Effect of Thermal Equilibration on Dark- and Photo-Conductivities in Undoped Amorphous Silicon-Germanium Alloys

1990 ◽  
Vol 192 ◽  
Author(s):  
J. Z. Liu ◽  
D. S. Shen ◽  
P. Roca i Cabarrocas ◽  
H. Park ◽  
S. Wagner
Keyword(s):  
Silicon Germanium ◽  
Lower Energy ◽  
Annealing Temperature ◽  
Equilibrium Configuration ◽  
Dark Conductivity ◽  
Defect States ◽  
Optical Gap ◽  
Thermal Equilibration ◽  
Amorphous Silicon Germanium ◽  
Subsequent Quenching

ABSTRACTWe report the effect of thermal equilibration on the dark- and photo- conductivities of an un-doped a-Si,Ge:H,F with optical gap of 1.47 eV. Annealing at high temperature and subsequent quenching can freeze in the equilibrium configuration at the annealing temperature. The characteristic glass-like transition behavior of the conductivities was observed and used to estimate a freeze-in temperature of about 140°C. As the annealing temperature increases above the freeze-in temperature, the frozen-in dark- and photo- conductivities decrease, the photo- to dark- conductivity ratio increases, and the photoconductivity-generation rate exponent increases. These changes in conductivities are explained by a model calculation, which assumes that the quenching introduces new defect states to die lower energy flanks of the Gaussian defect distributions.

Investigations of Tail and Defect States in a-Si0.6Ge0.4:H Alloys by PDS and ESR - Implications for the Interaction of Weak and Dangling Bonds

1995 ◽  
Vol 377 ◽  
Author(s):  
Tilo P. Drüsedau ◽  
Andreas N. Panckow ◽  
Bernd Schröder
Keyword(s):  
Silicon Germanium ◽  
Defect Density ◽  
State Density ◽  
Model Parameters ◽  
Defect States ◽  
Conversion Model ◽  
Order Of Magnitude ◽  
Underlying Mechanisms ◽  
Amorphous Silicon Germanium ◽  
Excess Absorption

ABSTRACTInvestigations on the gap state density were performed on a variety of samples of hydrogenated amorphous silicon germanium alloys (Ge fraction around 40 at%) containing different amounts of hydrogen. From subgap absorption measurements the values of the “integrated excess absorption” and the “defect absorption” were determined. Using a calibration constant, which is well established for the determination of the defect density from the integrated excess absorption of a-Si:H and a-Ge:H, it was found that the defect density is underestimated by nearly one order of magnitude. The underlying mechanisms for this discrepancy are discussed. The calibration constants for the present alloys are determined to 8.3×1016 eV−1 cnr2 and 1.7×1016 cm−2 for the excess and defect absorption, respectively. The defect density of the films was found to depend on the Urbach energy according to the law derived from Stutzmann's dangling bond - weak bond conversion model for a-Si:H. However, the model parameters - the density of states at the onset of the exponential tails N*=27×1020 eV−1 cm−3 and the position of the demarcation energy Edb-E*=0.1 eV are considerably smaller than in a-Si:H.

The Density of States in Undoped and Doped Amorphous Silicon-Germanium Alloys Determined through Photoyield Spectroscopy

1989 ◽  
Vol 149 ◽  
Author(s):  
S. Aljishi ◽  
Jin Shu ◽  
L. Ley
Keyword(s):  
Valence Band ◽  
Density Of States ◽  
Relative Position ◽  
Silicon Germanium ◽  
Lower Energy ◽  
Composition Range ◽  
Significant Shift ◽  
Band Tail ◽  
Defect Band ◽  
Amorphous Silicon Germanium

ABSTRACTPhotoelectron yield spectroscopy is used to study the occupied density of states (DOS) in undoped and doped a-Si, Ge:H alloys. We find a shift in the top of the valence band to lower energy as the Ge content is increased. The width of the defect band becomes abruptly narrower when Ge is initially introduced. This change is accompanied by a significant shift in the relative position of the Fermi level towards midgap. The defect peak tracks the valence band throughout the entire composition range. The intrinsic valence band tail in the alloys is found to be an exponential with a characteristic slope of 50 to 60 meV independent of composition. Boron and phosphorous doping affect the DOS of the alloys in a manner similar to that measured in a-Si:H.

