Large Grain Creation and Destruction in Excimer Laser Crystallized Amorphous Silicon

1993 ◽  
Vol 321 ◽  
Author(s):  
J. B. Boyce ◽  
G. B. Anderson ◽  
D. K. Fork ◽  
R. I. Johnson ◽  
P. Mei ◽  
...  
Keyword(s):  
Grain Size ◽  
Excimer Laser ◽  
Laser Fluence ◽  
Laser Energy ◽  
Laser Crystallization ◽  
X Ray Scattering ◽  
Maximum Value ◽  
Nucleation Sites ◽  
Average Grain Size ◽  
Similar Peak

ABSTRACTFor fast-pulse laser-crystallized thin-film Si on non-crystalline substrates, the average grain size exhibits a peak as a function excimer laser energy density at a characteristic laserfluence FM. The average grain size increases with increasing laser fluence and can reach a maximum value on the order of 10 pm or about 100 times the film thickness. The grain size then decreases with further increases in fluence. This peak in grain size is accompanied by a similar peak in the Hall electron mobility and x-ray scattering intensity. Our experiments have investigated as-deposited and ion-implanted samples, using a double-scan laser crystallization process. Devices have also been fabricated and studied. The results are consistent with the increase in grain size occurring because of the destruction of nucleation sites with increasing laser fluence (i.e., increased heating and complete Melting). But substrate damage occurs in the vicinity of FM, creating nucleation sites which give rise to small grain sizes in the solidified film. The disruption of the interface causes substantial current leakage through the dielectric of bottom-gate transistors, implying that devices should be laser fabricated below Fm.

Characterization of the Substrate Interface of Excimer Laser Crystallized Polycrystalline Silicon Thin Films

1994 ◽  
Vol 343 ◽  
Author(s):  
G. B. Anderson ◽  
J. B. Boyce ◽  
D. K. Fork ◽  
R. I. Johnson ◽  
P. Mei ◽  
...  
Keyword(s):  
Thin Films ◽  
Grain Size ◽  
Energy Range ◽  
Excimer Laser ◽  
Laser Fluence ◽  
Laser Energy ◽  
Substrate Surface ◽  
Fused Silica ◽  
Silica Substrate ◽  
Average Grain Size

ABSTRACTExcimer laser crystallized Si thin films on fused silica substrates exhibit a peak in the average grain size as a function of laser energy density. The average grain size increases with increasing laser fluence until a maximum value , approximately 10 microns for a 100 nm thick Si film, is achieved. The peak in grain size is accompanied by a peak in the electron Hall mobility. Further increases in the laser fluence result in a decrease in the Si grain size and an increase in the intragranular defects. A small energy range of 40 mJ/cm2 exists in which this peak in grain size can be achieved. Cross section TEM has shown that when the peak laser fluence is exceeded, the fused silica substrate can be as rough as 17 nm. Atomic force microscopy. performed on the substrate surface after the Si has been etched off, also shows that the magnitude and spatial frequency of the roughness increases when the critical laser fluence is exceeded. This degradation of the interface may also produce sites for stacking faults to form during the solidification of the Si. This result and results of simulations of the temperature of the interface during crystallization suggests that the peak energy range exists after the complete melting of the Si thin film and before the silica substrate starts to soften.

Pulse-Laser-Crystallization of Amorphous Nd3.7Pr3.4Dy0.9Fe86B5Nb1

2011 ◽  
Vol 217-218 ◽  
pp. 1693-1695
Author(s):  
Jia Jun Guo ◽  
Zhong Wei Wang ◽  
Jian Zhang ◽  
Xu Zhao ◽  
Wei Chen
Keyword(s):  
Grain Size ◽  
Magnetic Materials ◽  
Excimer Laser ◽  
Pulse Laser ◽  
Laser Crystallization ◽  
Amorphous Ribbons ◽  
Pulse Excimer Laser ◽  
Average Grain Size

The pulse-laser-crystallization (PLC) technique was applied to Nd3.7Pr3.4Dy0.9Fe86B5Nb1 amorphous ribbons. After irradiation with a 248nm KrF pulse excimer laser at a fequency of 15Hz for 1 min, the Nd3.7Pr3.4Dy0.9Fe86B5Nb1 amorphous ribbons crystallized into the homogeneous Nd2Fe14B/α-Fe nanocomposite permanent magnetic materials with an average grain size around 26nm. The obtained coercivity, remanence, and (BH)max values were 6.6 K, 1.23 T, and 18.5 MGOe, respectively.

