Transmission Electron Microscope Observations of Lattice Defects Produced During Diffusion Induced Grain Boundary Migration

1988 ◽  
Vol 122 ◽  
Author(s):  
Re-Jehn Jahn ◽  
A.H. King
Keyword(s):  
Electron Microscope ◽  
Grain Boundary ◽  
Transmission Electron Microscope ◽  
Boundary Migration ◽  
Lattice Defects ◽  
Grain Boundary Migration ◽  
Transmission Electron

Study of Deformation Behavior of Ultrafine-grained Materials Through in Situ Nanoindentation in a Transmission Electron Microscope

2005 ◽  
Vol 20 (7) ◽  
pp. 1735-1740 ◽  
Author(s):  
M. Jin ◽  
A.M. Minor ◽  
D. Ge ◽  
J.W. Morris
Keyword(s):  
Electron Microscope ◽  
Grain Boundary ◽  
Transmission Electron Microscope ◽  
Deformation Behavior ◽  
Boundary Migration ◽  
Boundary Motion ◽  
Transmission Electron ◽  
Ultrafine Grained ◽  
Grain Boundary Motion

The mechanical properties of ultrafine-grained and nanograined materials have received a great deal of recent attention because of their unusual and promising values. However, some of the most important mechanisms of deformation remain unclear. In this work, the deformation behavior of ultrafine-grained Al films and ultrafine-grained Fe is studied through in situ nanoindentation in a transmission electron microscope. Deformation-induced coarsening by grain boundary migration was observed in the ultrafine-grained Al films during deformation at room temperature, whereas no grain boundary motion was found in ultrafine-grained Fe. The lack of grain boundary motion in Fe was attributed to the pinning effect of nano-sized particles at the Fe grain boundaries.

The recrystallization process in some polycrystalline metals

1962 ◽  
Vol 267 (1328) ◽  
pp. 11-30 ◽  
Keyword(s):  
Activation Energy ◽  
Electron Microscope ◽  
Grain Boundary ◽  
Grain Boundaries ◽  
Boundary Migration ◽  
Grain Boundary Migration ◽  
Recrystallization Process ◽  
Boundary Mobility ◽  
Grain Boundary Mobility ◽  
Polycrystalline Metals

Electron microscope observations on some polycrystalline metals suggest that after small to moderate deformation, recrystallization occurs by the migration of the original grain boundaries. A theory based on this mechanism can account for the known form of the recrystallization kinetics without necessarily introducing any anisotropy of grain boundary mobility. For this mechanism the so-called recrystallization activation energy is identical to the activation energy for grain boundary migration.

Creep in Polycrystalline Aluminum

1999 ◽  
Vol 586 ◽  
Author(s):  
C. L. Briant ◽  
D. L. Davidson
Keyword(s):  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
Grain Boundary ◽  
Triple Point ◽  
Tensile Strain ◽  
Boundary Migration ◽  
Local Strain ◽  
Grain Boundary Migration ◽  
Polycrystalline Aluminum ◽  
Scanning Electron

ABSTRACTThis paper presents a study of creep in polycrystalline aluminum. The sample was deformed in a scanning electron microscope and local strain was measured by analyzing micrographs taken during the test. EBSP was used to examine grain curvature and recrystallization The results showed that tensile strain developed during the test. The strain was not constant but varied both spatially and with time. Significant grain boundary migration occurred during the test, and near a triple point a grain with a completely new orientation was formed.

scholarly journals Evidence of Stress Development as a Source of Driving Force for Grain-Boundary Migration in a Ni Bicrystalline TEM Specimen

Materials ◽  
2020 ◽  
Vol 13 (2) ◽  
pp. 360
Author(s):  
Sung Bo Lee ◽  
Jinwook Jung ◽  
Heung Nam Han
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Grain Boundary ◽  
Focused Ion Beam ◽  
Boundary Migration ◽  
Ion Beam ◽  
Grain Boundary Migration ◽  
Migration Behavior ◽  
Stress Development ◽  
Transmission Electron

In a previous study, using high-resolution transmission electron microscopy (HRTEM), we examined grain-boundary migration behavior in a Ni bicrystal. A specimen for transmission electron microscopy (TEM) was prepared using focused ion beam. The Ni lamella in the specimen was composed of two grains with surface normal directions of [1 0 0] and [1 1 0]. As the lamella was heated to 600 °C in a TEM, it was subjected to compressive stresses. The stress state of the Ni lamella approximated to the isostress condition, which was confirmed by a finite element method. However, the stress development was not experimentally confirmed in the previous study. In the present study, we present an observation of stacking faults with a length of 40–70 nm at the grain boundary as direct evidence of the stress development.

