Design and Manufacture of a New Telephone Transmitter/Receiver Capsule

1985 ◽  
Vol 199 (3) ◽  
pp. 189-196
Author(s):  
V P Baker ◽  
W Chambers ◽  
F Taylor ◽  
N W Tester
Keyword(s):  
Production Line ◽  
Assembly Line ◽  
High Volume ◽  
Automated Assembly ◽  
Design Decisions ◽  
High Volume Production ◽  
Volume Production ◽  
Design And Manufacture

This paper describes a project to design a new telephone transmitter/receiver capsule which could be assembled on an automatic high volume production line. The reasons why the project was undertaken are outlined together with design decisions that were taken, and the automated assembly line is described in detail. The resulting achievements and the benefits to the company are reviewed.

Innovative Strategic Planning for the Design of a High Volume Production Line using Quality Function Deployment and a Batch

2013 ◽  
Vol 4 (1) ◽  
pp. 53-68
Author(s):  
Roberto Yumbla ◽  
Stuart Lumley ◽  
M. Khurshid Khan
Keyword(s):  
Production Line ◽  
Quality Function Deployment ◽  
High Volume ◽  
Quality Function ◽  
Manufacturing Line ◽  
Proactive Management ◽  
High Volume Production ◽  
Volume Production ◽  
Planning Methodology ◽  
Line Design

This paper proposes an innovative factory planning methodology to achieve the objectives that were defined by Flexitallic for the future expansion of the Thermiculite production line. The concepts under investigation extend to the analysis of flow benefits and restrictions considering product features and demands addressed in a proposed Batch/Flow Comparative Matrix. Furthermore, this paper introduces the Quality Function Deployment (QFD) concept to support the manufacturing line design using a mechanism of incorporating commercial awareness in all stages of the product deployment. The original QFD ensures process planning by bringing parts deployment into parts characteristics through the House of Quality. This study renews the original QFD by developing the Strategic Alignment of Quality Function Deployment (SAQFD) to achieve proactive management of Houses III and House IV. The case study demonstrates the utilization and applicability of the proposed methodologies, and demonstrates their importance during the design of a high volume production line.

Flexible Hand-Free Microelectronics assembly Line for the Chip and Wire industry

2015 ◽  
Vol 2015 (DPC) ◽  
pp. 000790-000826
Author(s):  
Prakash Bhartia ◽  
Jim Angeloni ◽  
Will Bolinger
Keyword(s):  
Integrated Circuits ◽  
Assembly Line ◽  
High Volume ◽  
Microwave Integrated Circuits ◽  
Fully Integrated ◽  
Die Attach ◽  
High Volume Production ◽  
Volume Production ◽  
Overseas Operations ◽  
Automated Lines

This paper presents Natel's effort in pioneering the design and development of the first Touch-Free Microelectronics assembly Line for the Chip and Wire industry. When the Surface Mount Technology (SMT) industry first started, it began as a series of discrete pieces of equipment that performed the functions required to populate Circuit Cards. Over the years, the technology has evolved as has the industry such that fully integrated, automated lines are available where the circuit cards are installed at one end of the line, reels or tubes of components, such as packaged resistors, inductors, capacitors and semiconductors etc., loaded, the machine programmed and assembled circuit cards are available at the other end. However, no such line has been developed for the Chip and Wire industry, with most assembly houses still using individual stand alone die attach, bonders, plasma clean machines to populate substrates. Natel has developed the first of its kind integrated Auto line for the Chip and Wire industry, which conceptually replicates a SMT line. This Auto Line is touch–free and incorporates die attach ( including eutectic), ball and ribbon bonding , plasma clean and in line testing. The line is ideal for high volume production of Hybrid and Microwave Integrated Circuits. The obvious advantages of this approach are the “ hands-free” continuous flow aspect with significant reduction in product defects, increase in efficiency and cost reduction thereby increasing competitiveness against low labor rate overseas operations. This paper will provide details of the line, and discuss what additional capabilities can be added and hopefully promote the future development of the Chip and Wire industry built on this pioneering development.

Towards a Manufacturing Technology for High-Volume Production of Composite Components

1992 ◽  
Vol 206 (2) ◽  
pp. 77-91 ◽  
Author(s):  
C D Rudd ◽  
K N Kendall
Keyword(s):  
Cost Effective ◽  
High Volume ◽  
Process Technology ◽  
Reinforced Composite ◽  
High Volume Production ◽  
Volume Production ◽  
The University ◽  
Design And Manufacture ◽  
Transfer Moulding ◽  
The Relationship

The last decade has seen strong interest from high-volume manufacturers such as the automotive industry in the development of processes which provide cost effective routes to the manufacture of components in fibre-reinforced composite materials. This paper considers one family of processes that have been targeted as offering a solution—that of resin transfer moulding (RTM)—and reviews the findings of work based at the University of Nottingham. The mechanisms involved are examined together with the variants on the basic process and the implications for high-volume production. Consideration is given to process technology, materials and the relationship between design and manufacture. A route to high-volume manufacture based upon computer aided engineering is proposed.

