scholarly journals Sintering of screen-printed platinum thick films for electrode applications

2001 ◽  
Vol 16 (4) ◽  
pp. 922-931 ◽  
Author(s):  
J. B. Véchembre ◽  
G. R. Fox
Keyword(s):  
Surface Roughness ◽  
Screen Printing ◽  
Critical Parameter ◽  
Surface Coverage ◽  
Sintering Behavior ◽  
Alumina Surface ◽  
Anomalous Increase ◽  
Pt Electrodes ◽  
Three Stages ◽  
Pt Films

Pt electrodes with a 6–8-μm thickness were produced on alumina substrates by a double-print Pt screen-printing process that included a sequential heat treatment at 600 °C and 1300 °C. This process improved the final sintered double-print film because the first printed layer acted as a sintering template for the second printed layer. The sintered Pt films have a 95% coverage of the alumina surface, 92% density, 0.73-μm average surface roughness, and 16.10−5 Ω cm resistivity. The sintering behavior of Pt films exhibited three stages of densification: Stage I (T °C < 700 °C), exhibiting neck growth, and Stage II (700 < T °C < 1300 °C), exhibiting grain growth, have activation energies of 64 kJ/mol and 125 kJ/mol, respectively. Stage III exhibits a decrease in shrinkage due to Pt coalescence and island formation. The transition temperature, 700 °C, between Stages I and II corresponds to an anomalous increase in surface roughness and resistivity. The thickness of Pt films was a critical parameter for achieving alumina surface coverage. Uniaxial pressing of dried Pt films increased densification and reduced the surface roughness of double-print Pt films.

scholarly journals Printability and Properties of Conductive Inks on Primer-Coated Surfaces

2019 ◽  
Vol 2019 ◽  
pp. 1-8
Author(s):  
Hector R. Mendez-Rossal ◽  
Gernot M. Wallner
Keyword(s):  
Electrical Conductivity ◽  
Surface Roughness ◽  
Electrical Resistivity ◽  
Screen Printing ◽  
Good Adhesion ◽  
Laser Confocal Microscopy ◽  
Conductive Inks ◽  
Coated Metal ◽  
Coated Surfaces ◽  
Resistivity Testing

Conductive inks’ performance is affected by the printing conditions and the substrate’s properties. In this study, one graphite-, one polymer-, and two silver-based conductive inks were printed on four primer-coated metal substrates by screen printing. The compatibility and wettability between the inks and the primers were evaluated by infrared spectroscopy and surface energy measurements. The printed structures were characterized by laser confocal microscopy, peel-off tape testing, and four-point probe electrical resistivity testing. In general, silver inks exhibited the best performance in terms of printability and electrical conductivity. The graphite ink presented the worst printing, adhesion, and functional properties. The polymer-based ink revealed poor wettability but good adhesion and functionality. The surface roughness, energy, and polarity of the primer coating had no significant influence on the electrical conductivity of the printed inks.

Determination of the Orientation of Adsorbed Pyridine and γ-MPS on Alumina Surface by Photoacoustic FT-IR Spectroscopy

1986 ◽  
Vol 40 (6) ◽  
pp. 851-856 ◽  
Author(s):  
Marek W. Urban ◽  
Jack L. Koenig
Keyword(s):  
Surface Coverage ◽  
Hydroxyl Groups ◽  
Alumina Surface ◽  
Surface Hydroxyl ◽  
Adsorbed Pyridine ◽  
Ft Ir ◽  
Infrared Photoacoustic Spectroscopy ◽  
Pyridinium Ion ◽  
Ft Ir Spectroscopy

Fourier transform infrared photoacoustic spectroscopy has been applied to determine the structure and orientation of pyridine and γ-Metacryl-oxypropyltriethoxysilane (γ-MPS) on γ-Al2O3 surface. Adsorption of pyridine on activated γ-Al2O3 leads to formation of a pyridinium ion (pyN+-H) and pyridine N-oxide. The orientation of pyridinium ion on the alumina surface is random, whereas the pyridine N-oxide is parallel with respect to the surface. The adsorption of oligomers of γ-MPS gives parallel layers on the alumina surface. At low γ-MPS surface coverage, the carbonyl groups interact with the surface hydroxyl groups. Increasing surface coverage leads to an excess of the free C=O species.