Effect of Ge Incorporation on Hydrogenated Amorphous Silicon Germanium Thin Films Prepared by Plasma Enhanced Chemical Vapor Deposition

2012 ◽  
Vol 569 ◽  
pp. 27-30
Author(s):  
Bao Jun Yan ◽  
Lei Zhao ◽  
Ben Ding Zhao ◽  
Jing Wei Chen ◽  
Hong Wei Diao ◽  
...  
Keyword(s):  
Thin Films ◽  
Chemical Vapor Deposition ◽  
Amorphous Silicon ◽  
Vapor Deposition ◽  
Silicon Germanium ◽  
Hydrogenated Amorphous Silicon ◽  
Chemical Vapor ◽  
Dark Conductivity ◽  
Amorphous Silicon Germanium ◽  
Hydrogenated Amorphous

Hydrogenated amorphous silicon germanium thin films (a-SiGe:H) were prepared via plasma enhanced chemical vapor deposition (PECVD). By adjusting the flow rate of GeH4, a-SiGe:H thin films with narrow bandgap (Eg) were fabricated with high Ge incorporation. It was found that although narrow Eg was obtained, high Ge incorporation resulted in a great reduction of the thin film photosensitivity. This degradation was attributed to the increase of polysilane-(SiH2)n, which indicated a loose and disordered microstructure, in the films by systematically investigating the optical, optoelectronic and microstructure properties of the prepared a-SiGe:H thin films via transmission, photo/dark conductivity, Raman spectroscopy, and Fourier transform infrared spectroscopy (FTIR) measurements. Such investigation provided a helpful guide for further preparing narrow Eg a-SiGe:H materials with good optoelectronic properties.

Properties of amorphous silicon-germanium films and devices deposited at higher growth rates

2002 ◽  
Vol 715 ◽  
Author(s):  
Yong Liu ◽  
Vikram L. Dalal
Keyword(s):  
Amorphous Silicon ◽  
Growth Rates ◽  
Silicon Germanium ◽  
Urbach Energy ◽  
Dark Conductivity ◽  
Film Properties ◽  
Ecr Plasma ◽  
Device Properties ◽  
Amorphous Silicon Germanium ◽  
Defect Densities

AbstractWe report on the growth and properties of amorphous Silicon-Germanium [a–(Si,Ge):H] films and devices fabricated at growth rates of ∼ 5 Å/sec using a remote ECR plasma growth process. The films and devices were made using mixtures of germane and silane along with dilution with hydrogen and helium. The addition of He to the gas mixture significantly increased the growth rates. It was found that hydrogen was always necessary in order to achieve the best film and device properties. Films and devices were made across the entire bandgap range, from a-Si to a-Ge. High ratios of photo/dark conductivity and low values of Urbach energy ( > 50 meV) indicate good film properties. The defect densities were measured using space charge limited current techniques. The defect densities were in the range of 1-2 x 10 16/cm 3 –eV, about 5 times higher than for a-Si:H. Electron mobility-lifetime products were measured and found to be in the range of 2-4 x 10-7 cm2/V, even for low gap materials (1.35 eV). Single and graded gap devices were fabricated in these materials. Device fill factors of ∼ 70% were obtained in graded gap devices.

