In-Situ Fabrication and Process Control Techniques in Rapid Thermal Processing

1991 ◽  
Vol 224 ◽  
Author(s):  
Mehrdad M. Moslehi ◽  
John Kuehne ◽  
Richard Yeakley ◽  
Lino Velo ◽  
Habib Najm ◽  
...  

AbstractAdvanced rapid thermal processing (RTP) equipment and sensors have been developed for in-situ fabrication of semiconductor devices. High-performance multi-zone lamp modules have been applied to various processes including rapid thermal oxidation (RTO), chemicalvapor deposition (CVD) of tungsten and amorphous/polycrystalline silicon, silicide formation, as well as high-temperature rapid thermal annealing (RTA). Concurrent use of multizone lamps and multi-point temperature sensors allows real-time wafer temperature control and process uniformity optimization. Specific experimental results will be presented on the multi-zone lamp modules, in-situ process control sensors, and single-wafer fabrication processes.

1993 ◽  
Vol 29 (25) ◽  
pp. 2178 ◽  
Author(s):  
T. Hayashi ◽  
Y. Kawazu ◽  
H. Fukuda ◽  
T. Iwabuchi

1996 ◽  
Vol 429 ◽  
Author(s):  
Tony Speranza ◽  
Terry Riley ◽  
Arun Nanda ◽  
Burt Fowler ◽  
Kenneth Torres ◽  
...  

AbstractThis paper discusses various commercial aspects of Rapid Thermal Processing (RTP). It provides an overview of SEMATECH's efforts to improve the manufacturing viability of RTP. Over the past several years SEMATECH, a U.S. Government/Industry consortium, has identified thermal equipment and processing needs relating to semiconductor manufacturing. It has aggressively pursued solutions to these needs through specific equipment projects. These projects include: RTP Installed Base Productivity Improvement, 0.25um RTP Tool Development, and RTP Modeling and Component Technology. Also discussed are several thermal projects which focus on the performance of more traditional tools. A comparison between RTP and a vertical furnace with model based process control and a small batch fast ramp furnace is made. A brief discussion of an RTP gate stack cluster tool project is followed by a review of future thermal processing needs, including 300mm.


2019 ◽  
Vol 4 (46) ◽  
pp. 13569-13575
Author(s):  
Zhimiao Li ◽  
Yunlong Xu ◽  
Yue Chen ◽  
Wei Zhang ◽  
Keqiang Li ◽  
...  

2019 ◽  
Vol 787 ◽  
pp. 1110-1119 ◽  
Author(s):  
Jianan Wang ◽  
Guorui Yang ◽  
Ling Wang ◽  
Silan Wang ◽  
Wei Yan ◽  
...  

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