Comparison of Sensitivity of Resistive Oxygen Sensors Using Pt Electrodes Prepared by Screen-printing and Sputtering with Metal Mask

2005 ◽  
Vol 73 (7) ◽  
pp. 502-504
Author(s):  
Noriya IZU ◽  
Woosuck SHIN ◽  
Ichiro MATSUBARA ◽  
Norimitsu MURAYAMA
Keyword(s):  
Screen Printing ◽  
Oxygen Sensors ◽  
Metal Mask ◽  
Pt Electrodes

Preparation of Bauxite-Based Homogenized Mullite Grogs with Bauxite and Coal Gangue

2011 ◽  
Vol 199-200 ◽  
pp. 1940-1944 ◽  
Author(s):  
Zhong Zheng Yang ◽  
Zhen Xian Xing ◽  
Zhan Fang Gai ◽  
Huan Qiang Liu
Keyword(s):  
High Temperature ◽  
Physical Properties ◽  
Bulk Density ◽  
Sintering Temperature ◽  
Apparent Porosity ◽  
Heat Processing ◽  
Sintering Behavior ◽  
Sintering Aids ◽  
Homogenization Process ◽  
Three Stages

The sintering behavior, physical properties and heat processing changes of bauxite-based homogenized grogs prepared by homogenization process and high temperature sintering using bauxite as starting material were investigated. Results show that the bauxite-based mullite can be synthesized by the method, sintering temperature with and without MgO/CeO2sintering aids are 1600°C and 1700°C separately, the mullite with apparent porosity of＜1.0% and 2.5%, bulk density of ≥2.87g•cm-3and 2.75g•cm-3, Refracteriness-Under-Load(RUL) 1600°C and 1620С; changes in the heat processing is divided into three stages: dehydration stage(400°С~900°С ), primary mullitization stage(1000°С ~1200°С) and secondary mullitization stage(>1200°С).

scholarly journals Состав и морфология поверхности Si(111) с поверхностной пленкой SiO-=SUB=-2-=/SUB=- разной толщины

2021 ◽  
Vol 55 (11) ◽  
pp. 1045
Author(s):  
Б.Е. Умирзаков ◽  
С.Б. Донаев ◽  
Р.М. Ёркулов ◽  
Р.Х. Ашуров ◽  
В.М. Ротштейн
Keyword(s):  
Surface Roughness ◽  
Electronic Structure ◽  
Film Thickness ◽  
Thermal Oxidation ◽  
Surface Coverage ◽  
Plasma Oscillations

In this work, the composition, morphology, and electronic structure of SiO2 nanofilms of various thicknesses, created by thermal oxidation on the Si(111) surface, have been studied. It is shown that up to a thickness of 30–40 Å, the film has an island character. At d ≥ 60 Å, a homogeneous continuously film of SiO2 is formed and the stoichiometric surface roughness of which does not exceed 1.5 - 2 nm. Regardless of the film thickness of the SiO2 appreciable interdiffusion of atoms at the interface SiO2-Si not observed. The regularities of the change in the composition, the degree of surface coverage, and the energy of plasma oscillations with a change in the thickness of the SiO2/Si(111) films in the range from 20 to 120 Å have been determined.

A Study on the Selective Nucleations for Formation of Large Single Grains in PZT Thin Films

1999 ◽  
Vol 596 ◽  
Author(s):  
Jang-Sik Lee ◽  
Eung-Chul Park ◽  
Jung-Ho Park ◽  
Byung-Il Lee ◽  
Seung-Ki Joo
Keyword(s):  
Thin Films ◽  
Grain Boundary ◽  
Perovskite Phase ◽  
Breakdown Field ◽  
Pzt Thin Films ◽  
Random Nucleation ◽  
Saturation Polarization ◽  
Pt Electrodes ◽  
Pzt Films ◽  
Pt Films

AbstractSelective nucleation and lateral growing method have been developed for high quality ferroelectric PZT(65/35) thin films using perovskite-phase PZT island seed. The PZT films on PZT seed island were transformed into the perovskite phase at temperatures as low as 540°C, which is 150°C lower than compared to that of PZT thin films deposited on Pt films. The temperature difference enables lateral growth without undesirable random nucleation. Maximum grain sizes of the perovskite-phase PZT films were determined by the annealing temperature. The PZT thin films show a leakage current density of 8×10−8 A/cm2, breakdown field of 1240 kV/cm, saturation polarization of 42 μC/cm2, and remanent polarization of 30 μC/cm2, whose values were maintained up to 2×1011 cycles. In this study, we show that when there was no grain boundary in the area measured, degradation such as fatigue and retention was not observed even with Pt electrodes. So the main source of degradation is the grain boundary in the PZT thin films.

scholarly journals Effect of processing parameters on in situ screen printing-assisted synthesis and electrical properties of Ti3SiC2-based structures

2021 ◽  
Vol 10 (1) ◽  
pp. 129-138
Author(s):  
Mylena Lorenz ◽  
Nahum Travitzky ◽  
Carlos R. Rambo
Keyword(s):  
Electrical Conductivity ◽  
Surface Roughness ◽  
Electrical Properties ◽  
Dwell Time ◽  
Screen Printing ◽  
Processing Parameters ◽  
Powder Mixtures ◽  
Temperature Range ◽  
Screen Printed