scholarly journals Congener-specific partition properties of chlorinated paraffins evaluated with COSMOtherm and gas chromatographic retention indices

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Jort Hammer ◽  
Hidenori Matsukami ◽  
Satoshi Endo
Keyword(s):  
Chemical Properties ◽  
High Volume ◽  
Retention Indices ◽  
Chromatographic Retention ◽  
Linear Free Energy Relationship ◽  
Linear Free Energy ◽  
Chlorinated Paraffins ◽  
Gas Chromatographic Retention Indices ◽  
High Volume Production ◽  
Volume Production

AbstractChlorinated Paraffins (CPs) are high volume production chemicals and have been found in various organisms including humans and in environmental samples from remote regions. It is thus of great importance to understand the physical–chemical properties of CPs. In this study, gas chromatographic (GC) retention indexes (RIs) of 25 CP congeners were measured on various polar and nonpolar columns to investigate the relationships between the molecular structure and the partition properties. Retention measurements show that analytical standards of individual CPs often contain several stereoisomers. RI values show that chlorination pattern have a large influence on the polarity of CPs. Single Cl substitutions (–CHCl–, –CH2Cl) generally increase polarity of CPs. However, many consecutive –CHCl– units (e.g., 1,2,3,4,5,6-C11Cl6) increase polarity less than expected from the total number of –CHCl– units. Polyparameter linear free energy relationship descriptors show that polarity difference between CP congeners can be explained by the H-bond donating properties of CPs. RI values of CP congeners were predicted using the quantum chemically based prediction tool COSMOthermX. Predicted RI values correlate well with the experimental data (R2, 0.975–0.995), indicating that COSMOthermX can be used to accurately predict the retention of CP congeners on GC columns.

High Volume Production Growth of GaAs on Silicon Substrates

1986 ◽  
Vol 67 ◽  
Author(s):  
Chris R. Ito ◽  
M. Feng ◽  
V. K. Eu ◽  
H. B. Kim
Keyword(s):  
Schottky Diodes ◽  
High Volume ◽  
Wafer Surface ◽  
Silicon Substrates ◽  
Growth Technique ◽  
Wafer Thickness ◽  
Production Growth ◽  
High Volume Production ◽  
Volume Production ◽  
P Type

ABSTRACTA high-volume epitaxial reactor has been used to investigate the feasibility for the production growth of GaAs on silicon substrates. The reactor is a customized system which has a maximum capacity of 39 three-inch diameter wafers and can accommodate substrates as large as eight inches in diameter. The MOCVD material growth technique was used to grow GaAs directly on p-type, (100) silicon substrates, three and five inches in diameter. The GaAs surfaces were textured with antiphase boundaries. Double-cyrstal rocking curve measurements showed single-cyrstal GaAs with an average FWHMof 520 arc seconds measured at four points over the wafer surface. Within-wafer thickness uniformity was ± 4% with a wafer-to-wafer uniformity of ± 2%. Photoluminescence spectra showed Tour peaks at 1.500, 1.483, 1.464, and 1.440 ev. Schottky diodes were fabricated on the GaAs on silicon material.

Determination of transverse flexural and shear moduli of chopped carbon fiber tape-reinforced thermoplastic by vibration

2017 ◽  
Vol 52 (3) ◽  
pp. 395-404
Author(s):  
Xiuqi Lyu ◽  
Jun Takahashi ◽  
Yi Wan ◽  
Isamu Ohsawa
Keyword(s):  
Carbon Fiber ◽  
Beam Theory ◽  
Transversely Isotropic ◽  
High Volume ◽  
Bending Test ◽  
Thermoplastic Material ◽  
Shear Moduli ◽  
High Volume Production ◽  
Volume Production

Chopped carbon fiber tape-reinforced thermoplastic material is specifically developed for the high-volume production of lightweight automobiles. With excellent design processability and flexibility, the carbon fiber tape-reinforced thermoplastic material is manufactured by compressing large amounts of randomly oriented, pre-impregnated unidirectional tapes in a plane. Therefore, the carbon fiber tape-reinforced thermoplastic material presents transversely isotropic properties. Transverse shear effect along the thickness direction of carbon fiber tape-reinforced thermoplastic beam has a distinct influence on its flexural deformation. Accordingly, the Timoshenko beam theory combined with vibration frequencies was proposed to determine the set of transverse flexural and shear moduli. Meanwhile, the transverse flexural and shear moduli of carbon fiber tape-reinforced thermoplastic beam were finally determined by fitting all the first seven measured and calculated eigenfrequencies with the least squares criterion. In addition, the suggested thickness to length ratio for the 3-point bending test and Euler–Bernoulli model was given.

Sign in / Sign up

Export Citation Format

Share Document