Ballistic Electron Surface-Emitting Cold Cathode by Porous Polycrystalline Silicon Film Formed on Glass Substrate

2000 ◽  
Vol 638 ◽  
Author(s):  
Takuya Komoda ◽  
Tsutomu Ichihara ◽  
Yoshiaki Honda ◽  
Koichi Aizawa ◽  
Nobuyoshi Koshida

AbstractIt is demonstrated that a porous polycrystalline silicon (PPS) film is useful as a ballistic electron emitter for excitation source of a flat panel display. A 1.5 µ m polysilicon layer is deposited on a silicon substrate by Low Pressure Chemical Vapour Deposition (LPCVD) technique and subsequently anodised in an ethanoic HF solution and oxidised in a Rapid Thermal Oxidation (RTO) furnace. A thin Au film is deposited onto the RTO-treated PPS layer and used as a top electrode. The electron emission current Ie and the diode current Ips are measured as a function of the bias voltage Vps. Electron emission of which onset voltage is about 8 V rapidly increases with increasing Vps. The Ie value reaches about 2 mA/cm2 for Vps= 20 V at which the emission efficiency defined as Ie/Ips is about 1 %. The emission mechanism has also been investigated in terms of the correlation between the emitted electron energy and the structure of PPS layer. The observed energy distribution curve of output electrons suggests that the PPS layer acts as a ballistic transport medium and the emission occurs based on multiple tunnelling through silicon nanocrystallites. The PPS layer is also formed on the polysilicon layer deposited on a glass substrate by Plasma Enhanced Chemical Vapour Deposition (PCVD) technique. In this case, the film is treated by an electrochemical oxidation (ECO) in an H2SO4 solution. Similar emission characteristics are observed, although the emission current is lower than that formed on silicon substrate. We also demonstrate the 2.6 inches diagonal 53×40 pixels multicolour flat panel display. We name it ballistic electron surface-emitting display device (BSD). BSD shows the possible application to the future flat panel display.

Author(s):  
Tsutomu Ichihara ◽  
Takashi Hatai ◽  
Koichi Aizawa ◽  
Takuya Komoda ◽  
Akira Kojima ◽  
...  

2002 ◽  
Vol 2 (3) ◽  
pp. 233-235 ◽  
Author(s):  
Hoon Kim ◽  
Jong-Won Park ◽  
Joo-Won Lee ◽  
Yun-Hi Lee ◽  
Yoon-Ho Song ◽  
...  

1995 ◽  
Vol 34 (Part 1, No. 9A) ◽  
pp. 4666-4672 ◽  
Author(s):  
Eric Dehan ◽  
Juan Jose Pedroviejo ◽  
EmmanuelScheid ◽  
Joan Ramon Morante

2006 ◽  
Vol 497 (1-2) ◽  
pp. 157-162 ◽  
Author(s):  
Bin Ai ◽  
Hui Shen ◽  
Zongcun Liang ◽  
Zhi Chen ◽  
Guanglin Kong ◽  
...  

1995 ◽  
Vol 377 ◽  
Author(s):  
A. R. Middya ◽  
A. Lloret ◽  
J. Perrin ◽  
J. Huc ◽  
J. L. Moncel ◽  
...  

ABSTRACTPolycrystalline silicon thin films have been deposited at fast growth rates (50 Å/s) by hotwire chemical vapour deposition (HW-CVD) from SiH4/H2 gas mixtures at low substrate temperature (400–500°C). The surface morphology of these films consists of 0.5 – 2.0μm dendritic grains as seen by electron microscopy. The films have a columnar morphology with grains starting from the substrate either on glass or c-Si. Even the 150 nm thick initial layer is polycrystalline. The preferential crystalline orientation of the poly-Si film is apparently not governed by the radiative source but strongly depends on the type and orientation of the substrate. A strong hydrogen dilution (>90%) of silane is essential to obtain poly-Si films with optimal crystalline structure.


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