scholarly journals Comparison of experimental and modelling results of thermal properties in Cu-AlN composite materials

2013 ◽  
Vol 61 (2) ◽  
pp. 507-514 ◽  
Author(s):  
M. Chmielewski ◽  
W. Weglewski
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Thermal Properties ◽  
Metal Matrix ◽  
Coefficient Of Thermal Expansion ◽  
Analytical Models ◽  
Matrix Composites ◽  
Pressing Method ◽  
3D Space ◽  
Automotive Electronic

Abstract Copper-based composites could be widely used in automotive, electronic or electrical industry due to their very promising thermal properties. In the present paper, Cu-AlN metal matrix composites with ceramic volume fractions between 0.1 and 0.4 were fabricated by hot pressing method in vacuum. Dependence of the coefficient of thermal expansion (CTE) and the thermal conductivity (TC) on the chemical composition of composites has been investigated. The measured values of the thermal expansion coefficient have been compared with the analytical models’ predictions. A numerical model based on FEAP 7.5 in 3D space has been used to evaluate the influence of the porosity on the thermal properties (thermal conductivity) of the composite. A fairly good correlation between the FEM results and the experimental measurements has been obtained.

Thermal properties of kinetic spray Al–SiC metal-matrix composite

2003 ◽  
Vol 18 (4) ◽  
pp. 855-860 ◽  
Author(s):  
Gary L. Eesley ◽  
Alaa Elmoursi ◽  
Nilesh Patel
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Thermal Properties ◽  
Metal Matrix ◽  
Volume Fraction ◽  
Spray Deposition ◽  
Deposition Process ◽  
Matrix Composites ◽  
Kinetic Spray ◽  
Compositional Variations

Kinetic spray deposition provides a new means for producing composite materials with tailored physical properties. We report on measurements of the thermal conductivity and thermal-expansion coefficient for several compositional variations of kinetically sprayed Al–SiC metal-matrix composites. As a result of the deposition process, inclusion of SiC particles saturates in the 30–40% volume fraction range.

Diamond/Al metal matrix composites formed by the pressureless metal infiltration process

1993 ◽  
Vol 8 (5) ◽  
pp. 1169-1173 ◽  
Author(s):  
William B. Johnson ◽  
B. Sonuparlak
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Metal Matrix Composites ◽  
Metal Matrix ◽  
Coefficient Of Thermal Expansion ◽  
Matrix Composites ◽  
Infiltration Process ◽  
Point Bend ◽  
Aluminum Metal Matrix Composites ◽  
Metal Infiltration

Diamond particles are unique fillers for metal matrix composites because of their extremely high modulus, high thermal conductivity, and low coefficient of thermal expansion. Diamond reinforced aluminum metal matrix composites were prepared using a pressureless metal infiltration process. The diamond particulates are coated with SiC prior to infiltration to prevent the formation of Al4C3, which is a product of the reaction between aluminum and diamond. The measured thermal conductivity of these initial diamond/Al metal matrix composites is as high as 259 W/m-K. The effects of coating thickness on the physical properties of the diamond/Al metal matrix composite, including Young's modulus, 4-point bend strength, coefficient of thermal expansion, and thermal conductivity, are presented.

The Minimum Representative Volume Element Size for Coefficient of Thermal Expansion of Particle Reinforced Metal Matrix Composites

2013 ◽  
Vol 773 ◽  
pp. 435-440
Author(s):  
X.X. Zhang ◽  
B.L. Xiao ◽  
Z.Y. Ma
Keyword(s):  
Thermal Expansion ◽  
Metal Matrix Composites ◽  
Metal Matrix ◽  
Coefficient Of Thermal Expansion ◽  
Three Dimensional ◽  
Analytical Models ◽  
Matrix Composites ◽  
Element Size ◽  
Representative Volume Element Size ◽  
Sharp Edges

A 3D realistic microstructure based computational homogenization model is proposed, in order to determine the temperature dependent effective coefficient of thermal expansion of particle reinforced metal matrix composites The model employed three-dimensional realistic microstructures with different domain sizes, where particles had random shape, sharp edges and were randomly distributed. The unit cell microstructure based model and classical analytical models were also presented for comparison. As an illustration of the model, a 17% vol. SiCpreinforced 2124Al composite was investigated. Its minimum RVE size is found to beδ= 15, whereδis called the size ratio and defined by the ratio between the side length of microstructure and the mean particle radius.