Optical and electronic properties of an amorphous silicon‐germanium alloy with a 1.28 eV optical gap

1988 ◽  
Vol 52 (6) ◽  
pp. 477-479 ◽  
Author(s):  
J. Kolodzey ◽  
R. Schwarz ◽  
S. Aljishi ◽  
V. Chu ◽  
D.‐S. Shen ◽  
...  
Keyword(s):  
Amorphous Silicon ◽  
Electronic Properties ◽  
Silicon Germanium ◽  
Optical Gap ◽  
Optical And Electronic Properties ◽  
Germanium Alloy ◽  
Amorphous Silicon Germanium

Optoelectronic Properties of Amorphous SiGec Alloys

1992 ◽  
Vol 258 ◽  
Author(s):  
J. Kolodzey ◽  
R. Schwarz ◽  
F. Wang ◽  
T. Muschik ◽  
J. Krajewski ◽  
...  
Keyword(s):  
Silicon Germanium ◽  
Plasma Deposition ◽  
Optical Gap ◽  
Random Alloy ◽  
Amorphous Si ◽  
Silicon Germanium Carbon ◽  
Amorphous Silicon Germanium ◽  
Hydrogenated Amorphous ◽  
Average Bond ◽  
Defect Densities

ABSTRACTWe describe the optoelectronic characteristics of hydrogenated amorphous silicon germanium carbon (a.Si1-x-yGexCy:H) alloys prepared by plasma deposition from SiH4/GeH4/CH4/H2 gas mixtures. a-Si1-x-yGexCy:H is a homogeneous random alloy having a variable optical gap depending on composition, with properties similar to those of amorphous Si-Ge alloys of the same optical gap but with improved thermal stability. Calculations show that if the ratio of Ge/C atomic fractions is 8.2, the average bond length matches that of unalloyed amorphous a-Si:H with the possibility of reduced defect densities at heterointerfaces. After light-soaking with high intensity white light, a sample having a 1.3 eV optical gap exhibited no Staebler-Wronski change in its properties.

Influence of Filament and Substrate Temperatures on Structural and Optoelectronic Properties of Narrow Gap a-SiGe:H Alloys Deposited by Hot-Wire CVD

2003 ◽  
Vol 762 ◽  
Author(s):  
Yueqin Xu ◽  
Brent P. Nelson ◽  
D.L. Williamson ◽  
Lynn M. Gedvilas ◽  
Robert C. Reedy
Keyword(s):  
Hydrogen Content ◽  
Silicon Germanium ◽  
Chemical Vapor ◽  
Dark Conductivity ◽  
Hot Wire ◽  
Standard Temperature ◽  
X Ray Scattering ◽  
Deposition Parameters ◽  
Amorphous Silicon Germanium ◽  
Structural And Optoelectronic Properties

AbstractWe have found that narrow-bandgap—1.25 < Tauc Gap < 1.50 eV—amorphous silicon germanium (a-SiGe:H) alloys grown by hot-wire chemical vapor deposition (hot-wire CVD) can be improved by lowering both substrate and filament temperatures. We systematically study films deposited using a one-tungsten filament, decreasing filament temperature (Tf) from our standard temperature of 2150° down to 1750°C, and fixing all other deposition parameters. By decreasing Tfat the fixed substrate temperature (Ts) of 180°C, the Ge-H bonding increases, whereas the Si-H2bonding is eliminated. Films with higher Ge-H bonding and less Si-H2have improved photoconductivity. For the series of films deposited using the same germane gas fraction at 35%, the energy where the optical absorption is 1x104(E04) drops from 1.54 to 1.41 eV with decreasing Tf. This is mainly due to the combination of an increasing Ge solid fraction (x) in the film, and an improved homogeneity and compactness due to significant reduction of microvoids, which was confirmed by small angle X-ray scattering (SAXS). We also studied a series of films grown by decreasing the Tsfrom our previous standard temperature of 350°C down to 125°C, fixing all other deposition parameters including Tfat 1800°C. By decreasing Ts, both the total hydrogen content (CH) and the Ge-H bonding increased, but the Si-H2bonding is not measurable in the Tsrange of 180°-300°C. The E04 increases from 1.40 to 1.51 eV as Tsdecreased from 350° to 125°C, mainly due to the increased total hydrogen content (CH). At the same time, the photo-to-dark conductivity ratio increases almost three orders of magnitude over this range of Ts.

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