Electrical Characterization of Al2O3 - SiO2 Mos Structures

1999 ◽  
Vol 567 ◽  
Author(s):  
L-Å Ragnarsson ◽  
E. Aderstedt ◽  
P. Lundgren
Keyword(s):  
Electrical Characterization ◽  
Thickness Reduction ◽  
Initial Thickness ◽  
Equivalent Thickness ◽  
Conventional Furnace ◽  
Capacitance Voltage ◽  
Layered Dielectric ◽  
The Impact ◽  
Mos Structures

ABSTRACTA comparative capacitance voltage method is used to investigate the equivalent thickness reduction during post metallization annealing of thermally grown ultrathin (∼15-27 Å) oxides. It is found that a double layered dielectric consisting of a thin Al2O3—SiO2 sandwich is appropriate to describe both the increased capacitance and the nearly unaltered current after anneal. It is further shown that the impact of initial thickness and method of growth — in a conventional furnace or by rapid thermal oxidation — on the equivalent thickness reduction is negligible.

Probing at Nanoscale Underneath the Gate Oxides in 4H-SiC MOS-Based Devices Annealed in N2O and POCl3

2014 ◽  
Vol 806 ◽  
pp. 143-147
Author(s):  
P. Fiorenza ◽  
Marilena Vivona ◽  
L.K. Swanson ◽  
Filippo Giannazzo ◽  
C. Bongiorno ◽  
...  
Keyword(s):  
Electrical Characterization ◽  
Cross Sectional ◽  
Direct Demonstration ◽  
Current Voltage ◽  
Capacitance Voltage ◽  
N Incorporation ◽  
The Impact ◽  
Post Deposition ◽  
Partial Compensation

In this paper a comparative study of the impact of N2O and POCl3 annealing on the SiO2/SiC system is presented, combining nanoscale electrical characterization of SiC surface doping by scanning spreading resistance microscopy (SSRM) and scanning capacitance microscopy (SCM) to the conventional capacitance-voltage (C-V) and current-voltage (I-V) measurements on MOS-based devices. A significant reduction of the interface states density (from 1.8×1012 to 5.7×1011 cm-2eV-1) and, correspondingly, an increase in the carrier mobility (from 19 to 108 cm2V-1s-1) was found moving from N2O to POCl3 annealing. Furthermore, SSRM measurements on bare p+-type SiC regions selectively exposed to N2O and POCl3 at high temperature provided the direct demonstration of the incorporation of N or P-related donors in the SiC surface, leading to a partial compensation of substrate acceptors during N2O treatment and to an overcompensation during POCl3 annealing. Finally, cross-sectional SCM profiles performed on epitaxial n-doped 4H-SiC with 45 nm SiO2 (subjected to post deposition annealing in the two ambients) allowed to quantify the active donors concentrations associated to P or N incorporation under the gate oxide, showing almost a factor of ten higher doping (4.5×1018cm-3 vs 5×1017cm-3) in the case of P related donors.

Process and Simulation of TiSi2/n+/p Silicon Shallow Junctions

1991 ◽  
Vol 235 ◽  
Author(s):  
Ying Wu ◽  
W. Savin ◽  
T. Fink ◽  
N. M. Ravindra ◽  
R. T. Lareau ◽  
...  
Keyword(s):  
Electrical Characterization ◽  
Furnace Annealing ◽  
Si Substrates ◽  
Conventional Furnace ◽  
Mass Spec ◽  
Current Voltage ◽  
Shallow Junctions ◽  
Current Voltage Characteristics ◽  
Secondary Ion

ABSTRACTExperimental analysis and simulation of the formation and electrical characterization of TiSi2/+/p-Si shallow junctions are presented here. The formation of shallow n+-p junction, by ion implantation of As through Ti films evaporated on p-Si substrates followed by Rapid Thermal Annealing (RTA) and conventional furnace annealing has been performed in these experiments. Structural techniques such as Secondary Ion Mass Spec-troscopy (SIMS) and Rutherford Backscattering (RBS) experiments have been employed to characterize these devices. RUMP simulations were used to analyze and interpret the RBS data. Current-voltage characteristics have been simulated using PISCES simulator.