Laser Crystallized Polysilicon Thin Films and Applications

1995 ◽  
Vol 403 ◽  
Author(s):  
J. B. Boyce ◽  
P. Mei ◽  
D. K. Fork ◽  
G. B. Anderson ◽  
R. I. Johnson
Keyword(s):  
Grain Size ◽  
Amorphous Silicon ◽  
Grain Growth ◽  
Excimer Laser ◽  
Laser Fluence ◽  
Polycrystalline Silicon ◽  
Grain Structure ◽  
Large Area ◽  
Materials Properties ◽  
Average Grain Size

AbstractPulsed excimer-laser crystallization of amorphous silicon on non-crystalline substrates is an important processing technique for large-area polycrystalline silicon films and devices. Interest stems, in large part, from proposals to use polycrystalline silicon on glass in large-area electronic applications, such as flat-panel active matrix displays and two-dimensional imaging systems. The polycrystalline silicon is envisioned to increase the functionality and reduce costs over the current circuits that use amorphous silicon. Also, it is found that laser-crystallized polycrystalline silicon exhibits some interesting materials properties, such as a sharp peak in the average grain size with large lateral grain growth as a function of excimer laser energy density. The average grain size increases with increasing laser fluence and peaks on the order of several microns or two orders of magnitude larger than the film thickness. The grain size then decreases with further increases in laser fluence. This peak in grain size is accompanied by a similar peak in the Hall electron mobility. This is a significant relationship for devices since the grain structure has a substantial influence on electrical properties. But to the detriment of device parameters, this large lateral grain growth occurs over a very arrow range of laser fluences and is accompanied by a corresponding peak in the surface roughness of the films. These relationships between laser processing conditions, materials properties, and device parameters force a compromise between large grain size for high mobility and homogeneity of material for uniformity of device characteristics. A window does exist in process parameter space where good-quality devices with uniform characteristics have been obtained. In addition, these attributes have been achieved under conditions that yield good polycrystalline silicon and good amorphous silicon devices on the same wafer within a mm of one another, allowing for hybrid polycrystalline and amorphous silicon circuits.

A New Double Laser Recrystallization Technique to Induce Ultra-Large Poly-Si Grains

2001 ◽  
Vol 685 ◽  
Author(s):  
Minghong Lee ◽  
Seungjae Moon ◽  
Mutsuko Hatano ◽  
Costas P. Grigoropoulos
Keyword(s):  
Grain Growth ◽  
Excimer Laser ◽  
Laser Fluence ◽  
Laser Power ◽  
Laser Flash ◽  
Process Window ◽  
Nanosecond Laser ◽  
Solidification Velocity ◽  
Laser Recrystallization ◽  
Nucleation Sites

AbstractA new double laser recrystallization technique that can produce lateral grains of tens of micrometers is presented. A nanosecond laser (excimer or Nd:YLF laser) and a pulse modulated Ar+ laser are used in the experiment. The effect of different parameters on lateral grain growth is investigated. These parameters include the time delay between the two lasers, the excimer laser fluence, the Ar+ laser power and the pulse duration. This process has wide process window and is insensitive to both the excimer laser fluence and the Ar+ laser power fluctuations. Preheating and melting of the a-Si film with the Ar+ laser before firing the excimer laser is found to be necessary for inducting lateral grain growth. The transient excimer laser irradiation is believed to generate nucleation sites for initiating the subsequent lateral grain growth. The solidification dynamics of the process is probed by high spatial and temporal resolution laser flash photography. A lateral solidification velocity of about 10 m/s is observed.

