Chemical vapor deposition of titanium nitride thin films from tetrakis(dimethylamido)titanium and hydrazine as a coreactant

2000 ◽  
Vol 15 (11) ◽  
pp. 2414-2424 ◽  
Author(s):  
Carmela Amato-Wierda ◽  
Derk A. Wierda
Keyword(s):  
Thin Films ◽  
Chemical Vapor Deposition ◽  
Low Temperature ◽  
Growth Rates ◽  
Vapor Deposition ◽  
Film Growth ◽  
Chemical Vapor ◽  
Air Exposure ◽  
Tin Films ◽  
Tin Film

Hydrazine was used as a coreactant with tetrakis(dimethylamido)titanium for the low-temperature chemical vapor deposition of TiN between 50 and 200 °C. The TiN film-growth rates ranged from 5 to 45 nm/min. Ti:N ratios of approximately 1:1 were achieved. The films contain between 2 and 25 at.% carbon, as well as up to 36 at.% oxygen resulting from diffusion after air exposure. The resistivity of these films is approximately 104 μΩ cm. Annealing the films in ammonia enhances their crystallinity. The best TiN films were produced at 200 °C from a 2.7% hydrazine–ammonia mixture. The Ti:N ratio of these films is approximately 1:1, and they contain no carbon or oxygen. These films exhibit the highest growth rates observed.

Novel Antimony Precursors for Low-Temperature CVD of Antimonide Thin Films

1997 ◽  
Vol 495 ◽  
Author(s):  
Michael A. Todd ◽  
Gautam Bhandari ◽  
T. H. Baum
Keyword(s):  
Thin Films ◽  
Chemical Vapor Deposition ◽  
Low Temperature ◽  
Growth Rates ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Low Pressure ◽  
Lewis Base ◽  
Stable Carbon ◽  
Deuterium Substitution

ABSTRACTVolatile antimony precursors were synthesized for the low temperature chemical vapor deposition (CVD) of antimony thin films. The molecules synthesized include tris (trifluoromethyl)stibine, Sb(CF3)3, Lewis base adducts of Sb(CF3)3, and antimony trihydride (stibine), SbH3. Isotopie substitution of stibine with deuterium leads to a more thermally stable, carbon-free antimony source. Similarly, deuterium substitution of trimethylsilylmethyl antimony dihydride leads to a stabilized liquid antimony precursor. The molecules were characterized using FTIR, NMR and DSC / TGA. Pure antimony films were deposited at temperatures below 300 °C with growth rates approaching 170 Å / min using a low pressure hot-wall CVD reactor. The films were characterized using XRD, EDS, SEM and AFM.

Low Temperature Chemical Vapor Deposition of Titanium Nitride Thin Films With Hydrazine and Tetrakis-(dimethylamide)Titanium

1999 ◽  
Vol 606 ◽  
Author(s):  
Carmela Amato-Wierda ◽  
Edward T. Norton ◽  
Derk A. Wierda
Keyword(s):  
Thin Films ◽  
Chemical Vapor Deposition ◽  
Low Temperature ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Air Exposure ◽  
Temperature Growth ◽  
Low Temperature Growth ◽  
Reducing Ability ◽  
Tin Thin Films

AbstractHydrazine and tetrakis-(dimethylamido)titanium have been used as precursors for the low temperature chemical vapor deposition of TiN thin films between 50°C and 200°C at growth rates between 5 to 35 nm/min. At hydrazine to TDMAT ratios of 50:1 and 100:1 the resulting films show an increase in the Ti:N ratio with increasing deposition temperature. They contain 2% carbon, and varying amounts of oxygen up to 36% as a result of diffusion after air exposure. The low temperature growth is improved when hydrazine-ammonia mixtures containing as little as 1.9% hydrazine are used. Their Ti:N ratio is almost 1:1 and they contain no carbon or oxygen according to RBS. The TiN films grown from pure hydrazine or the hydrazine-ammonia mixture have some crystallinity according to x-ray diffraction and their resistivity is on the order of 104µω cm. The low temperature growth is attributed to the weak N–N bond in hydrazine and its strong reducing ability. In these films, the Ti:N ratio is approximately 1:1.

Transparent conducting indium oxide thin films grown by low-temperature metal organic chemical vapor deposition

2007 ◽  
Vol 515 (5) ◽  
pp. 2921-2925 ◽  
Author(s):  
Chunyu Wang ◽  
Volker Cimalla ◽  
Genady Cherkashinin ◽  
Henry Romanus ◽  
Majdeddin Ali ◽  
...  
Keyword(s):  
Thin Films ◽  
Chemical Vapor Deposition ◽  
Low Temperature ◽  
Indium Oxide ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Organic Chemical ◽  
Transparent Conducting ◽  
Metal Organic ◽  
Organic Chemical Vapor Deposition

Growth of Rhombohedral B12P2 Thin Films on 6H-SiC(0001) By Chemical Vapor Deposition

2003 ◽  
Vol 799 ◽  
Author(s):  
Peng Lu ◽  
J. H. Edgar ◽  
J. Pomeroy ◽  
M. Kuball ◽  
H. M. Meyer ◽  
...  
Keyword(s):  
Thin Films ◽  
Chemical Vapor Deposition ◽  
Flow Rate ◽  
Growth Rates ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Flow Rate Ratio ◽  
Good Surface ◽  
Boron Phosphide ◽  
Moderate Growth

ABSTRACTThe parameters necessary to deposit oriented rhombohedral boron phosphide (B12P2) thin films on on-axis Si-face 6H-SiC(0001) substrates by chemical vapor deposition are reported. Ultra high purity BBr3 and PBr3 were used as reactants, with hydrogen as the carrier gas. The BBr3 to PBr3 flow rate ratio was adjusted to obtain good surface morphology of the B12P2 films. BBr3 to PBr3 ratios in the range of 1 to 1.5 produced smooth surfaces and moderate growth rates of 10μm/hr. Higher growth rates were obtained by increasing the BBr3 flow rate, but the surfaces became very rough. The c-axis of the B12P2 film was aligned with the c -axis of the substrate at temperatures between 1650°C-1700°C. The surface morphologies were investigated by SEM and the crystalline properties of the films were characterized by XRD and Raman spectroscopy.

Growth of Antimony Thin Films Using Perbenzylated Organometallic Precursors

1998 ◽  
Vol 547 ◽  
Author(s):  
Michael P. Remington ◽  
Smuruthi Kamepalli ◽  
Philip Boudjouk ◽  
Bryan R. Jarabek ◽  
Dean G. Grier ◽  
...  
Keyword(s):  
Thin Films ◽  
Chemical Vapor Deposition ◽  
Low Temperature ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Low Carbon ◽  
Design Strategies ◽  
Glass Substrates ◽  
Pressure Chemical ◽  
Organometallic Precursors

AbstractThe low temperature (ca. 300°C) deposition of antimony films by low-pressure chemical vapor deposition (LPCVD) on glass substrates from tribenzylantimony, Bn3Sb, is described. The facile elimination of the benzyl ligands results in preferentially oriented antimony films with low carbon content. The pyrolysis, decomposition mechanism and precursor design strategies are discussed. In addition, the deposition of bismuth from tribenzylbismuth, Bn3Bi, is presented. The potential for alloy growth using these precursors is discussed. Resulting films were characterized by XRD, SEM, and AFM.

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