Characterization of Ruthenium and Ruthenium Oxide Thin Films deposited by Chemical Vapor Deposition for CMOS Gate Electrode Applications

2002 ◽  
Vol 745 ◽  
Author(s):  
Filippos Papadatos ◽  
Spyridon Skordas ◽  
Steve Consiglio ◽  
Alain E. Kaloyeros ◽  
Eric Eisenbraun
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Rutherford Backscattering Spectrometry ◽  
Ruthenium Oxide ◽  
Performance Testing ◽  
Chemical Vapor ◽  
Electrical Performance ◽  
Organic Chemical ◽  
Gate Electrode ◽  
X Ray

ABSTRACTThis study describes work carried out to date involving evaluation of the chemical, structural, and electrical performance of ruthenium (Ru) and ruthenium oxide (RuO2) films grown on SiO2 substrates employing metal organic chemical vapor deposition (MOCVD). Diethyl ruthenocene and oxygen were employed as reactant gases for this work, which was carried out using a 200mm wafer cluster tool. The films were characterized using cross-sectional scanning electron microscopy (CS-SEM), four-point resistance probe, x-ray photoelectron spectroscopy (XPS), Rutherford backscattering spectrometry (RBS), x-ray diffraction (XRD), and energy dispersive spectrometry (EDS). Capacitance-voltage (C-V) measurements were also carried out to assess the work function of the deposited films. It was determined that both Ru and RuO2 phases possess near-bulk resistivity and low contamination levels. Importantly, it was observed that the film stoichiometry could be modulated by controlled changes of the processing conditions, and that pure Ru and RuO2 films can be deposited in an oxygen ambient. In order to assess thermal stability, the films were subsequently annealed in forming gas and oxygen ambients, and it was found that the film stability is dependent upon both the deposited phase and the annealing ambient. Results of PMOS gate electrode performance testing of CVD Ru films, has been carried out, and the results are similar to those previously reported for ruthenium-based films.

Chemical Vapor Deposition of Ru and RuO2 for Gate Electrode Applications

2002 ◽  
Vol 716 ◽  
Author(s):  
Filippos Papadatos ◽  
Spyridon Skordas ◽  
Zubin Patel ◽  
Steven Consiglio ◽  
Eric Eisenbraun
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Photoelectron Spectroscopy ◽  
Rutherford Backscattering Spectrometry ◽  
Chemical Vapor ◽  
Gate Electrode ◽  
Cross Sectional ◽  
X Ray ◽  
Potential Applications ◽  
Reactive Gases

AbstractIn this work, Ru and RuO2 films have been investigated for potential applications in emerging CMOS gate electrode and memory capacitor bottom electrode applications. Films were deposited on SiO2 using chemical vapor deposition (CVD) and low power plasma assisted CVD (PACVD) in a 200-mm wafer deposition cluster tool using a metal beta-diketonate precursor [Bis (2,2,6,6-tetramethyl-3,5-heptanedionato) (1,5-cyclooctadiene) ruthenium (II)]. Hydrogen and oxygen were employed as the reactive gases to deposit, respectively, Ru and RuO2, over a wafer temperature range from 320°C to 480°C. The resulting film properties were analyzed using cross-sectional scanning electron microscopy (CS-SEM), four point resistance probe, x-ray photoelectron spectroscopy (XPS), Rutherford backscattering spectrometry (RBS) and x-ray diffraction (XRD). Both Ru and RuO2 films could be deposited with minimal carbon concentration (∼5 at. %). The purity of the films was also reflected in the as-deposited resistivity of the films, which was as low as 47 μΩ-cm, and was strongly dependent on processing conditions. In order to assess thermal stability, the films were subsequently annealed in forming gas and oxygen ambients for 60 min at 650°C. It was observed that, generally speaking, CVD RuO2 films were stable, with respect to resistivity, in oxidizing ambients, while annealing in a reducing ambient resulted in significant film densification and reduction of the film resistivities to as low as 43 μΩ-cm. Ru films demonstrated good adhesion after anneals in oxidizing, but not in reducing ambients.

Growth of Ferroelectric PbZrxTi1-xO3 (PZT) Thin Films by Liquid-Delivery Metalorganic Chemical Vapor Deposition

2005 ◽  
Vol 902 ◽  
Author(s):  
Serhiy Matichyn ◽  
Marco Lisker ◽  
Edmund P. Burte
Keyword(s):  
Thin Films ◽  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Organic Chemical ◽  
Main Role ◽  
Pzt Thin Films ◽  
X Ray ◽  
Pzt Films ◽  
Deposited Films

AbstractIn this study lead zirkonat titanate (PZT) thin films were deposited using direct liquid injection metal organic chemical vapor deposition (DLI-MOCVD).The chemical states and the stoichiometry of PZT-films were characterized using X-ray photoelectron spectroscopy (XPS). The crystal structure of the films was investigated by X-ray diffraction (XRD).The surface composition of the films was Pb : Zr : Ti = 1.05 : 0.52 : 0.48, which indicates that the deposited films had a stoichiometric PZT composition. 130 nm thick PZT films deposited on Ir showed <110> preferred orientation.The main role for formation of the perovsktive PZT films plays the content of the lead in the deposited films. Lead deficiency causes the formation of the pyrochlore phase with poor electrical properties. In films with a significant excess of lead a second PbO phase appeared that can be observed even with naked eyes. Negligible excess of lead can be reduced by post-deposition annealing at 500-600 °C.The Ir/PZT/Ir capacitor showed large values of the remanent polarisation of about 60μC/cm2 at an applied voltage of 3 V. So high value of the remanent polarisation can be induced by structural stress in the films. After ten switch impulses the values of the remanent polarisation have significantly decreased. This is probably due to a relaxation of crystal cells.