Critical Laser Fluence Observed in (111) Texture, Grain Size and Mobility of Laser Crystallized Amorphous Silicon

1993 ◽  
Vol 297 ◽  
Author(s):  
R.I. Johnson ◽  
G.B. Anderson ◽  
J.B. Boyce ◽  
D.K. Fork ◽  
P. Mei ◽  
...  
Keyword(s):  
Grain Size ◽  
Film Thickness ◽  
Substrate Temperature ◽  
Amorphous Silicon ◽  
Laser Fluence ◽  
Laser Energy ◽  
X Ray ◽  
Peak Intensity ◽  
Silicon Materials ◽  
The Relationship

This paper describes new results on the relationship between the grain size, mobility, and Si (111) x-ray peak intensity of laser crystallized amorphous silicon as a function of the laser fluence, shot density, substrate temperature, and film thickness. These observations include an unexpected narrow peak found in the silicon (111) x- ray peak intensity, which occurs at a specific laser fluence for a given film thickness and substrate temperature. Amorphous silicon materials processed at laser energy densities defined by this peak exhibit exceptionally large grain sizes and electron mobilities that cannot be obtained at any other energy and shot density combination above or below the energy at which the Si (111) x-ray peak intensity maximum occurs.

Considerations for Large Area Fabrication of Integrated a-Si and Poly-Si TFTs

1994 ◽  
Vol 336 ◽  
Author(s):  
P. Mei ◽  
G. B. Anderson ◽  
J. B. Boyce ◽  
D. K. Fork ◽  
M. Hack ◽  
...  
Keyword(s):  
Grain Size ◽  
Energy Density ◽  
Laser Energy ◽  
Gate Insulator ◽  
Laser Energy Density ◽  
Laser Crystallization ◽  
Large Area ◽  
Low Leakage ◽  
Threshold Voltages ◽  
Excellent Method

ABSTRACTThe combination of a-Si low leakage pixel TFTs with poly-Si TFTs in peripheral circuits provides an excellent method for reducing the number of external connections to large-area imaging arrays and displays. To integrate the fabrication of the peripheral poly-Si TFTs with the a-Si pixel TFTs, we have developed a three-step laser process which enables selective crystallization of PECVD a-Si:H. X-ray diffraction and transmission electron microscopy show that the polycrystalline grains formed with this three-step process are similar to those crystallized by a conventional one step laser crystallization of unhydrogenated amorphous silicon. The grain size increases with increasing laser energy density up to a peak value of a few Microns. The grain size decreases with further increases in laser energy density. The transistor field effect mobility is correlated with the grain size, increasing gradually with laser energy density until reaching its maximum value. Thereafter, the transistors suffer from leakage through the gate insulators. A dual dielectric gate insulator has been developed for these bottom-gate thin film transistors to provide the correct threshold voltages for both a-Si and poly-Si TFTs.

Excimer Lasbr Induced Crystallization of thin Amorphous Si Films on SiO2: Implications of Crystallized Microstructures for Phase Transformation Mechanisms

1992 ◽  
Vol 283 ◽  
Author(s):  
H. J. Kim ◽  
James S. Im ◽  
Michael O. Thompson
Keyword(s):  
Grain Size ◽  
Energy Density ◽  
Laser Energy ◽  
High Energy ◽  
High Energy Density ◽  
Laser Energy Density ◽  
Single Shot ◽  
Average Grain Size ◽  
Si Films ◽  
Density Regime

ABSTRACTUsing planar view transmission electron microscope (TEM) and transient reflectance (TR) analyses, we have investigated the excimer laser crystallization of amorphous silicon (a-Si) films on SiO2. Emphasis was placed on characterizing the microstructures of the single-shot irradiated materials, as a function of the energy density of the laser pulse and the temperature of the substrate. The dependence of the grain size and melt duration as a function of energy density revealed two major crystallization regimes. In the low energy density regime, the average grain size first increases gradually with increases in the laser energy density. In the high energy density regime, on the other hand, a very fine grained microstructure, which is relatively insensitive to variations in the laser energy density, is obtained. In addition, we have discovered that at the transition between these two regimes an extremely small experimental window exists, within which an exceedingly large grain-sized polycrystalline film is obtained. We suggest a liquid phase growth model for this phenomenon, which is based on the regrowth of crystals from the residual solid islands at the oxide interface.

