scholarly journals Probing Dynamic Mechanical Analysis and Atomic Force Microscopy of Polypropylene/Kaolin Nanocomposite

2018 ◽  
Vol 7 (4.30) ◽  
pp. 465
Author(s):  
Dagaci Muhammad Zago ◽  
Suzi Salwah Binti Jika ◽  
Nur Azam Bin Badarulzaman ◽  
Nurun Najwa Binti Ruslan ◽  
Awwal Hussain Nuhu ◽  
...  

The Dynamic mechanical analysis (DMA) and Atomic force microscopy (AFM) studies were conducted and evaluated on polypropylene/kaolin (P/K) nanocomposite treated with maleic anhydride (MA) and dicumyl peroxide (DCP) as additives in an in- situ process.  Two-roll mill was used in compounding of the nanocomposites while moulding were done by injection moulding machine. Investigation in to the effect of K and MA/DCP on the nanocomposites (NCs) indicates that interfacial interactions between PP and K as filler was eminent. DMA analysis reveals an increase in the storage modulus which was at maximum significantly in P/K NC with 3 wt% and decrease in damping factor tan δ also at P/K NC of 3 wt%. The AFM study indicates that there was uniform and smooth surface roughness among the NCs. Thus, addition of MA/DCP on to P/K NC improves the reinforcing influence on the nanocomposites for better improvement.

Soft Matter ◽  
2019 ◽  
Vol 15 (8) ◽  
pp. 1776-1784 ◽  
Author(s):  
Bryant L. Doss ◽  
Kiarash Rahmani Eliato ◽  
Keng-hui Lin ◽  
Robert Ros

Atomic force microscopy (AFM) is becoming an increasingly popular method for studying cell mechanics, however the existing analysis tools for determining the elastic modulus from indentation experiments are unable to quantitatively account for mechanical heterogeneity commonly found in biological samples.


2012 ◽  
Vol 18 (S2) ◽  
pp. 1622-1623
Author(s):  
S. Avasthy ◽  
Y. Ishikawa ◽  
G. Shekhawat ◽  
V.P. Dravid ◽  
G. Mustata ◽  
...  

Extended abstract of a paper presented at Microscopy and Microanalysis 2012 in Phoenix, Arizona, USA, July 29 – August 2, 2012.


e-Polymers ◽  
2004 ◽  
Vol 4 (1) ◽  
Author(s):  
Witold Brostow ◽  
Kevin P. Menard ◽  
John B. White

Abstract Dynamic mechanical analysis (DMA) techniques are commonly applied to characterize polymer-based materials - but little if at all to characterize semiconductor thermoelectric (TE) materials. TE materials may be coupled with polymeric materials in advanced thermoelectric devices, and the knowledge of TE material properties will be useful in the choice of materials for future applications. We have obtained DMA results for both n-type and p-type bismuth telluride based TE materials. We find that tan δ values, indicative of viscoelastic energy dissipation modes, approach the values for glassy or semi-crystalline polymers, and are larger by more than a whole order of magnitude than the tan δ of structural metals. DMA thermal scans show clear hysteresis-type effects and a correlation with differential scanning calorimetry thermal transitions. DMA properties as a function of frequency are briefly discussed. Our results show that DMA techniques are useful in the evaluation of thermophysical and thermomechanical properties of these TE materials and of assembled coolers. The viscoelastic effects we report may provide a damping mechanism for severe stresses inherent to service conditions of the TE coolers.


2020 ◽  
Vol 01 (01) ◽  
Author(s):  
A. Alzomor ◽  
◽  
A. Z. M. Rus ◽  
H. A. Wahab ◽  
N. S. M. Salim ◽  
...  

The most common sustainable polymer for polyurethane (PU) materials is the production of polyurethane (PU) materials using renewable resources, which will reduce thedependency on petroleum-based products for consumption.This research presents findings from an experimental research on dynamic mechanical and viscoelastic properties such as storage module (E'), loss module(E") and damping coefficient(tan δ)of synthetic epoxy (E) and bio-epoxy (B) polymer foam with different loading ratios of 0%, 5%, 10%, 15% and 20% flakes and powder filler.The samples were then exposed to 8000 hours of UV irradiation. The samples were subjected to dynamic mechanical analysis (DMA) over a temperature range of 25-180 ° C for (E) and (B) polymer foam at a frequency of 1 Hz.The results showed that the 20 %synthetic epoxy with flakes filler material, namely as E20L sample with the highest filler ratio, gives the maximum storage module and loss module values (0.3125 MPa and0.0625 MPa respectively), among other filler ratios due to bonding between foam and filler resulting in increased viscosity of the synthetic-epoxy PU foam. The bio-epoxy PU foam with a 5% powder filler material (B5P), has the highest storage value (3,956 MPa) and loss module (17,213 MPa), showing that bio-epoxy PU foams can dissipate energy faster than synthetic-epoxy polymer foams.Thermogravimetric analysis (TGA) showed that the synthetic epoxy (E) polymer foam had a higher Tg value and the highest value was reported by E5L (1.2) compared to bio-epoxy foams with far less repeatable results due to the less homogeneous polyol structure.


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