scholarly journals Fabrication and Characterization of Copper Matrix Composites Reinforced Silver-Coated Carbon Fibres

2018 ◽  
Vol 7 (4.30) ◽  
pp. 568
Author(s):  
A Kamardin ◽  
MNB Derman ◽  
A Rahmat ◽  
MAA Mohd Salleh
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Thermal Properties ◽  
Carbon Fibre ◽  
Weight Percent ◽  
Copper Matrix ◽  
Matrix Composites ◽  
Carbon Fibres ◽  
Coated Carbon

Silver interface was developed to improve the thermal properties of copper matrix reinforced carbon fibre. The composites were made by coating the carbon fibres with silver and copper layers via the electroless coating process. The thermal conductivity and the thermal expansion of the composites were profiled by means of JMP Pro software. The experimental results showed that the weight-percent of silver and the volume-percent of the carbon fibre have significant effect on the thermal properties of the composites. The thermal conductivity and thermal expansion of the composites were also profoundly influenced by the anisotropic structure of the composites.  

scholarly journals Correlation between Interfacial Microstructure and Conditions of Bonding in Carbon Fibre-Copper Composites

1995 ◽  
Vol 4 (2) ◽  
pp. 096369359500400 ◽  
Author(s):  
W.K. Włosiński ◽  
K. Pietrzak ◽  
D. Kaliński ◽  
W. Olesińska
Keyword(s):  
Thermal Conductivity ◽  
Carbon Fibre ◽  
Active Element ◽  
Copper Matrix ◽  
Interface Layer ◽  
Interfacial Microstructure ◽  
Electrical Contacts ◽  
Matrix Composites ◽  
Carbon Fibres ◽  
The Matrix

Carbon fibre reinforced copper matrix composites have been produced to provide materials with high thermal conductivity for use in semiconductors (diodes and thyristors) and electrical contacts. The problem of poor wettability of the carbon fibres by the copper matrix was overcome by admixing the matrix with zirconium which react with the carbon fibres to form carbides. The amount of carbides formed in the interface layer and, thus, the properties of the composite can be controlled by controlling the amount of the active element added, or by modifying appropriately the process parameters. This latter method has been examined in the present study. The experimental results have been verified by calculating and analysing the thermodynamic parameters of the process.

Thermal properties of kinetic spray Al–SiC metal-matrix composite

2003 ◽  
Vol 18 (4) ◽  
pp. 855-860 ◽  
Author(s):  
Gary L. Eesley ◽  
Alaa Elmoursi ◽  
Nilesh Patel
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Thermal Properties ◽  
Metal Matrix ◽  
Volume Fraction ◽  
Spray Deposition ◽  
Deposition Process ◽  
Matrix Composites ◽  
Kinetic Spray ◽  
Compositional Variations

Kinetic spray deposition provides a new means for producing composite materials with tailored physical properties. We report on measurements of the thermal conductivity and thermal-expansion coefficient for several compositional variations of kinetically sprayed Al–SiC metal-matrix composites. As a result of the deposition process, inclusion of SiC particles saturates in the 30–40% volume fraction range.

Thermal Conductivity and Thermal Expansion of Copper Matrix Composites Reinforced with High Modulus C Fibres

2010 ◽  
Vol 297-301 ◽  
pp. 820-825
Author(s):  
Naďa Beronská ◽  
Pavol Štefánik ◽  
Karol Iždinský
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Pure Copper ◽  
Longitudinal Direction ◽  
Copper Matrix ◽  
Matrix Composites ◽  
High Modulus ◽  
Pressure Infiltration ◽  
Copper Matrix Composite ◽  
Infiltration Technique

Copper matrix composite with pure copper matrix reinforced with high modulus carbon fibres Thornel K 1100 was prepared by gas pressure infiltration technique. As-received composite was subjected to thermal expansion and thermal conductivity measurements in longitudinal and transversal directions. Large anisotropy of properties as well as surprisingly good structural stability has been observed. The mean coefficients of thermal expansion as low as 0.8 x 10-6 K-1 in longitudinal and as high as 23.5 x 10-6 K-1 in transversal directions were determined, the thermal conductivities as high as 650 Wm-1K-1 in longitudinal direction and as low as 60.7 Wm-1K-1in transversal directions were measured.

Thermal expansion of cross-ply and woven carbon fibre–copper matrix composites

2002 ◽  
Vol 33 (1) ◽  
pp. 133-136 ◽  
Author(s):  
J. Koráb ◽  
P. Štefánik ◽  
Š. Kavecký ◽  
P. Šebo ◽  
G. Korb
Keyword(s):  
Thermal Expansion ◽  
Carbon Fibre ◽  
Copper Matrix ◽  
Matrix Composites ◽  
Copper Matrix Composites

scholarly journals Comparison of experimental and modelling results of thermal properties in Cu-AlN composite materials

2013 ◽  
Vol 61 (2) ◽  
pp. 507-514 ◽  
Author(s):  
M. Chmielewski ◽  
W. Weglewski
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Thermal Properties ◽  
Metal Matrix ◽  
Coefficient Of Thermal Expansion ◽  
Analytical Models ◽  
Matrix Composites ◽  
Pressing Method ◽  
3D Space ◽  
Automotive Electronic

Abstract Copper-based composites could be widely used in automotive, electronic or electrical industry due to their very promising thermal properties. In the present paper, Cu-AlN metal matrix composites with ceramic volume fractions between 0.1 and 0.4 were fabricated by hot pressing method in vacuum. Dependence of the coefficient of thermal expansion (CTE) and the thermal conductivity (TC) on the chemical composition of composites has been investigated. The measured values of the thermal expansion coefficient have been compared with the analytical models’ predictions. A numerical model based on FEAP 7.5 in 3D space has been used to evaluate the influence of the porosity on the thermal properties (thermal conductivity) of the composite. A fairly good correlation between the FEM results and the experimental measurements has been obtained.

Structural and Thermal Properties of Hot Pressed Cu/C Matrix Composites Materials Used for the Thermal Management of High Power Electronic Devices

2007 ◽  
Vol 534-536 ◽  
pp. 1505-1508 ◽  
Author(s):  
Pierre Marie Geffroy ◽  
Jean François Silvain
Keyword(s):  
Thermal Conductivity ◽  
Thermal Properties ◽  
Carbon Fibers ◽  
Volume Fraction ◽  
Coefficient Of Thermal Expansion ◽  
Copper Matrix ◽  
Matrix Composites ◽  
Porosity Level ◽  
Materials Used ◽  
Short Carbon

In order to obtain materials for electronic applications that exhibit both excellent thermal conductivity and low coefficient of thermal expansion (CTE), copper matrix composites have been reinforced by short high modulus graphite fibers. The lack of fiber/matrix interaction prevents any degradation of the carbon reinforcement during the elaboration steps and the normal use of these materials. Elaboration conditions, such as mixing conditions of the short carbon fibers and the copper powder, dimension and shape of the two powders, and finally densification atmosphere, temperature, pressure and time, have been optimized. Main parameters involved in the thermal properties of the Cu/C composite materials have been analyzed and adjusted. CTE is mainly related with the carbon volume fraction; CTE ranging from 9 to 13 10-6/°C can be reproductively obtained with carbon volume fraction ranging from 50% to 20%. Thermal conductivity properties are more complex and are linked mainly with 1) the porosity level inside the material, and 2) the orientation, properties and volume fraction of the carbon fibers. For short carbon fibers, in plane thermal conductivity ranging from 200 to 550 W/mK have been reproductively measured associated with thermal conductivity through-thickness ranging from 150 to 300 W/mK.

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