Improvement of Stress Corrosion Cracking (SCC) Resistance of a 7150 Al-Zn-Mg-Cu Alloy by Retrogression and Reageing (RRA) Treatment

2014 ◽  
Vol 984-985 ◽  
pp. 529-535 ◽  
Author(s):  
Prasanta Kumar Rout ◽  
M.M. Ghosh ◽  
K.S. Ghosh
Keyword(s):  
Electron Microscope ◽  
Grain Boundary ◽  
Transmission Electron Microscope ◽  
Stress Corrosion Cracking ◽  
Peak Hardness ◽  
Slow Strain Rate Test ◽  
Cu Alloy ◽  
Transmission Electron ◽  
Crack Morphology ◽  
Rate Test

A 7150 Al-Zn-Mg-Cu alloy is artificially aged at 120 oC for varying time. The peak hardness (T6 temper) is obtained at about 24 h at that temperature. Further, the T6 temper is subjected to retrogression and reageing (RRA) treatment. Slow strain rate test (SSRT) has been carried out on the T6 and RRA tempers. SSRT results indicated that the RRA temper have higher resistance to SCC compared to that of T6 temper. SCC behaviour of the alloy tempers have been explained with the help of microstructural features studied by transmission electron microscope (TEM). The large, discrete and discontinuous grain boundary precipitates observed in the microstructure of the RRA temper are believed to be the responsible factor for achieving higher SCC resistance. Further, SEM fractographs and crack morphology have also been analyzed to evaluate the SCC behaviour of the alloy tempers.

Grain Boundary Responses to Local and Applied Stress: An In Situ TEM Deformation Study

2006 ◽  
Vol 976 ◽  
Author(s):  
Bryan Miller ◽  
Jamey Fenske ◽  
Dong Su ◽  
Chung-Ming Li ◽  
Lisa Dougherty ◽  
...  
Keyword(s):  
Electron Microscope ◽  
Grain Boundary ◽  
Grain Boundaries ◽  
Grain Growth ◽  
Transmission Electron Microscope ◽  
In Situ Tem ◽  
Deformation Twins ◽  
Transmission Electron ◽  
Dislocation Interactions

AbstractDeformation experiments at temperatures between 300 and 750 K have been performed in situ in the transmission electron microscope to investigate dislocation interactions and reactions with grain boundaries and other obstacles. Dislocations, both partial and perfect, as well as deformation twins have been observed being emitted from grain boundaries and, in some cases, even the same grain boundary. The ejection of dislocations from the grain boundary can result in its partial or total annihilation. In the latter case, the disintegration of the grain boundary was accompanied by grain growth and a change in misorientation.

Dislocation–grain boundary interactions in martensitic steel observed through in situ nanoindentation in a transmission electron microscope

2004 ◽  
Vol 19 (12) ◽  
pp. 3626-3632 ◽  
Author(s):  
T. Ohmura ◽  
A.M. Minor ◽  
E.A. Stach ◽  
J.W. Morris
Keyword(s):  
Electron Microscope ◽  
Grain Boundary ◽  
Transmission Electron Microscope ◽  
Critical Stress ◽  
Martensitic Steel ◽  
High Angle ◽  
Block Boundary ◽  
Density Of Dislocations ◽  
Transmission Electron

Dislocation–interface interactions in Fe–0.4 wt% C tempered martensitic steel were studied through in situ nanoindentation in a transmission electron microscope (TEM). Two types of boundaries were imaged in the dislocated martensitic structure: a low-angle (probable) lath boundary and a coherent, high-angle (probable) block boundary. In the case of a low-angle grain boundary, the dislocations induced by the indenter piled up against the boundary. As the indenter penetrated further, a critical stress appeared to have been reached, and a high density of dislocations was suddenly emitted on the far side of the grain boundary into the adjacent grain. In the case of the high-angle grain boundary, the numerous dislocations that were produced by the indentation were simply absorbed into the boundary, with no indication of pileup or the transmission of strain. This surprising observation is interpreted on the basis of the crystallography of the block boundary.

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