Evaluation of the Impact Shear Strength of Thermal Aged Lead-Free Solder Ball Joints

An electroless Ni/Pd/Au plated electrode is expected to be used as an electrode material for lead-free solder to improve joint reliability. The aim of this study is to investigate the effect of the thickness of the Pd layer on joint properties of the lead-free solder joint with the electroless Ni/Pd/Au plated electrode. Solder ball joints were fabricated with Sn-3Ag-0.5Cu (mass%) lead-free solder balls and electroless Ni/Pd/Au and Ni/Au plated electrodes. Ball shear force and microstructure of the joint were investigated. The (Cu,Ni)6Sn5 reaction layer formed in the joint interface in all specimens. The thickness of the reaction layer decreased with increasing the thickness of the Pd layer. In the joint with a Pd layer 0.36 μm thick, the remained Pd layer was observed in the joint interface. In the joint, impact shear force decreased compared with that of the joint without the remained Pd layer. On the contrary, when the thickness of the Pd layer was less than 0.36 μm, the Pd layer was not remained in the joint interface and impact shear force improved. Impact shear force of the joint with the electroless Ni/Pd/Au plated electrode was higher than that with the electroless Ni/Au one.

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The impact of thermal cycling regime on the shear strength of lead‐free solder joints

Soldering & Surface Mount Technology ◽

10.1108/09540910510597474 ◽

2005 ◽

Vol 17 (2) ◽

pp. 22-31 ◽

Cited By ~ 15

Author(s):

Milos Dusek ◽

Martin Wickham ◽

Christopher Hunt

Keyword(s):

Shear Strength ◽

Thermal Cycling ◽

Solder Joints ◽

Lead Free ◽

Lead Free Solder ◽

Free Solder ◽

The Impact

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Shear strengths of CBGA/PBGA solder ball joints with lead-free solder pastes

International Journal of Materials and Structural Integrity ◽

10.1504/ijmsi.2014.064774 ◽

2014 ◽

Vol 8 (1/2/3) ◽

pp. 62 ◽

Cited By ~ 1

Author(s):

Sung Yi

Keyword(s):

Solder Ball ◽

Lead Free ◽

Lead Free Solder ◽

Solder Pastes ◽

Free Solder ◽

Ball Joints

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Comparison of Impact Properties of Sn-9Zn and Sn-3Ag-0.5Cu Lead-Free Solder Ball Joints

Key Engineering Materials ◽

10.4028/www.scientific.net/kem.385-387.429 ◽

2008 ◽

Vol 385-387 ◽

pp. 429-432 ◽

Cited By ~ 1

Author(s):

Ikuo Shohji ◽

Satoshi Shimoyama ◽

Hisao Ishikawa ◽

Masao Kojima

Keyword(s):

Solder Ball ◽

Impact Force ◽

Lead Free ◽

Joint Interface ◽

Impact Properties ◽

Joint Fracture ◽

Free Solder ◽

Ball Joints ◽

Electroless Ni ◽

The Impact

Impact properties of solder ball joints with Sn-9mass%Zn and Sn-3mass%Ag- 0.5mass%Cu lead-free solders were investigated under aging at 423 K. In the case of the joints with Cu electrodes, both Sn-9Zn and Sn-3Ag-0.5Cu joints have similar impact forces before aging. For the Sn-3Ag-0.5Cu joint, fracture occurred in an intermetallic compound (IMC) layer formed in a joint interface regardless of aging, and thus the impact force was stable upon aging at 423 K for 500 h. For the Sn-9Zn joint, fracture mode changed from solder fracture to other fracture upon aging and thus this change led a decrease in the impact force. In the Sn-9Zn joint with an electroless Ni/Au plated electrode, fracture occurred in the solder regardless of aging, and thus impact properties improved compared with the joint using the Cu electrode. The impact properties are superior to those of the Sn-3Ag-0.5Cu joints with the Cu and the electroless Ni/Au electrodes.

