Monitoring for Ultra-Precision Turning of Single Crystal Silicon using Diamond Tool with Large Nose Radius and Small Chamfer at Cutting Edge

According to the size effect theory established on the concept of geometrically necessary dislocations and results of nano-indentation experiments, a novel brittle-ductile mechanism of ultra-precision turning of single crystal silicon is proposed. The accurate critical chip thickness is firstly calculated on the basis of theoritical analysis. A macro-micro cutting model is created based on the brittle-ductile transition mechanism. Finally, the results of study are testified through experiments.

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Nanoindentation Characterization of Single-Crystal Silicon With Oxide Film

10.21203/rs.3.rs-512020/v1 ◽

2021 ◽

Author(s):

Lianmin Yin ◽

Yifan Dai ◽

Hao Hu

Keyword(s):

Mechanical Properties ◽

Plastic Deformation ◽

Oxide Film ◽

Single Crystal ◽

Deformation Zone ◽

Single Crystal Silicon ◽

Plastic Deformation Zone ◽

Crystal Silicon ◽

Ultra Precision

Abstract In order to obtain ultra-smooth surfaces of single-crystal silicon in ultra-precision machining, an accurate study of the deformation mechanism, mechanical properties, and the effect of oxide film under load is required. The mechanical properties of single-crystal silicon and the phase transition after nanoindentation experiments are investigated by nanoindentation and Raman spectroscopy, respectively. It is found that pop-in events appear in the theoretical elastic domain of single-crystal silicon due to the presence of oxide films, which directly leads the single crystal silicon from the elastic deformation zone into the plastic deformation zone. In addition, the mechanical properties of single-crystal silicon are more accurately measured after it has entered the full plastic deformation.

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Graphitization Wear of Diamond Tool in Nanometric Cutting of Single Crystal Silicon

Key Engineering Materials ◽

10.4028/www.scientific.net/kem.609-610.751 ◽

2014 ◽

Vol 609-610 ◽

pp. 751-757 ◽

Cited By ~ 1

Author(s):

Jia Chun Wang ◽

Ming Ming Xin ◽

Si Yu Cao ◽

Teng Zhao

Keyword(s):

Diamond Tool ◽

Single Crystal Silicon ◽

Dynamics Modeling ◽

Machined Surface ◽

Crystal Silicon ◽

Nanometric Cutting ◽

Coordination Numbers ◽

Molecular Dynamics Modeling ◽

Ultra Precision

During ultra-precision cutting of brittle materials, the wear of diamond tool seriously affects the quality of machined surface. By molecular dynamics modeling of nanometric cutting, the generation of graphitization and its formation process at the cutting edge of tool are observed. By analyzing the process, the reason of the graphitization wear is mainly thermo-chemical reactions. By calculating the changes of coordination numbers of the tool atoms, graphitization conversion rate keeps increasing along the cutting process but gets stable after a certain length, which indicates the graphitization wear will occur in the same process.

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Surface finish in ultra-precision diamond turning of single-crystal silicon

10.1117/12.2194433 ◽

2015 ◽

Cited By ~ 5

Author(s):

M. Ayomoh ◽

K. Abou-El-Hossein

Keyword(s):

Single Crystal ◽

Surface Finish ◽

Single Crystal Silicon ◽

Diamond Turning ◽

Crystal Silicon ◽

Ultra Precision

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EFFECTS OF DIAMOND CUTTING TOOL'S RAKE ANGLE AND ROUNDED CUTTING EDGE RADIUS ON THE MACHINED SINGLE CRYSTAL SILICON SURFACE QUALITY

Journal of Mechanical Engineering ◽

10.3901/jme.2002.12.054 ◽

2002 ◽

Vol 38 (12) ◽

pp. 54 ◽

Cited By ~ 4

Author(s):

Qingliang Zhao

Keyword(s):

Single Crystal ◽

Surface Quality ◽

Silicon Surface ◽

Single Crystal Silicon ◽

Rake Angle ◽

Cutting Edge ◽

Diamond Cutting ◽

Crystal Silicon ◽

Cutting Edge Radius ◽

Edge Radius

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Potential Analysis in Nanoturning of Single Crystal Silicon Using Molecular Dynamics

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.239-242.3236 ◽

2011 ◽

Vol 239-242 ◽

pp. 3236-3239 ◽

Cited By ~ 2

Author(s):

Ying Chun Liang ◽

Zhi Guo Wang ◽

Ming Jun Chen ◽

Jia Xuan Chen ◽

Zhen Tong

Keyword(s):

Molecular Dynamics ◽

Single Crystal ◽

Diamond Tool ◽

Single Crystal Silicon ◽

Crystal Silicon ◽

Potential Analysis ◽

Ductile Mode ◽

Tool Surface ◽

Dynamics Simulations ◽

Nanoscale Cutting

Molecular dynamics simulations of the single crystal silicon nanoscale cutting with a diamond tool in ductile mode are carried out to investigate the adhesion phenomenon. After relaxation the silicon atoms on the surface reconstruct to make the potential decrease. The silicon atoms close to the diamond tool have the lowest potential (<-5.5 eV) and form a stable structure with surface atoms on the tool surface.

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