Electrical Characterization of E7 Liquid Crystal Molecules under the Impact of an External Electric Field (THz): A Theoretical approach

2020 ◽  
Vol 15 (2) ◽  
pp. 95-101
Keyword(s):  
Liquid Crystal ◽  
Electric Field ◽  
Order Parameter ◽  
Optical Switching ◽  
Rapid Change ◽  
Electrical Characterization ◽  
Optical Switching Devices ◽  
The Impact ◽  
Orientation Of Molecules

In this work, different parameters of E7 liquid crystal (LC) have been calculated under the influence of an electric field in THz frequency. The E7 LC parameters have positive as well as negative values of order parameter and birefringence under the influence for an electric field. The director angle of E7 LC shows fast fluctuations above the angle θ=45° and due to rapid change in the orientation of molecules, fast electro-optical switching devices based on E7 LC can be designed. The refractive index of the E7 LC maintains stability in THz frequency.

Electrical Characterization of In Schottky Contacts to Epitaxial n-In0.46Ga0.54P Grown on n+-GaAs by Mocvd

1996 ◽  
Vol 448 ◽  
Author(s):  
N. Marcano ◽  
A. Singh
Keyword(s):  
Barrier Height ◽  
Thermionic Emission ◽  
Electrical Characterization ◽  
Interface Layer ◽  
Zero Bias ◽  
Current Voltage ◽  
Capacitance Voltage ◽  
Direct Current Voltage ◽  
Etched Surface

AbstractIn/n-In0.46Ga0.54P Schottky diode was fabricated by thermal evaporation of In on chemically etched surface of In0.45Ga0.54P:Si epitaxial layer grown on highly doped n type GaAs. The In metal formed a high quality rectifying contact to In0.46Ga0.54P:Si with a rectification ratio of 500. The direct current-voltage/temperature (I-V/T) characteristics were non-ideal with the values of the ideality factor (n) between 1.26-1.78 for 400>T>260 K. The forward I-V data strongly indicated that the current was controlled by the generation-recombination (GR) and thermionic emission (TE) mechanisms for temperature in the range 260-400 K. From the temperature variation of the TE reverse saturation current, the values of (0.75±0.05)V and the (4.5±0.5)×10-5 Acm-2K-2 for the zero bias zero temperature barrier height (φoo) and modified effective Richardson constant were obtained. The 1 MHz capacitance-voltage (C-V) data for 260 K < T < 400 K was analyzed in terms of the C-2-V relation including the effect of interface layer to obtain more realistic values of the barrier height (φbo). The temperature dependence of φbo was described the relation φbo =(0.86±10.03) - (8.4±0.7)×l0-4T. The values of φoo, obtained by the I-V and C-V techniques agreed well.

Characterization of SiC MOS Structures using Conductance Spectroscopy and Capacitance Voltage Analysis

2000 ◽  
Vol 338-342 ◽  
pp. 1117-1120 ◽  
Author(s):  
Einar Ö. Sveinbjörnsson ◽  
M. Ahnoff ◽  
H.Ö. Ólafsson
Keyword(s):  
Capacitance Voltage ◽  
Mos Structures

Temperature and frequency dependent electrical characterization of HfO2/InxGa1−xAs interfaces using capacitance-voltage and conductance methods

2009 ◽  
Vol 94 (10) ◽  
pp. 102902 ◽  
Author(s):  
É. O’Connor ◽  
S. Monaghan ◽  
R. D. Long ◽  
A. O’Mahony ◽  
I. M. Povey ◽  
...  
Keyword(s):  
Electrical Characterization ◽  
Frequency Dependent ◽  
Capacitance Voltage

Metal-Ferroelectric-Semiconductor Characteristics of BaMgF4 Films on p-Silicon

1991 ◽  
Vol 230 ◽  
Author(s):  
T. S. Kalkur ◽  
J. R. Kulkarni ◽  
R. Y. Kwor ◽  
L. Levinson ◽  
L. Kammerdiner
Keyword(s):  
Threshold Voltage ◽  
Zirconium Oxide ◽  
Ionic Conduction ◽  
Electrical Characterization ◽  
Temperature Dependent ◽  
Capping Layer ◽  
Capacitance Voltage ◽  
Ferroelectric Memories ◽  
Non Destructive

AbstractCapacitance-voltage characterstics of BaMgF4 film deposited in an ion-assisted deposition system shows hysteresis and the direction of hysteresis corresponds to ferroelectric polarization. Electrical characterization of the films shows that these films can be used to implement non-destructive read-out non-volatile ferroelectric memories. These films were found to dissolve in water and other aqueous solutions. In order to overcome this problem, a suitable capping layer like zirconium oxide and amorphous silicon was deposited on BMF films. The shift in threshold voltage did not change significantly due to the incorporation of the capping layer. The shift in threshold voltage was found to be temperature dependent and this might be due to ionic conduction in fluorides.

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