Influence of Coating Layer to Reduce Thermal Stresses in Cylindrically Formed Metal Matrix Composites

2000 ◽  
Author(s):  
Fuat Okumus ◽  
Aydin Turgut ◽  
Erol Sancaktar
Keyword(s):  
Thermal Expansion ◽  
Metal Matrix Composites ◽  
Metal Matrix ◽  
Thermal Stresses ◽  
Coating Layer ◽  
Coefficient Of Thermal Expansion ◽  
Aluminum Matrix ◽  
Matrix Composites ◽  
Cylinder Model ◽  
Matrix Layer

Abstract In this study, the use of coating layers is investigated to reduce thermal stresses in the metal matrix composites which have a mismatch in coefficients of thermal expansions in fiber and matrix components. The thermoelastic solutions are obtained based on a three-cylinder model. It is shown that the effectiveness of the layer can be defined by the product of its coefficient of thermal expansion and thickness. Consequently, a compensating layer with a sufficiently high coefficient of thermal expansion can reduce the thermal stresses in the metal matrix. The study is based on a concentric three cylinder model isolating individual steel fibers surrounded with a coating layer and an aluminum matrix layer. Only monotonic cooling is studied.

Thermal Properties of Diamond-Particle-Dispersed Cu-Matrix-Composites Fabricated by Spark Plasma Sintering (SPS)

2010 ◽  
Vol 638-642 ◽  
pp. 2115-2120 ◽  
Author(s):  
Kiyoshi Mizuuchi ◽  
Kanryu Inoue ◽  
Yasuyuki Agari ◽  
Shinji Yamada ◽  
Motohiro Tanaka ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Properties ◽  
Spark Plasma Sintering ◽  
Packing Density ◽  
Coefficient Of Thermal Expansion ◽  
Diamond Particle ◽  
Holding Time ◽  
Matrix Composites ◽  
Plasma Sintering ◽  
Spark Plasma

Diamond-particle-dispersed copper (Cu) matrix composites were fabricated from Cu-coated diamond particles by spark plasma sintering (SPS) process, and the microstructure and thermal properties of the composites fabricated were examined. These composites can well be consolidated in a temperature range between 973K and 1173K and scanning electron microscopy detects no reaction at the interface between the diamond particle and the Cu matrix. The relative packing density of the diamond-Cu composite increases with increasing sintering temperature and holding time, reaching 99.2% when sintered at a temperature of 1173K for a holding time of 2.1ks. Thermal conductivity of the diamond-Cu composite containing 43.2 vol. % diamond increases with increasing relative packing density, reaching a maximum (654W/mK) at a relative packing density of 99.2%. This thermal conductivity is 83% the theoretical value estimated by Maxwell-Eucken equation. The coefficient of thermal expansion of the composites falls in the upper line of Kerner’s model, indicating strong bonding between the diamond particle and the Cu matrix in the composite.

scholarly journals Technological Relevance, Research Prospect and Applications of Aluminium-Silicon Carbide-Graphite Hybrid Metal Matrix Composites for Thermal Characterization

2018 ◽  
Vol 8 (02) ◽  
Author(s):  
S A Mohan Krishna ◽  
T N Shridhar ◽  
L Krishnamurthy ◽  
K B Vinay ◽  
G V Naveen Prakash
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Silicon Carbide ◽  
Thermal Expansion ◽  
Hybrid Composites ◽  
Coefficient Of Thermal Expansion ◽  
Aluminium Matrix ◽  
Matrix Composites ◽  
Aluminium Matrix Composites ◽  
Research Prospect