AbstractThis work reports on the development of pastes containing Ti, TiC, Si, and C elementary powders for in situ synthesis of Ti3SiC2 via screen printing. Four paste compositions were manufactured using two powder mixtures (Ti/Si/C and Ti/TiC/Si/C) with different stoichiometry. The pastes were screen printed onto Al2O3 substrates and sintered at 1400 ℃ in argon varying the dwell time from 1 to 5 h. The printed pastes containing TiC and excess of Si exhibited the lowest surface roughness and after 5 h sintering comprised of Ti3SiC2 as the majority phase. The electrical conductivity of this sample was found to range from 4.63×104 to 2.57×105 S·m–1 in a temperature range of 25–400 ℃.

scholarly journals Effect of Various Infrared Heaters on Sintering Behavior of UHMWPE in Selective Inhibition Sintering Process

2019 ◽  
Vol 8 (6) ◽  
pp. 725-731 ◽  
Keyword(s):  
Surface Roughness ◽  
Computer Aided Design ◽  
Low Cost ◽  
Laser System ◽  
Selective Laser Sintering ◽  
Heating Surface ◽  
Selective Inhibition ◽  
Sintering Behavior ◽  
Layer By Layer ◽  
Selective Inhibition Sintering

Selective inhibition sintering (SIS) is an emerging powder-based additive manufacturing technology that creates polymer or metal based parts through adhesion of layer-by-layer from three-dimensional computer-aided design model. Replacement of costly laser system in selective laser sintering tremendously reduces the cost of manufacturing. SIS attempts to incorporate low cost heaters to achieve efficient sintering for production of high quality parts. However, SIS demands uniform heating of each layer for effective sintering. The present study focused on examining the heating characteristics of three different types of infrared heaters with respect to various layer thickness and determining the optimal distance between the heating surface and the powder bed. Experiments are conducted using the low-cost heaters to obtain uniform distribution of heat energy across the ultra-high molecular weight polyethylene (UHMWPE) powder surface. The thermal and optical images are captured to observe the temperature distribution on the powder and the surface roughness. Tensile and compressive specimens were fabricated and their corresponding strength was determined and surface roughness was measured to study the surface characteristics of the parts.

Microstructural Characterization of Platinum Films Grown by Mocvd

1995 ◽  
Vol 403 ◽  
Author(s):  
M. Vellaikal ◽  
S. K. Streiffer ◽  
R. R. Woolcott ◽  
A. I. Kingon
Keyword(s):  
Surface Roughness ◽  
Film Thickness ◽  
Side Wall ◽  
Chemical Vapor ◽  
Microstructural Characterization ◽  
Si Substrates ◽  
Wall Film ◽  
Conformal Coverage ◽  
Formation Resistivity ◽  
Pt Films

AbstractPlatinum thin films were deposited on SiO2/Si(100) by metalorganic chemical vapor deposition using Pt(acetylacetonate) and Pt(hexaflouroacetylacetonate) as precursors. The films were characterized in terms of orientation, surface roughness and morphology. As expected, Pt(111) was the preferred orientation. Higher substrate temperatures led to higher growth rates and increased surface roughness. The presence of oxygen during deposition decreased the minimum substrate temperature required for platinum deposition, indicating that oxygen played a role in the decomposition of these metalorganic compounds. Annealing platinum films at 550°C in an oxygen ambient resulted in hillock formation. Resistivity measurements showed that films deposited without oxygen were more resistive. Conformal coverage of platinum on patterned SiO2/Si substrates was investigated, and a side wall film thickness to top film thickness ratio of 0.6 for growth at 400°C was obtained. These Pt films produced by MOCVD displayed greater surface roughnesses than films grown by evaporation or sputtering.

Surface Morphology and Structural Properties of Silver Thin Films Prepared on Polyethylene Terephthalate (PET) Substrate by Screen Printing Technique

2011 ◽  
Vol 364 ◽  
pp. 110-114 ◽  
Author(s):  
M.K.M. Ali ◽  
Kamarulazizi Ibrahim ◽  
E.M. Mkawi ◽  
M.Z. Pakhuruddin
Keyword(s):  
Thin Films ◽  
Surface Roughness ◽  
Polyethylene Terephthalate ◽  
Screen Printing ◽  
Plastic Substrates ◽  
Force Microscopy ◽  
Screen Printing Technique ◽  
Printing Technique ◽  
Experimental Findings ◽  
Screen Printing Technology

In this work, different thicknesses of silver (Ag) thin films were prepared on flexible polyethylene terephthalate (PET) plastic substrates by screen printing technology. Scanning electron microscopy (SEM) and atomic force microscopy (AFM) were used to characterize morphology and surface roughness of the Ag thin films. Crystallinity and crystallites sizes of the films were verified on High resolution X-ray diffraction (HR-XRD) system. From the AFM, rough surfaces were revealed with root mean square surface roughness (RMS) ranging from 20 to 40 nm for different thicknesses of the films and were found to be strongly dependent on the film thickness. The HR-XRD spectra showed different crystalline orientations of Ag thin films (with various thicknesses) produced by the screen printing technique. All the experimental findings were subsequently discussed.

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