Metal-Organic Chemical Vapor Deposition of InSb on Gaas and InSb in an Inverted Stagnation Point Flow Geometry

1988 ◽  
Vol 144 ◽  
Author(s):  
G. A. Hebner ◽  
R. M. Biefeld ◽  
K. P. Killeen
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
High Mobility ◽  
Chemical Vapor ◽  
Organic Chemical ◽  
X Ray ◽  
Partial Pressures ◽  
Narrow Bandgap ◽  
Flow Geometry ◽  
Metal Organic

ABSTRACTSeveral properties of InSb such as high mobility and narrow bandgap make it an attractive candidate for many unique devices. We have examined the metalorganic chemical vapor deposition (MOCVD) of InSb on GaAs and InSb substrates under a variety of conditions using trimethylindium and trimethylantimony sources. The absolute metal-organic partial pressures above the susceptor were monitored using in-situ Ultraviolet (UV) absorption spectroscopy. X-ray studies of the homoepitaxial growth of InSb on InSb substrates (100) indicate good crystalline epitaxial growth while the x-ray peak for the InSb grown on GaAs (100) is broadened due to defects. Room-temperature Hall mobility measurements performed on the heteroepitaxial InSb layer on GaAs substrates indicates that the mobility of the InSb increases with increasing layer thickness. Mobilities range from 12,000 cm2/V sec for 0.8 micron layers to 38,000 cm2/V sec for 7.4 micron layers. The carrier concentrations are relatively constant (2 to 4 × 1016 cm−3 ) for the n type InSb deposited layers.

Atmospheric pressure chemical vapor deposition of TiN from tetrakis(dimethylamido)titanium and ammonia

1996 ◽  
Vol 11 (4) ◽  
pp. 989-1001 ◽  
Author(s):  
Joshua N. Musher ◽  
Roy G. Gordon
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Atmospheric Pressure ◽  
Gas Flow ◽  
Rutherford Backscattering Spectrometry ◽  
Chemical Vapor ◽  
Scanning Electron Micrographs ◽  
X Ray ◽  
High Ammonia ◽  
Pressure Chemical

Near stoichiometric titanium nitride (TiN) was deposited from tetrakis(dimethylamido)titanium (TDMAT) and ammonia using atmospheric pressure chemical vapor deposition. Experiments were conducted in a belt furnace; static experiments provided kinetic data and continuous operation uniformly coated 150-mm substrates. Growth rate, stoichiometry, and resistivity are examined as functions of deposition temperature (190−420 °C), ammonia flow relative to TDMAT (0−30), and total gas-flow rate (residence time 0.3−0.6 s). Films were characterized by sheet resistance measurements, Rutherford Backscattering Spectrometry, and X-Ray Photoelectron Spectrometry. Films deposited without ammonia were substoichiometric (N/Ti, 0.6−0.75), contained high levels of carbon (C/Ti = 0.25−0.40) and oxygen (O/Ti = 0.6−0.9), and grew slowly. Small amounts of ammonia (NH3/TDMAT ≥ 1) brought impurity levels down to C/Ti, 0.1 and O/Ti = 0.3−0.5. Ammonia increased the growth rates by a factor of 4−12 at temperatures below 400 °C. Films 500 Å thick had resistivities as low as 1600 μΩ-cm when deposited at 280 °C and 1500 μΩ-cm when deposited at 370 °C. Scanning electron micrographs indicate a smooth surface and poor step coverage for films deposited with high ammonia concentrations.

In situ X-ray studies of metal organic chemical vapor deposition of PbZrxTi1−xO3

2007 ◽  
Vol 515 (14) ◽  
pp. 5593-5596 ◽  
Author(s):  
R.-V. Wang ◽  
F. Jiang ◽  
D.D. Fong ◽  
G.B. Stephenson ◽  
P.H. Fuoss ◽  
...  
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Organic Chemical ◽  
X Ray ◽  
Metal Organic ◽  
Organic Chemical Vapor Deposition

Properties of Pr-based high k dielectric films obtained by Metal-Organic Chemical Vapor Deposition

2004 ◽  
Vol 811 ◽  
Author(s):  
Raffaella Lo Nigro ◽  
Roberta G. Toro ◽  
Graziella Malandrino ◽  
Vito Raineri ◽  
Ignazio L. Fragalà
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Morphological Characteristics ◽  
Chemical Vapor ◽  
Organic Chemical ◽  
Electrical Measurements ◽  
Praseodymium Oxide ◽  
X Ray ◽  
Metal Organic ◽  
Organic Chemical Vapor Deposition

