Heat dissipation performance of a high-brightness LED package assembly using high-thermal conductivity filler

2013 ◽  
Vol 52 (35) ◽  
pp. 8484 ◽  
Author(s):  
K. C. Yung ◽  
H. Liem ◽  
H. S. Choy
Keyword(s):  
Thermal Conductivity ◽  
Heat Dissipation ◽  
High Thermal Conductivity ◽  
High Brightness

scholarly journals Development of Thermally Conductive Polyurethane Composite by Low Filler Loading of Spherical BN/PMMA Composite Powder

2019 ◽  
Vol 9 (1) ◽  
Author(s):  
Kai-Han Su ◽  
Cherng-Yuh Su ◽  
Cheng-Ta Cho ◽  
Chung-Hsuan Lin ◽  
Guan-Fu Jhou ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Heat Dissipation ◽  
Three Dimensional ◽  
Filler Loading ◽  
High Thermal Conductivity ◽  
Heat Diffusion ◽  
Composite Powders ◽  
Polyurethane Composite ◽  
Uniform Dispersion ◽  
Thermally Conductive

Abstract The issue of electronic heat dissipation has received much attention in recent times and has become one of the key factors in electronic components such as circuit boards. Therefore, designing of materials with good thermal conductivity is vital. In this work, a thermally conductive SBP/PU composite was prepared wherein the spherical h-BN@PMMA (SBP) composite powders were dispersed in the polyurethane (PU) matrix. The thermal conductivity of SBP was found to be significantly higher than that of the pure h-BN/PU composite at the same h-BN filler loading. The SBP/PU composite can reach a high thermal conductivity of 7.3 Wm−1 K−1 which is twice as high as that of pure h-BN/PU composite without surface treatment in the same condition. This enhancement in the property can be attributed to the uniform dispersion of SBP in the PU polymer matrix that leads to a three-dimensional continuous heat conduction thereby improving the heat diffusion of the entire composite. Hence, we provide a valuable method for preparing a 3-dimensional heat flow path in polyurethane composite, leading to a high thermal conductivity with a small amount of filler.

scholarly journals High thermal conductivity in soft elastomers with elongated liquid metal inclusions

2017 ◽  
Vol 114 (9) ◽  
pp. 2143-2148 ◽  
Author(s):  
Michael D. Bartlett ◽  
Navid Kazem ◽  
Matthew J. Powell-Palm ◽  
Xiaonan Huang ◽  
Wenhuan Sun ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Liquid Metal ◽  
Heat Dissipation ◽  
Dielectric Materials ◽  
Phonon Transport ◽  
High Thermal Conductivity ◽  
Stretchable Electronics ◽  
Mechanical Stiffness ◽  
Mechanical Coupling ◽  
Thermally Conductive

Soft dielectric materials typically exhibit poor heat transfer properties due to the dynamics of phonon transport, which constrain thermal conductivity (k) to decrease monotonically with decreasing elastic modulus (E). This thermal−mechanical trade-off is limiting for wearable computing, soft robotics, and other emerging applications that require materials with both high thermal conductivity and low mechanical stiffness. Here, we overcome this constraint with an electrically insulating composite that exhibits an unprecedented combination of metal-like thermal conductivity, an elastic compliance similar to soft biological tissue (Young’s modulus < 100 kPa), and the capability to undergo extreme deformations (>600% strain). By incorporating liquid metal (LM) microdroplets into a soft elastomer, we achieve a ∼25× increase in thermal conductivity (4.7 ± 0.2 W⋅m−1⋅K−1) over the base polymer (0.20 ± 0.01 W⋅m−1·K−1) under stress-free conditions and a ∼50× increase (9.8 ± 0.8 W⋅m−1·K−1) when strained. This exceptional combination of thermal and mechanical properties is enabled by a unique thermal−mechanical coupling that exploits the deformability of the LM inclusions to create thermally conductive pathways in situ. Moreover, these materials offer possibilities for passive heat exchange in stretchable electronics and bioinspired robotics, which we demonstrate through the rapid heat dissipation of an elastomer-mounted extreme high-power LED lamp and a swimming soft robot.

Novel high-thermal-conductivity composite ceramic phosphors for high-brightness laser-driven lighting

2021 ◽  
Author(s):  
Huanyu Zhao ◽  
Huaqian Yu ◽  
Jian Xu ◽  
Mu Zhang ◽  
Xiaodong Li ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Laser Irradiation ◽  
High Power ◽  
Heat Dissipation ◽  
Laser Diodes ◽  
Composite Ceramic ◽  
High Power Laser ◽  
Power Laser ◽  
Widespread Application ◽  
High Brightness

The widespread application of laser diodes (LDs) in high-brightness lighting is limited by the insufficient heat dissipation of colour converters due to high-power laser irradiation. In this study, a novel...