Excimer Laser Crystallized Amorphous Silicon Films: Effects of Shot Density and Substrate Temperature

1991 ◽  
Vol 219 ◽  
Author(s):  
R. I. Johnson ◽  
G. B. Anderson ◽  
S. E. Ready ◽  
J. B. Boyce
Keyword(s):  
Energy Density ◽  
Substrate Temperature ◽  
Amorphous Silicon ◽  
Laser Energy ◽  
Silicon Films ◽  
Laser Energy Density ◽  
Laser Crystallization ◽  
Average Grain Size ◽  
Substrate Temperatures

ABSTRACTLaser crystallization of a-Si thin films has been shown to produce materials with enhanced electrical properties and devices that are faster and capable of carrying higher currents. The quality of these polycrystalline films depends on a number of parameters such as laser energy density, shot density, substrate temperature, and the quality of the starting material. We find that the average grain size and transport properties of laser crystallized amorphous silicon films increase substantially with laser energy density, increase only slightly with laser shot density, and are unaffected by substrate temperatures of up to 400°C. The best films are those processed in vacuum but films of fair quality can also be obtained in air and nitrogen atmospheres.

A Novel Two-Pass Excimer Laser Crystallization Process to Obtain Homogeneous Large Grain Polysilicon

1999 ◽  
Vol 558 ◽  
Author(s):  
L. Mariucci ◽  
R. Carluccio ◽  
A. Pecora ◽  
V. Foglietti ◽  
G. Fortunato ◽  
...  
Keyword(s):  
Excimer Laser ◽  
Crystallization Process ◽  
Laser Energy ◽  
Spatial Modulation ◽  
Lateral Growth ◽  
Laser Crystallization ◽  
First Pass ◽  
Wide Energy ◽  
Excimer Laser Crystallization ◽  
Polysilicon Tft

ABSTRACTNew approach to control the lateral growth mechanism through the opportune spatial modulation of the absorbed laser energy and with a two-pass excimer laser crystallization process is presented. In the first pass, spatial modulation of the light intensity has been obtained by irradiating the sample through a patterned mask in contact with the sample. Lateral growth is triggered when the irradiated regions are fully melted and a lateral extension of the grains in excess to 1 μm has been observed for samples irradiated at RT. In order to homogeneously crystallize the sample, the film can be re-irradiated (second pass) without the mask. By using opportune energy densities it can be induced a complete melting of the residual a-Si regions (masked areas during the first pass), while partially melting the polysilicon regions (unmasked areas during the first pass). Different mask geometries have been investigated and for optimized conditions, the sample area can be fully covered with laterally grown grains. The proposed novel technique can be rather attractive for polysilicon TFT fabrication, being characterized by only a two laser-shot process and wide energy density windows.

Lateral Grain Growth in the Excimer Laser Crystallization of Poly-Si

1994 ◽  
Vol 321 ◽  
Author(s):  
H. Kuriyama ◽  
K. Sano ◽  
S. Ishida ◽  
T. Nohda ◽  
Y. Aya ◽  
...  
Keyword(s):  
Grain Size ◽  
Excimer Laser ◽  
Laser Annealing ◽  
Field Effect Mobility ◽  
Laser Crystallization ◽  
Excimer Laser Annealing ◽  
Short Processing Time ◽  
Low Temperature Processing ◽  
Excimer Laser Crystallization ◽  
Annealing Method

ABSTRACTWe have succeeded in obtaining nondoped, thin poly-Si film (thickness ∼500Å) with excellent crystallinity and large grain size (Maximum grain size ∼4.5 μ m) by an excimer laser annealing Method, which offers the features of low-temperature processing and a short processing time. The grain size distribution shrinks in the region around 1.5 μ m and this poly-Si film exhibits a strong (111) crystallographic orientation. Poly-Si thin film transistors using these films show quite a high field effect mobility of 440cm2/V · s below 600°C process.

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