Aluminium matrix composites belong to the family of materials whose mechanical, tribological, thermal and electrical properties can be customized effectively. Most of the commercial work on MMCs has been highlighted on Aluminium as the matrix material. The combination of light weight, environmental resistance and beneficial mechanical properties has made Aluminium alloys exceedingly popular; these properties also make Aluminium best suited for use as a matrix metal. The thermophysical properties of these composites can be tailor made and have excellent specific mechanical properties. These composites can be fabricated with ease. Aluminium matrix composites reinforced with the particles of Silicon Carbide possess high yield strength, low coefficient of thermal expansion or thermal expansivity, high modulus of elasticity and excellent wear resistance by maintaining volume proportion up to 20%. Aluminium hybrid composites can be customized to provide moderate Coefficient of Thermal Expansion (CTE) and high thermal conductivity that are favorable for the applications pertaining to thermal management equipment. However, it is necessary to evaluate different percentage combinations of reinforcements with matrix Aluminium to check for thermal stability and to measure thermal conductivity and coefficient of thermal expansion. It is expected that, Aluminium-Silicon Carbide-Graphite hybrid composites can be used as load bearing material for the above applications. In this paper, a review about the said hybrid composites to investigate thermal properties for engineering applications have been discussed based on its technological relevance, applications and research prospect.

Diamond-Based Metal Matrix Composites for Thermal Management Made by Liquid Metal Infiltration — Potential and Limits

2008 ◽  
Vol 59 ◽  
pp. 111-115 ◽  
Author(s):  
Ludger Weber ◽  
Reza Tavangar
Keyword(s):  
Thermal Conductivity ◽  
Metal Matrix Composites ◽  
Metal Matrix ◽  
Room Temperature ◽  
Volume Fraction ◽  
Coefficient Of Thermal Expansion ◽  
Diamond Powder ◽  
Matrix Composites ◽  
Pressure Infiltration ◽  
The One

Diamond-based metal matrix composites have been made based on pure Al and eutectic Ag-3Si alloy by gas pressure infiltration into diamond powder beds with the aim to maximize thermal conductivity and to explore the range of coefficient of thermal expansion (CTE) that can be covered. The resulting composites covered roughly the range between 60 and 75 vol-% of diamond content. For the Al-based composites a maximum thermal conductivity at room temperature of 7.6 W/cmK is found while for the Ag-3Si based composites an unprecedented value of 9.7 W/cmK was achieved. The CTE at room temperature varied as a function of the diamond volume fraction between 3.3 and 7.0 ppm/K and 3.1 and 5.7 ppm/K for the Al-based and the Ag-3Si-based composites, respectively. The CTE was further found to vary quite significantly with temperature for the Al-based composites while the variation with temperature was less pronounced for the Ag-3Si-based composites. The results are compared with prediction by analytical modeling using the differential effective medium scheme for thermal conductivity and the Schapery bounds for the CTE. For the thermal conductivity good agreement is found while for the CTE a transition of the experimental data from Schapery’s upper to Schapery’s lower bound is observed as volume fraction increases. While the thermophysical properties are quite satisfactory, there is a trade-off to be made in these materials between high thermal conductivity and low CTE on the one side and surface quality and machinability on the other.

The Influences of Cu-Coated SiCp on the Porosity and Thermal Expansion Behavior of Cu-SiCp Composites

2013 ◽  
Vol 795 ◽  
pp. 241-244
Author(s):  
K. Azmi ◽  
M.I.M. Tajuddin ◽  
A. Azida
Keyword(s):  
Thermal Expansion ◽  
Thermal Management ◽  
Metal Matrix ◽  
Coefficient Of Thermal Expansion ◽  
Copper Matrix ◽  
Matrix Composites ◽  
Electroless Coating ◽  
Expansion Behavior ◽  
Significant Difference ◽  
Powder Metallurgy Methods