High thermal conductivity liquid metal pad for heat dissipation in electronic devices

2018 ◽  
Vol 124 (5) ◽  
Author(s):  
Zuoye Lin ◽  
Huiqiang Liu ◽  
Qiuguo Li ◽  
Han Liu ◽  
Sheng Chu ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Liquid Metal ◽  
Heat Dissipation ◽  
Electronic Devices ◽  
High Thermal Conductivity

High Current Injection to a UV-LED grown on a Bulk AlN Substrate

2003 ◽  
Vol 798 ◽  
Author(s):  
Toshio Nishida ◽  
Tomoyuki Ban ◽  
Hisao Saito ◽  
Toshiki Makimoto
Keyword(s):  
Thermal Conductivity ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Peak Shift ◽  
Emission Peak ◽  
Injection Current ◽  
High Thermal Conductivity ◽  
Uv Led ◽  
High Injection ◽  
Large Injection

ABSTRACTWe applied a bulk AlN substrate to an AlGaN-based ultraviolet light emitting diode (UV-LED) and found that this combination enables high injection current, which shows the LED's potential for large ultraviolet flux extraction. Heat dissipation is an important issue for LEDs. Bulk AlN substrate has high thermal conductivity, a wurtzite crystal symmetry the same as that of nitride emitters, and transparency in the ultraviolet wavelength range. An UV-LED grown on a bulk AlN substrate shows output power linearity up to high injection current up to 300 mA, whereas a similar device grown on an AlN-template formed on a sapphire substrate only shows linearity up to an injection current of about 150 mA. It also showed very stable emission peak wavelength. For example, the emission peak shift is less than 2 nm in spite of the large injection current of 200 mA. Both findings are attributed to the heat dissipation afforded by the high thermal conductivity of the bulk AlN. This LED still suffers from internal absorption loss caused by the residual color centers in the AlN at present. However, further improvement of bulk AlN substrates will lead to high flux and highly efficient ultraviolet sources.

scholarly journals Enhancement of thermal conductivity in polyamide-6/graphene composites via a “bridge effect” of silicon carbide whiskers

RSC Advances ◽  
2017 ◽  
Vol 7 (73) ◽  
pp. 46306-46312 ◽  
Author(s):  
Na Song ◽  
Haidong Pan ◽  
Xingshuang Hou ◽  
Siqi Cui ◽  
Liyi Shi ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Silicon Carbide ◽  
Polymer Composite ◽  
Heat Dissipation ◽  
Electronic Devices ◽  
Polyamide 6 ◽  
High Thermal Conductivity ◽  
Silicon Carbide Whiskers ◽  
Plane Direction

It is urgent to manufacture a polymer composite that has high thermal conductivity (especially in the through-plane direction) and mechanical properties simultaneously to meet the heat dissipation requirement of electronic devices.

Ultrahigh thermal conductivity of tetrahedral carbon allotropes with non-simple structure

2021 ◽  
Author(s):  
Qiang Chen ◽  
Pei Zhang ◽  
Tao Ouyang ◽  
Xiaoliang Zhang ◽  
Qin Guangzhao
Keyword(s):  
Thermal Conductivity ◽  
Heat Dissipation ◽  
Simple Structure ◽  
High Thermal Conductivity ◽  
Carbon Allotropes

Pursuing high thermal conductivity is of great significance to the enhanced performance and working stability of microelectronics in terms of efficient heat dissipation. Traditionally, the ultrahigh thermal conductivity is thought...

The Effects of Material Properties on Heat Dissipation in High Power Electronics

1998 ◽  
Vol 120 (3) ◽  
pp. 280-289 ◽  
Author(s):  
T. J. Lu ◽  
A. G. Evans ◽  
J. W. Hutchinson
Keyword(s):  
Thermal Conductivity ◽  
Power Electronics ◽  
High Power ◽  
Heat Dissipation ◽  
Substrate Material ◽  
High Thermal Conductivity ◽  
Analytical Models ◽  
Wide Range ◽  
Power Densities

The role of the substrate in determining heat dissipation in high power electronics is calculated, subject to convective cooling in the small Biot number regime. Analytical models that exploit the large aspect ratio of the substrate to justify approximations are shown to predict the behavior with good accuracy over a wide range of configurations. The solutions distinguish heat spreading effects’ that enable high chip-level power densities from insulation effects that arise at large chip densities. In the former, the attributes of high thermal conductivity are apparent, especially when the substrate dimensions are optimized. Additional benefits that derive from a thin layer of a high thermal conductivity material (such as diamond) are demonstrated. In the insulating region, which arises at high overall power densities, the substrate thermal conductivity has essentially no effect on the heat dissipation. Similarly, for compact multichip module designs, with chips placed on both sides of the substrate, heat dissipation is insensitive to the choice of the substrate material, unless advanced cooling mechanisms are used to remove heat around the module perimeter.

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