Simulation and experimental investigation on micro electrochemical drilling of micro-holes with ultra short pulse voltage

2019 ◽  
Vol 14 (1) ◽  
pp. 67
Author(s):  
Chunsheng Guo ◽  
Minghong Li ◽  
Yong Liu ◽  
Jingran Niu
2009 ◽  
Vol 52 (12) ◽  
pp. 1351-1357
Author(s):  
A. M. Bobreshov ◽  
A. V. Dyboi ◽  
Yu. Yu. Razuvaev ◽  
G. K. Uskov

Author(s):  
F. Beaudoin ◽  
P. Perdu ◽  
C. DeNardi ◽  
R. Desplats ◽  
J. Lopez ◽  
...  

Abstract Ultra-short pulse laser ablation is applied to IC backside sample preparation. It is contact-less, non-thermal, precise and can ablate the various types of material present in IC packages. This study concerns the optimization of ultra-short pulse laser ablation for silicon thinning. Uncontrolled silicon roughness and poor uniformity of the laser thinned cavity needed to be tackled. Special care is taken to minimize the silicon RMS roughness to less than 1µm. Application to sample preparation of 256Mbit devices is presented.


2020 ◽  
Vol 110 (11-12) ◽  
pp. 787-789
Author(s):  
Marcel Simons ◽  
Till Rusche ◽  
Tobias Valentino ◽  
Tim Radel ◽  
Frank Vollertsen

Die Ultrakurzpuls (UKP)-laserbasierte Bearbeitung erlaubt die Herstellung von Netzstrukturen mit verschiedenen Transmissionsgraden. Vorteile der UKP-laserbasierten Herstellung der Netze liegen vor allem in der hohen Präzision und Bearbeitungsgeschwindigkeit. Die UKP-Laserbearbeitung ermöglicht die Herstellung von Netzen aus Aluminium in hoher Qualität, bezogen auf die Stegbreitenabweichung von < 8 µm, mit variablen Transmissionsgraden. Ultra-short pulse (USP) laser based processing enables the production of mesh structures with different degrees of transmission. The advantages of USP-based production of mesh structures are mainly the high precision and processing speed. USP laser processing enables the production of meshes of aluminum in high quality, with respect to the mesh width deviation of < 8 µm with variable transmission degrees.


Sign in / Sign up

Export Citation Format

Share Document