Shear strengths of CBGA/PBGA solder ball joints with lead-free solder pastes

2014 ◽  
Vol 8 (1/2/3) ◽  
pp. 62 ◽  
Author(s):  
Sung Yi
Keyword(s):  
Solder Ball ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Pastes ◽  
Free Solder ◽  
Ball Joints

Effect of Thickness of Pd Plating Layer on Shear Strength of Lead-Free Solder Ball Joint With Electroless Ni/Pd/Au Plated Electrode

2011 ◽  
Author(s):  
Takahiro Kano ◽  
Ikuo Shohji ◽  
Tetsuyuki Tsuchida ◽  
Toshikazu Ookubo
Keyword(s):  
Reaction Layer ◽  
Shear Force ◽  
Solder Ball ◽  
Lead Free ◽  
Joint Interface ◽  
Lead Free Solder ◽  
Solder Balls ◽  
Free Solder ◽  
Ball Joints ◽  
Electroless Ni

An electroless Ni/Pd/Au plated electrode is expected to be used as an electrode material for lead-free solder to improve joint reliability. The aim of this study is to investigate the effect of the thickness of the Pd layer on joint properties of the lead-free solder joint with the electroless Ni/Pd/Au plated electrode. Solder ball joints were fabricated with Sn-3Ag-0.5Cu (mass%) lead-free solder balls and electroless Ni/Pd/Au and Ni/Au plated electrodes. Ball shear force and microstructure of the joint were investigated. The (Cu,Ni)6Sn5 reaction layer formed in the joint interface in all specimens. The thickness of the reaction layer decreased with increasing the thickness of the Pd layer. In the joint with a Pd layer 0.36 μm thick, the remained Pd layer was observed in the joint interface. In the joint, impact shear force decreased compared with that of the joint without the remained Pd layer. On the contrary, when the thickness of the Pd layer was less than 0.36 μm, the Pd layer was not remained in the joint interface and impact shear force improved. Impact shear force of the joint with the electroless Ni/Pd/Au plated electrode was higher than that with the electroless Ni/Au one.

The micro-impact fracture behavior of lead-free solder ball joints

2008 ◽  
Vol 23 (4) ◽  
pp. 1057-1063 ◽  
Author(s):  
Y.L. Huang ◽  
K.L. Lin ◽  
D.S. Liu
Keyword(s):  
Solder Joint ◽  
Fracture Energy ◽  
Fracture Behavior ◽  
Solder Ball ◽  
Impact Fracture ◽  
Lead Free ◽  
Lead Free Solder ◽  
Impact Fracture Behavior ◽  
Free Solder ◽  
Ball Joints

The present study investigated the micro-impact fracture behavior of various lead-free solder joints, including Sn–1Ag–0.1Cu–0.02Ni–0.05In, Sn–1.2Ag–0.5Cu–0.05Ni, and Sn–1Ag–0.5Cu. The fracture that occurs within the solder joint corresponds to a higher impact fracture energy (1.35 mJ), while the fracture at the interface between the solder joint and intermetallic compound acquires a smaller impact energy (0.82 mJ). Two types of fracture mechanisms were proposed based on observations of the fracture morphology and the impact curve for the solder ball joints. The longer deflection distance, referring to better elongation, exists for the mechanism corresponding to the higher fracture energy.

Higher Copper Composition Shear Stress Analysis on Lead Free Solder Ball

2013 ◽  
Author(s):  
Vithyacharan Retnasamy ◽  
Zaliman Sauli ◽  
Phaklen Ehkan ◽  
Steven Taniselass
Keyword(s):  
Shear Stress ◽  
Stress Analysis ◽  
Solder Ball ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder
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