Anisotropic Fracture Behavior of Electroless deposited Ni-P Amorphous Alloy Thin Films

2000 ◽  
Vol 657 ◽  
Author(s):  
Kazuki Takashima ◽  
Akio Ogura ◽  
Yusuke Ichikawa ◽  
Yakichi Higo
Keyword(s):  
Thin Film ◽  
Amorphous Alloy ◽  
Crack Propagation ◽  
Fracture Behavior ◽  
Growth Direction ◽  
Propagation Direction ◽  
Alloy Thin Film ◽  
Anisotropic Fracture ◽  
Crack Propagation Direction ◽  
Fracture Tests

ABSTRACTFracture tests have been carried out for an electroless deposited Ni-P amorphous alloy thin film with different crack growth directions. Cantilever beam type specimens with dimensions of 10 × 10 × 50 μm3 were prepared from a Ni-P amorphous thin film and notches with different directions, which are perpendicular and parallel to the deposition growth direction, were introduced by focused ion beam machining. Fatigue pre-cracks were introduced ahead of the notches. Fracture tests were performed using a mechanical testing machine for micro-sized specimens. Fracture behavior is different between the two types of specimens. As KIC values were not obtained because the criteria of plane strain were not satisfied for this size of the specimen, the provisional fracture toughness KQ values were determined. The KQ value of the specimen with crack propagation direction being perpendicular to the deposition growth direction was 4.2 MPam1/2, while that with crack propagation direction being parallel to the deposition growth direction was 7.3 MPam1/2. This result suggests that the electroless deposited Ni-P amorphous alloy thin film has anisotropic fracture properties.

Fracture Behavior of Micro-Sized Specimens Prepared From an Amorphous Alloy Thin Film at Ambient and Elevated Temperatures

2001 ◽  
Vol 695 ◽  
Author(s):  
K. Takashima ◽  
R. Tarumi ◽  
Y. Higo
Keyword(s):  
Thin Film ◽  
Fracture Toughness ◽  
Amorphous Alloy ◽  
Cantilever Beam ◽  
Fracture Behavior ◽  
Room Temperature ◽  
Elevated Temperatures ◽  
Alloy Thin Film ◽  
Type Specimens ◽  
Beam Type

ABSTRACTFracture behavior of micro-sized cantilever beam type specimens prepared from an electroless deposited Ni-P amorphous alloy thin film has been investigated at ambient and elevated temperatures. Cantilever beam type specimens with dimensions of 10 x 12 x 50 μm3 were prepared from an electroless deposited Ni-P amorphous alloy thin film and notches were introduced by focused ion beam machining. Fatigue pre-cracks were introduced ahead of the notches. The introduction of fatigue pre-crack and fracture toughness tests were carried out using a mechanical testing machine for micro-sized specimens. The temperature of the specimen was controlled from room temperature to 473 K using a newly developed heating system. Compared with room temperature, fracture toughness increased approximately 40 % at 373 K but decreased 19 % at 473 K. The increase of fracture toughness at 373 K is considered to be related with the formation of nano-sized crystals and the decrease of fracture toughness at 473 K is considered to be due to the growth of crystals. It is required to consider the fracture behavior obtained in this investigation when designing actual MEMS devices using electroless deposited amorphous films.

Understanding Effect of Grain Boundaries in the Fracture Behavior of Polycrystalline Tungsten under Mode-I Loading

2012 ◽  
Vol 134 (3) ◽  
Author(s):  
Hongsuk Lee ◽  
Vikas Tomar
Keyword(s):  
Crack Propagation ◽  
Grain Boundaries ◽  
Fracture Behavior ◽  
Propagation Direction ◽  
Thermal And Mechanical Properties ◽  
Property Variation ◽  
Microcrack Density ◽  
Failure Resistance ◽  
Crack Propagation Direction ◽  
Polycrystalline Tungsten

Polycrystalline tungsten is considered as an important material in aerospace, automobile, and energy industries due to its excellent thermal and mechanical properties. While grain boundaries (GBs) are perceived to play a major role in polycrystalline tungsten failure resistance, experimental data are scarce on explicit contribution of GBs to tungsten failure resistance. The present work focuses on understanding the effect of GB property variation on fracture resistance of polycrystalline tungsten. The cohesive finite element method is used for the simulation of crack propagation in polycrystalline tungsten microstructures. The results show a significant effect of GB property variation on change of crack propagation patterns during tungsten fracture. A variation of 10% in GB fracture energy resulted in distinctly different crack patterns with different primary crack propagation direction and the microcrack density. Based on the observed microstructural fracture attributes, a relation between cohesive energy dissipation and microcrack density in polycrystalline tungsten microstructures is proposed.

Automatic 3-D Crack Propagation Calculations in Industrial Components: A Pure Hexahedral versus a Combined Hexahedral-Tetrahedral Approach

2007 ◽  
Vol 348-349 ◽  
pp. 45-48
Author(s):  
Guido Dhondt
Keyword(s):  
Crack Propagation ◽  
Computing Time ◽  
Propagation Direction ◽  
Hexahedral Elements ◽  
Crack Propagation Direction ◽  
Low Weight ◽  
Out Of Plane ◽  
Hexahedral Meshes ◽  
Crack Faces

In recent years, increased loading and low weight requirements have led to the need for automatic crack tracing software. At MTU a purely hexahedral code has been developed in the nineties for Mode-I applications. It has been used extensively for all kinds of components and has proven to be very flexible and reliable. Nevertheless, in transition regions between complex components curved cracks have been observed, necessitating the development of mixed-mode software. Due to the curvature of the crack faces, purely hexahedral meshes are not feasible, and therefore a mixture of hexahedral elements at the crack tip, combined with tetrahedral in the remaining structure has been selected. The intention of the present paper is to compare both methods and to point out the strength and weaknesses of each regarding accuracy, complexity, flexibility and computing time. Furthermore, difficulties arising from the out-of-plane growth of the crack such as the determination of the crack propagation direction are discussed.

Experimental Study and Finite Element Simulation of Heat Build-Up in Rubber Compounds with Application to Fracture

2003 ◽  
Vol 76 (2) ◽  
pp. 386-405 ◽  
Author(s):  
Vladamir Kerchman ◽  
Cheng Shaw
Keyword(s):  
Finite Element ◽  
Crack Propagation ◽  
Numerical Models ◽  
Propagation Direction ◽  
Transient Temperature ◽  
Ir Thermography ◽  
Crack Propagation Direction ◽  
Measure Surface Temperature ◽  
Rubber Compounds ◽  
Heat Build Up

Abstract IR thermography was used to measure surface temperature profiles of cylindrical rubber specimens during cyclic compression. A linearized constitutive approach and finite element analysis were used to evaluate heat generation and associated transient temperature fields. Modeled temperatures compared well with the IR measurements. This led to extended simulation efforts on lab fracture samples. IR thermography was used to measure temperature of filled NR and filled SBR specimens during tensile fatigue cut growth tests. Temperature gradients are expected to relate to kinetics of rubber fracture and identify regions within the sample that are undergoing accelerated damage. The following cut growth issues were addressed: 1) crack propagation direction in a non-uniform stress field; 2) crack propagation direction as a function of the angle of initial cuts; 3) initiation of crack branching; and 4) catastrophic failure. The nonlinear coupled mechanical and thermal FEA was used to evaluate the energy dissipation in the non-homogeneous cyclic deformation of cracked samples. Modeled and measured surface temperatures are in good agreement. Accounting for heat build-up ahead of an advancing crack can improve numerical models that quantify fatigue cut growth behavior in rubber compounds.

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