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The micro-impact fracture behavior of lead-free solder ball joints

Journal of Materials Research ◽

10.1557/jmr.2008.0129 ◽

2008 ◽

Vol 23 (4) ◽

pp. 1057-1063 ◽

Cited By ~ 6

Author(s):

Y.L. Huang ◽

K.L. Lin ◽

D.S. Liu

Keyword(s):

Solder Joint ◽

Fracture Energy ◽

Fracture Behavior ◽

Solder Ball ◽

Impact Fracture ◽

Lead Free ◽

Lead Free Solder ◽

Impact Fracture Behavior ◽

Free Solder ◽

Ball Joints

The present study investigated the micro-impact fracture behavior of various lead-free solder joints, including Sn–1Ag–0.1Cu–0.02Ni–0.05In, Sn–1.2Ag–0.5Cu–0.05Ni, and Sn–1Ag–0.5Cu. The fracture that occurs within the solder joint corresponds to a higher impact fracture energy (1.35 mJ), while the fracture at the interface between the solder joint and intermetallic compound acquires a smaller impact energy (0.82 mJ). Two types of fracture mechanisms were proposed based on observations of the fracture morphology and the impact curve for the solder ball joints. The longer deflection distance, referring to better elongation, exists for the mechanism corresponding to the higher fracture energy.

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Impact Properties of Sn-0.75Cu Lead-Free Solder Ball Joint

Key Engineering Materials ◽

10.4028/www.scientific.net/kem.385-387.745 ◽

2008 ◽

Vol 385-387 ◽

pp. 745-748 ◽

Cited By ~ 2

Author(s):

Ikuo Shohji ◽

Tsutomu Osawa ◽

Takeshi Okashita ◽

Hirohiko Watanabe

Keyword(s):

Fracture Mode ◽

Solder Ball ◽

Lead Free ◽

Lead Free Solder ◽

Ball Joint ◽

Ball Impact ◽

Impact Properties ◽

Main Fracture ◽

Free Solder ◽

The Impact

Impact properties of a solder ball joint with a Sn-0.75mass%Cu lead-free solder were investigated under aging conditions at 393 K. Moreover, obtained impact properties were compared with those of the joints with Sn-3.5mass%Ag and Sn-3.5mass%Ag-0.5mass%Cu solders. Ball impact force of a Sn-0.75Cu joint was stable at 4.5~5 N, which is similar to that of a Sn-3.5Ag-0.5Cu joint without aging, upon aging at 393 K for 1000 h. In the Sn-0.75Cu joint without aging, main fracture mode was complex fracture of the solder and an intermetallic compound (IMC) formed in a joint interface. Main fracture mode changed from the complex mode to solder fracture upon aging, and thus the impact toughness improved.

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PENGARUH KANDUNGAN UNSUR Ag PADA PADUAN SOLDER BEBAS TIMBAL TERHADAP SIFAT MEKANIS DAN FISIS Sn-0.7Cu-“X”Ag

POROS ◽

10.24912/poros.v15i2.1274 ◽

2018 ◽

Vol 15 (2) ◽

pp. 123

Author(s):

Erwin Siahaan

Keyword(s):

Shear Strength ◽

Melting Point ◽

Specific Gravity ◽

Lead Free ◽

Lead Free Solder ◽

Micro Hardness ◽

Micro Structure ◽

Solder Sample ◽

Free Solder ◽

The Impact

Abstract: In this research was carried out of lead free solder sample of Sn-Cu-Ag to characterized how far the effect of Ag composition on Lead Free Solder of Sn0.7CuxAg to replace SnPb alloy. The research will be carried out such us specific gravity, melting point, micro structure, shear strength, and micro hardness value The impact was added Ag to Sn -Cu-Ag has shown that shear strength for each at 61% on material Sn-0.7Cu-1Ag,73% at material Sn-0.7Cu-1.5Ag and 94% on material Sn-Cu-2Ag. The results has shown that on Sn-0.7Cu-1Ag material getting melting point bellow Sn -Pb that is 1820C.

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