ABSTRACTWe report the results of a recent study on the deposition of praseodymium oxides thin films on silicon substrates by Metal-Organic Chemical Vapor Deposition (MOCVD). A suited Pr(III) β-diketonate precursor has been used as the metal source and the deposition conditions have been carefully selected because of a large variety of possible PrO2−x (x= 0−0.5) phases. Pr2O3 films have been obtained in a hot-wall MOCVD reactor under non oxidising ambient at 750°C deposition temperature. The structural and morphological characteristics of Pr2O3 films have been carried out by X-ray diffraction (XRD) and high resolution transmission electron microscopy (TEM). Chemical compositional studies have been performed by X- ray photoelectron spectroscopic (XPS) analysis and a fully understanding of the MOCVD process has been achieved. Preliminary electrical measurements point to MOCVD as a reliable growth technique to obtain good quality praseodymium oxide based films.

Metal-Organic Chemical Vapor Deposition of BiFeO3 Based Multiferroics

2014 ◽  
Vol 90 ◽  
pp. 57-65 ◽  
Author(s):  
Maria Rita Catalano ◽  
Gugliemo Guido Condorelli ◽  
Raffaella Lo Nigro ◽  
Graziella Malandrino
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Ferroelectric Properties ◽  
Chemical Vapor ◽  
Piezoresponse Force Microscopy ◽  
Morphological Characterization ◽  
Organic Chemical ◽  
X Ray ◽  
Metal Organic ◽  
Organic Chemical Vapor Deposition

BiFeO3 films undoped and doped with Ba and/or Ti have been fabricated through Metal-Organic Chemical Vapor Deposition (MOCVD) on SrTiO3 (100), SrTiO3:Nb (100) and YSZ (100) substrates. Films have been deposited using a multi-metal source, consisting of the Bi (phenyl)3, Fe (tmhd)3, Ba (hfa)2•tetraglyme and Ti (tmhd)2(O-iPr)2 (phenyl= -C6H5, H-tmhd=2,2,6,6-tetramethyl-3,5-heptandione; O-iPr= iso-propoxide; H-hfa=1,1,1,5,5,5-hexafluoro-2,4-pentanedione; tetraglyme = CH3O(CH2CH2O)4CH3) precursor mixture. The structural and morphological characterization of films has been carried out using X-ray diffraction (XRD) and field emission scanning electron microscopy (FE-SEM). Chemical compositional studies have been performed by energy dispersive X-ray (EDX) analysis. Structural and morphological characterizations point to the formation of crystalline phases and homogeneous surfaces for both undoped and doped BiFeO3 films. Piezoresponse force microscopy (PFM) and piezoresponce force spectroscopy (PFS) have been applied to study the piezoelectric and ferroelectric properties of the films.

Chemical Vapor Deposition of ZnS:Mn for Thin-Film Electroluminescent Display Applications

2004 ◽  
Vol 19 (3) ◽  
pp. 697-706 ◽  
Author(s):  
Anna W. Topol ◽  
Kathleen A. Dunn ◽  
Karl W. Barth ◽  
Guillermo M. Nuesca ◽  
Brian K. Taylor ◽  
...  
Keyword(s):  
Thin Film ◽  
Electron Microscopy ◽  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Photoelectron Spectroscopy ◽  
Rutherford Backscattering Spectrometry ◽  
Chemical Vapor ◽  
Nuclear Reaction Analysis ◽  
Process Window ◽  
X Ray

Results are presented from a systematic investigation to design and optimize a low-pressure chemical vapor deposition (CVD) process for manganese-doped zinc sulfide (ZnS:Mn) thin films for electroluminescent (EL) device applications. The CVD process used diethylzinc (DEZ), di-π-cyclopentadienyl manganese (CPMn), and hydrogen sulfide (H2S) as co-reactants and hydrogen (H2) as carrier gas. A design of experiments approach was used to derive functionality curves for the dependence of ZnS:Mn film properties on substrate temperature and flow rates (partial pressures) of DEZ, CPMn, H2S, and H2. Film physical, chemical, structural, and optical properties were examined using Rutherford backscattering spectrometry, dynamic secondary ion mass spectroscopy, x-ray photoelectron spectroscopy, nuclear-reaction analysis, x-ray diffraction, transmission electron microscopy, atomic force microscopy, and scanning electron microscopy. EL measurements were carried out on ZnS:Mn-based dielectric–sulfur–dielectric stacks incorporated into alternating-current thin-film electroluminescent devices. An optimized process window was established for the formation of films with predominantly (0 0 2) orientation, grain size larger than 0.2 μm, and Mn dopant level approximately 0.5 at.%. A brightness of 407 cd/m2 (119 fL) and efficiency of 1.6 lm/W were obtained, as measured at 40 V above threshold voltage and 60 Hz frequency.

Sign in / Sign up

Export Citation Format

Share Document