OS1(3)-11(OS01W0277) A Novel Approach for Full-Field Measurement of Principal Stress Directions in Photoelasticity

Terry Yuan Fang Chen; You Cheng Chou

doi:10.1299/jsmeatem.2003.141

OS1(3)-11(OS01W0277) A Novel Approach for Full-Field Measurement of Principal Stress Directions in Photoelasticity

The Abstracts of ATEM International Conference on Advanced Technology in Experimental Mechanics Asian Conference on Experimental Mechanics ◽

10.1299/jsmeatem.2003.141 ◽

2003 ◽

Vol 2003 (0) ◽

pp. 141

Author(s):

Terry Yuan Fang Chen ◽

You Cheng Chou

Keyword(s):

Principal Stress ◽

Field Measurement ◽

Full Field ◽

Novel Approach ◽

Full Field Measurement ◽

Stress Directions

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OS01W0277 A novel approach for full-field measurement of principal stress directions in photoelasticity

The Abstracts of ATEM International Conference on Advanced Technology in Experimental Mechanics Asian Conference on Experimental Mechanics ◽

10.1299/jsmeatem.2003.2._os01w0277 ◽

2003 ◽

Vol 2003.2 (0) ◽

pp. _OS01W0277-_OS01W0277

Author(s):

Terry Yuan-Fang Chen ◽

You-Cheng Chou

Keyword(s):

Principal Stress ◽

Field Measurement ◽

Full Field ◽

Novel Approach ◽

Full Field Measurement ◽

Stress Directions

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LCoS spatial light modulators as active phase elements of full-field measurement systems and sensors

Metrology and Measurement Systems ◽

10.2478/v10178-012-0038-3 ◽

2012 ◽

Vol 19 (3) ◽

Cited By ~ 8

Author(s):

Małgorzata Kujawińska ◽

Rosario Porras-Aguilar ◽

Weronika Zaperty Warsaw

Keyword(s):

Field Measurement ◽

Active Phase ◽

Spatial Light Modulators ◽

Full Field ◽

Measurement Systems ◽

Light Modulators ◽

Full Field Measurement

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SHEAROGRAPHY: A Full-Field Measurement Technique and Application in Non-Destructive Testing

10.4271/2005-01-0485 ◽

2005 ◽

Author(s):

Michael Y. Y. Hung

Keyword(s):

Measurement Technique ◽

Field Measurement ◽

Non Destructive Testing ◽

Destructive Testing ◽

Full Field ◽

Full Field Measurement ◽

Non Destructive

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Full-Field Measurement of Deformation of Recycled Paper Using Electronic Speckle Pattern Interferometry

Key Engineering Materials ◽

10.4028/www.scientific.net/kem.270-273.686 ◽

2004 ◽

Vol 270-273 ◽

pp. 686-689 ◽

Cited By ~ 1

Author(s):

Eisaku Umezaki ◽

Jyunnosuke Takakuwa

Keyword(s):

Field Measurement ◽

Speckle Pattern ◽

Electronic Speckle Pattern Interferometry ◽

Recycled Paper ◽

Full Field ◽

Full Field Measurement

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Importance of Full-Field Measurement Techniques for Better Models in Solid Mechanics

Experimental Analysis of Nano and Engineering Materials and Structures ◽

10.1007/978-1-4020-6239-1_6 ◽

2007 ◽

pp. 13-14

Author(s):

Michel Grediac

Keyword(s):

Field Measurement ◽

Solid Mechanics ◽

Measurement Techniques ◽

Full Field ◽

Full Field Measurement

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Research on full-field measurement of optical film thickness by processing double interferometric fringes based on digital wavefront interferometry

10.1117/12.839934 ◽

2009 ◽

Author(s):

Long-jiang Chen ◽

Yi-yong Liang ◽

Jian-bo Luo ◽

Chun-hui Zhang ◽

Guo-guang Yang

Keyword(s):

Film Thickness ◽

Field Measurement ◽

Full Field ◽

Optical Film ◽

Full Field Measurement

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Full-field measurement with nanometric accuracy of 3D superficial displacements by digital profile correlation: A powerful tool for mechanics of materials

Materials & Design ◽

10.1016/j.matdes.2018.08.052 ◽

2018 ◽

Vol 159 ◽

pp. 170-185 ◽

Cited By ~ 2

Author(s):

Luigi Bruno

Keyword(s):

Field Measurement ◽

Full Field ◽

Mechanics Of Materials ◽

Full Field Measurement

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Full-field measurement of micro strain of printed circuit board assembly using digital image correlation

Infrared and Laser Engineering ◽

10.3788/irla201746.1103004 ◽

2017 ◽

Vol 46 (11) ◽

pp. 1103004

Author(s):

杨靖 Yang Jing ◽

吴思进 Wu Sijin ◽

郑伟巍 Zheng Weiwei ◽

李伟仙 Li Weixian ◽

杨连祥 Yang Lianxiang

Keyword(s):

Digital Image Correlation ◽

Field Measurement ◽

Printed Circuit Board ◽

Image Correlation ◽

Circuit Board ◽

Printed Circuit Board Assembly ◽

Full Field ◽

Printed Circuit ◽

Full Field Measurement ◽

Circuit Board Assembly

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Full-Field Measurement of Residual Stresses in Composite Materials Using the Incremental Slitting and Digital Image Correlation Techniques

Experimental Mechanics ◽

10.1007/s11340-020-00640-2 ◽

2020 ◽

Vol 60 (9) ◽

pp. 1239-1250

Author(s):

S. D. Salehi ◽

M. A. Rastak ◽

M. M. Shokrieh ◽

L. Barrallier ◽

R. Kubler

Keyword(s):

Composite Materials ◽

Digital Image Correlation ◽

Residual Stresses ◽

Digital Image ◽

Field Measurement ◽

Image Correlation ◽

Full Field ◽

Full Field Measurement ◽

Correlation Techniques

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Mechanical properties of solution heat treated Al-Zn-Mg-Cu (7075) alloy under different cooling conditions: Analysis with full field measurement and finite element modeling

Journal of Alloys and Compounds ◽

10.1016/j.jallcom.2020.158180 ◽

2021 ◽

Vol 856 ◽

pp. 158180

Author(s):

Chanmi Moon ◽

Sandrine Thuillier ◽

Jinwoo Lee ◽

Myoung-Gyu Lee

Keyword(s):

Mechanical Properties ◽

Finite Element ◽

Finite Element Modeling ◽

Field Measurement ◽

Full Field ◽

Element Modeling ◽

Cooling Conditions ◽

Full Field Measurement ◽

Heat Treated ◽

7075 Alloy

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