp are considered for the evaluation of hazard conditions.</p><p>Finally, well-log analysis of the clastic sequence filling the Pretare-Piedilama Valley evidenced additional Quaternary landslide events occurred before the rock avalanche, thus testifying to a long history of large slope instabilities in the area controlling the landscape development.</p><p> </p><p><strong>REFERENCES</strong></p><p> </p><ul><li>Antonielli B., Della Seta M., Esposito C., Scarascia-Mugnozza G., Schilirò L., Spadi M., Tallini M. (2020). Quaternary rock avalanches in the Apennines: New data and interpretation of the huge clastic deposit of the L'Aquila Basin (central Italy). Geomorphology, 361, 107-194. doi:10.1016/j.geomorph.2020.107194.</li> <li>Bianchi Fasani G., Di Luzio E., Esposito C., Evans S.G., Scarascia-Mugnozza G. (2014). Quaternary, catastrophic rock avalanches in the Central Apennines (Italy): relationships with inherited tectonic features, gravity-driven deformations and the geodynamic frame. Geomorphology, 21, 22–42. doi:10.1016/j.geomorph.2013.12.027.</li> <li>Di Luzio E., Bianchi-Fasani G., Saroli M., Esposito C., Cavinato G.P., Scarascia-Mugnozza G. (2004). Massive rock slope failure in the central Apennines (Italy): the case of the Campo di Giove rock avalanche. Bullettin of Engineering Geology and the Environment 63, 1-12. doi:10.1007/s10064-003-0212-7.</li> <li>Schilirò L., Esposito C., De Blasio F.V., Scarascia-Mugnozza G. (2019). <strong>Sediment texture in rock avalanche deposits: insights from field and experimental observations. </strong>Landslides, 16, 1629-1643. doi: 10.1007/s10346-019-01210-x.</li> <li>Tortorici G., Romagnoli G., Grassi S. et al. (2019). Quaternary negative tectonic inversion along the Sibillini Mts. thrust zone: the Arquata del Tronto case history (Central Italy). Environ Earth Sci 78:<strong> </strong>37. doi:10.1007/s12665-018-8021-2.</li> </ul>


Author(s):  
Jin Young Kim ◽  
R. E. Hummel ◽  
R. T. DeHoff

Gold thin film metallizations in microelectronic circuits have a distinct advantage over those consisting of aluminum because they are less susceptible to electromigration. When electromigration is no longer the principal failure mechanism, other failure mechanisms caused by d.c. stressing might become important. In gold thin-film metallizations, grain boundary grooving is the principal failure mechanism.Previous studies have shown that grain boundary grooving in gold films can be prevented by an indium underlay between the substrate and gold. The beneficial effect of the In/Au composite film is mainly due to roughening of the surface of the gold films, redistribution of indium on the gold films and formation of In2O3 on the free surface and along the grain boundaries of the gold films during air annealing.


Author(s):  
Robert C. Cieslinski ◽  
H. Craig Silvis ◽  
Daniel J. Murray

An understanding of the mechanical behavior polymers in the ductile-brittle transition region will result in materials with improved properties. A technique has been developed that allows the realtime observation of dynamic plane stress failure mechanisms in the transmission electron microscope. With the addition of a cryo-tensile stage, this technique has been extented to -173°C, allowing the observation of deformation during the ductile-brittle transition.The technique makes use of an annealed copper cartridge in which a thin section of bulk polymer specimen is bonded and plastically deformed in tension in the TEM using a screw-driven tensile stage. In contrast to previous deformation studies on solvent-cast films, this technique can examine the frozen-in morphology of a molded part.The deformation behavior of polypropylene and polypropylene impact modified with EPDM (ethylene-propylene diene modified) and PE (polyethylene) rubbers were investigated as function of temperature and the molecular weight of the impact modifier.


Author(s):  
Ng Sea Chooi ◽  
Chor Theam Hock ◽  
Ma Choo Thye ◽  
Khoo Poh Tshin ◽  
Dan Bockelman

Abstract Trends in the packaging of semiconductors are towards miniaturization and high functionality. The package-on-package(PoP) with increasing demands is beneficial in cost and space saving. The main failure mechanisms associated with PoP technology, including open joints and warpage, have created a lot of challenges for Assembly and Failure Analysis (FA). This paper outlines the sample preparation process steps to overcome the challenges to enable successful failure analysis and optical probing.


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