The widespread use of metal matrix composites as the packaging materials is due to their tailorable thermal conductivity and coefficient of thermal expansion (CTE). For the same reason, silicon carbide reinforced copper matrix (Cu-SiCp) composites are highly rated as thermal management materials in the electronic packaging applications. However, the Cu-SiCp composites fabricated via the conventional powder metallurgy methods have inferior thermophysical properties due to the presence of porosity in the interface of copper matrix and the SiCp reinforcement. In order to improve the bonding between the two constituents, the SiCp were coated with copper via electroless coating process. Based on the experimental results, the CTE values of the copper coated Cu-SiCp composites were found significantly lower than those of the non-Coated Cu-SiCp composites. The CTEs of the composites tend to decrease as the porosity increases. The significant difference in the CTE values was related to the presence of sub-micron gap between the copper matrix and the SiCp reinforcement.

Structural and Thermal Properties of Hot Pressed Cu/C Matrix Composites Materials Used for the Thermal Management of High Power Electronic Devices

2007 ◽  
Vol 534-536 ◽  
pp. 1505-1508 ◽  
Author(s):  
Pierre Marie Geffroy ◽  
Jean François Silvain
Keyword(s):  
Thermal Conductivity ◽  
Thermal Properties ◽  
Carbon Fibers ◽  
Volume Fraction ◽  
Coefficient Of Thermal Expansion ◽  
Copper Matrix ◽  
Matrix Composites ◽  
Porosity Level ◽  
Materials Used ◽  
Short Carbon

In order to obtain materials for electronic applications that exhibit both excellent thermal conductivity and low coefficient of thermal expansion (CTE), copper matrix composites have been reinforced by short high modulus graphite fibers. The lack of fiber/matrix interaction prevents any degradation of the carbon reinforcement during the elaboration steps and the normal use of these materials. Elaboration conditions, such as mixing conditions of the short carbon fibers and the copper powder, dimension and shape of the two powders, and finally densification atmosphere, temperature, pressure and time, have been optimized. Main parameters involved in the thermal properties of the Cu/C composite materials have been analyzed and adjusted. CTE is mainly related with the carbon volume fraction; CTE ranging from 9 to 13 10-6/°C can be reproductively obtained with carbon volume fraction ranging from 50% to 20%. Thermal conductivity properties are more complex and are linked mainly with 1) the porosity level inside the material, and 2) the orientation, properties and volume fraction of the carbon fibers. For short carbon fibers, in plane thermal conductivity ranging from 200 to 550 W/mK have been reproductively measured associated with thermal conductivity through-thickness ranging from 150 to 300 W/mK.

Coefficient of Thermal Expansion Measurement of Metal Matrix Composites by Thermo Mechanical Analyser

2011 ◽  
Vol 264-265 ◽  
pp. 663-668 ◽  
Author(s):  
B. Karthikeyan ◽  
S. Ramanathan ◽  
V. Ramakrishnan
Keyword(s):  
Thermal Expansion ◽  
Metal Matrix Composites ◽  
Metal Matrix ◽  
Coefficient Of Thermal Expansion ◽  
Stir Casting ◽  
Matrix Composites ◽  
Aerospace Materials ◽  
Casting Technique ◽  
Actual Use ◽  
The Matrix

The demand of today’s and future spacecrafts for a stable platform for critical payloads is the driving force behind the coefficient of thermal expansion (CTE) measurement of different aerospace materials. The CTE of a composite is different from that given by a simple rule of mixtures. This is because of the presence of reinforcement. The expansion coefficient of reinforcement is less than that of the matrix which introduces a mechanical constraint on the matrix. The degree of constraint is also dependent on the nature of the reinforcement. It is important to point out that interface can exert some influence on the value of CTE, especially for very small particle size. In addition to the interface, the CTE of particle reinforced metal matrix composites (MMCs) is affected by several other factors. To cater the needs of various requirements in a spacecraft making, a wide variety of materials are used. Besides, the indigenization efforts and development of new materials for space-use emphasizes the measurement of CTE before their actual use. Stir casting technique was used to fabricate composites containing Si Cp as reinforcements and special thermo physical properties of the material are found. CTE of the composites are measured by TMA. The experiments have been carried out in the temperature range -1400 C to 5750 C.

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