Detailed Investigation of GaN Metal-Insulator-Semiconductor Structures by Capacitance-voltage and Deep Level Transient Spectroscopy Methods

2008 ◽  
Vol 1108 ◽  
Author(s):  
Junjiroh Kikawa ◽  
Yuki Horiuchi ◽  
Eiji Shibata ◽  
Masamitsu Kaneko ◽  
Hirotaka Otake ◽  
...  

AbstractInterface states produced at the interface between an insulator and GaN semiconductor determine the performance of GaN metal-insulator-semiconductor (MIS) field effect transistors. Therefore, it is important to know details of interface states characteristics to improve device performances. For above purpose, we have fabricated GaN MIS capacitors, then carried out capacitance-voltage (CV) and deep level transient spectroscopy (DLTS) measurements, and analyzed the obtained results in detail.Wafers used in this study were n-type GaN grown on sapphire substrates by metal organic chemical vapor deposition. A film of SiN was deposited as an insulating layer using electron-cyclotron-resonance plasma-assisted deposition at room temperature, then samples were annealed at 400, 600 or 800°C in N2 atmosphere for 10 min.CV measurements were performed for all the samples at various frequencies and bias sweep rates in the dark condition. CV curves of all the samples exhibited ledges in the curves. Here, ledge indicates a region of which capacitance is independent of applied bias. Although each sample was annealed at each different temperature, it was observed at the same surface potential for all the samples. This result indicates that the Fermi level of the GaN/SiN interface is pinned by a particular trap. In addition, the shape of the CV curve depended on both frequency and bias sweep rate, and it was not observed in the results obtained by a quasi-static capacitance voltage measurement. This can be explained that the shape of ledge is determined by the quasi-equilibrium between a filling rate of traps and a bias sweep rate or test frequency.In the positive bias region of the ledge, a hysteresis window of the CV curve had some dependence on frequency but little dependence on bias sweep rate. On the other hand, in the negative bias region of the ledge, it had little dependence on frequency but obvious dependence on bias sweep rate. These dependences indicate two different traps and related to the ledge formation. The trap energy level related to the sweep rate dependence is estimated to be 0.34 eV by the temperature dependence of the width of hysteresis window.Deep level transient spectroscopy measurements were carried out to characterize the trap levels observed in the CV curves. Trap levels with activation energies of 0.32 and 0.78 eV were observed [1]. The former is almost equal to 0.34 eV obtained from the temperature dependence of the width of hysteresis window. The latter is similar to the interface trap reported by Nakano et al., which is considered to be originated from the complexes of Si and surface defect [2].[1] E. Shibata et al., Ext. Abstracts 2008 IMFEDK, Osaka, pp.69-70. (2008).[2] Y. Nakano and T. Jimbo, Appl. Phys. Lett. 80, 4756 (2002).

Author(s):  
М.М. Соболев ◽  
Ф.Ю. Солдатенков

The results of experimental studies of capacitance– voltage characteristics, spectra of deep-level transient spectroscopy of graded high-voltage GaAs p+−p0−i−n0 diodes fabricated by liquid-phase epitaxy at a crystallization temperature of 900C from one solution–melt due to autodoping with background impurities, in a hydrogen or argon ambient, before and after irradiation with neutrons. After neutron irradiation, deep-level transient spectroscopy spectra revealed wide zones of defect clusters with acceptor-like negatively charged traps in the n0-layer, which arise as a result of electron emission from states located above the middle of the band gap. It was found that the differences in capacitance–voltage characteristics of the structures grown in hydrogen or argon ambient after irradiation are due to different doses of irradiation of GaAs p+−p0−i−n0 structures and different degrees of compensation of shallow donor impurities by deep traps in the layers.


2011 ◽  
Vol 109 (6) ◽  
pp. 064514 ◽  
Author(s):  
A. F. Basile ◽  
J. Rozen ◽  
J. R. Williams ◽  
L. C. Feldman ◽  
P. M. Mooney

1997 ◽  
Vol 500 ◽  
Author(s):  
S. Dueñas ◽  
R. Peláez ◽  
E. Castán ◽  
J. Barbolla ◽  
I. Mártil ◽  
...  

ABSTRACTWe have obtained Al/SiNx:H/Si and Al/SiNx:H/InP Metal-Insulator-Semiconductor devices by directly depositing silicon nitride thin films on silicon and indium phosphide wafers by the Electron Cyclotron Resonance Plasma method at 200°C. The electrical properties of the structures were first analyzed by Capacitance-Voltage measurements and Deep-Level Transient Spectroscopy (DLTS). Some discrepancies in the absolute value of the interface trap densities were found. Later on, Admittance measurements were carried out and room and low temperature conductance transients in the silicon nitride/semiconductor interfaces were found. The shape of the conductance transients varied with the frequency and temperature at which they were obtained. This behavior, as well as the previously mentioned discrepancies, are explained in terms of a disorder-induced gap-state continuum model for the interfacial defects. A perfect agreement between experiment and theory is obtained proving the validity of the model.


1993 ◽  
Vol 312 ◽  
Author(s):  
P. Krispin ◽  
R. Hey ◽  
H. Kostial ◽  
M. Höricke

AbstractWe report on a detailed investigation of MBE-grown isotype silicon-doped heterostructures by capacitance/voltage (C/V) technique and deep-level transient spectroscopy (DLTS). A sequence of electrically active defects is found. By depth profiling of the density of the dominant levels it is demonstrated that the corresponding defects are concentrated at the GaAs-on-AlAs (inverted) interface. By comparison with studies on irradiation-induced levels in LPE- or VPE-grown AlGaAs we conclude that the defects at the GaAs/AlAs interface are most probably linked to different charge states of the arsenic vacancy VAs and VAs−ASi pairs.


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