Roles of Primary Hot Hole and FN Electron Fluences in Gate Oxide Breakdown

1999 ◽  
Vol 592 ◽  
Author(s):  
M. F. Li ◽  
Y. D. He ◽  
S. G. Ma ◽  
Byung Jin Cho ◽  
K. F. Lo

ABSTRACTIn this work, we report the link between the primary hot hole and Fowler Nordheim (FN) electron injections in oxide breakdown mechanism. A simple breakdown model is established. The experimental method is carefully designed to measure the primary hot hole fluence and FN electron fluence separately and accurately. The calculation based on our model is in very good agreement with our experiments. Oxide breakdown is stimulated by a combined effect when the sum of the trap density Dpri activated by primary hot hole injection and the trap density Dn activated by FN electron injection reaches a critical value Dcri. The hole is two orders of magnitude more effective than FN electron in causing breakdown. Since primary hot hole injection may occurs under many realistic device operation in the circuit, existing oxide lifetime projected from conventional TDDB measurement by only applying FN stress is overestimated in many cases. The model demonstrated in this work lays the groundwork in approaching a more appropriate way for predicting the oxide reliability and lifetime.

1990 ◽  
Vol 11 (10) ◽  
pp. 460-462 ◽  
Author(s):  
K.R. Mistry ◽  
D.B. Krakauer ◽  
B.S. Doyle

2013 ◽  
Vol 740-742 ◽  
pp. 745-748 ◽  
Author(s):  
J. Sameshima ◽  
Osamu Ishiyama ◽  
Atsushi Shimozato ◽  
K. Tamura ◽  
H. Oshima ◽  
...  

Time-dependent dielectric breakdown (TDDB) measurement of MOS capacitors on an n-type 4 ° off-axis 4H-SiC(0001) wafer free from step-bunching showed specific breakdown in the Weibull distribution plots. By observing the as-grown SiC-epi wafer surface, two kinds of epitaxial surface defect, Trapezoid-shape and Bar-shape defects, were confirmed with confocal microscope. Charge to breakdown (Qbd) of MOS capacitors including an upstream line of these defects is almost the same value as that of a Wear-out breakdown region. On the other hand, the gate oxide breakdown of MOS capacitors occurred at a downstream line. It has revealed that specific part of these defects causes degradation of oxide reliability. Cross-sectional TEM images of MOS structure show that gate oxide thickness of MOS capacitor is non-uniform on the downstream line. Moreover, AFM observation of as-grown and oxidized SiC-epitaxial surfaces indicated that surface roughness of downstream line becomes 3-4 times larger than the as-grown one by oxidation process.


1996 ◽  
Vol 442 ◽  
Author(s):  
T. Mera ◽  
J. Jablonski ◽  
M. Danbata ◽  
K. Nagai ◽  
M. Watanabe

AbstractCrystal-originated pits are known as the defects responsible for B-mode Time Zero Dielectric Break-down (TZDB) of the gate oxide grown on the surface of Si wafers. In order to clarify the breakdown mechanism, we have analyzed the structure of those defects formed at the surface of bare and oxidized wafers. In the latter case the analysis has been done both before and after gate oxide breakdown. Electric breakdown has been accomplished by Cu decoration method, recognized as an effective tool for unambiguous detection and positioning of the defects causing B-mode TZDB. As revealed by cross-sectional transmission electron microscopy (XTEM), crystal-originated pits at the bare wafer surface are polyhedral pits having about 5-nm-thick oxide layer on the inner walls. During gate oxidation the thermal oxide is growing faster on the pit walls than on the wafer surface, except for the pit comers where the oxide thinning has been observed. Resulting concave comers of the oxidized pits are suggested to be the weak spots where B-mode TZDB occurs.


2000 ◽  
Vol 40 (1) ◽  
pp. 37-47 ◽  
Author(s):  
T. Pompl ◽  
H. Wurzer ◽  
M. Kerber ◽  
I. Eisele

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