Thermal conductivity of bulk nanostructured Bi85Sb15 solid solution samples

2021 ◽  
Vol 64 (10) ◽  
pp. 91-97
Author(s):  
M.M. Tagiyev ◽  
◽  
G.J. Abdinova ◽  
I.A. Abdullayeva
Keyword(s):  
Thermal Conductivity ◽  
Solid Solution

scholarly journals Термоэлектрические свойства нанокомпозитного Bi-=SUB=-0.45-=/SUB=-Sb-=SUB=-1.55-=/SUB=-Te-=SUB=-2.985-=/SUB=- с микрочастицами SiO-=SUB=-2-=/SUB=-

2019 ◽  
Vol 53 (6) ◽  
pp. 751
Author(s):  
А.А. Шабалдин ◽  
П.П. Константинов ◽  
Д.А. Курдюков ◽  
Л.Н. Лукьянова ◽  
А.Ю. Самунин ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Solid Solution ◽  
Electrical Conductivity ◽  
Wide Temperature Range ◽  
Figure Of Merit ◽  
Nanostructured Material ◽  
Thermoelectric Figure Of Merit ◽  
Thermoelectric Efficiency ◽  
Thermoelectric Figure ◽  
P Type

AbstractNanocomposite thermoelectrics based on Bi_0.45Sb_1.55Te_2.985 solid solution of p -type conductivity are fabricated by the hot pressing of nanopowders of this solid solution with the addition of SiO_2 microparticles. Investigations of the thermoelectric properties show that the thermoelectric power of the nanocomposites increases in a wide temperature range of 80–420 K, while the thermal conductivity considerably decreases at 80–320 K, which, despite a decrease in the electrical conductivity, leads to an increase in the thermoelectric efficiency in the nanostructured material without the SiO_2 addition by almost 50% (at 300 K). When adding SiO_2, the efficiency decreases. The initial thermoelectric fabricated without nanostructuring, in which the maximal thermoelectric figure of merit ZT = 1 at 390 K, is most efficient at temperatures above 350 K.

Large reduction of thermal conductivity leading to enhanced thermoelectric performance in p-type Mg3Bi2–YbMg2Bi2 solid solutions

2019 ◽  
Vol 7 (2) ◽  
pp. 434-440 ◽  
Author(s):  
Ting Zhou ◽  
Jun Mao ◽  
Jing Jiang ◽  
Shaowei Song ◽  
Hangtian Zhu ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Solid Solution ◽  
Thermoelectric Property ◽  
Solid Solutions ◽  
Thermoelectric Performance ◽  
Large Reduction ◽  
P Type

The thermoelectric property of YbMg2Bi2–Mg3Bi2 solid solution is studied.

scholarly journals Electrical Transport and Thermoelectric Properties of SnSe–SnTe Solid Solution

Materials ◽  
2019 ◽  
Vol 12 (23) ◽  
pp. 3854 ◽  
Author(s):  
Jun-Young Cho ◽  
Muhammad Siyar ◽  
Woo Chan Jin ◽  
Euyheon Hwang ◽  
Seung-Hwan Bae ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Solid Solution ◽  
Electrical Conductivity ◽  
Single Crystal ◽  
Carrier Concentration ◽  
Electrical Transport ◽  
Lattice Thermal Conductivity ◽  
Phonon Scattering ◽  
Practical Applications ◽  
Defect Sites

SnSe is considered as a promising thermoelectric (TE) material since the discovery of the record figure of merit (ZT) of 2.6 at 926 K in single crystal SnSe. It is, however, difficult to use single crystal SnSe for practical applications due to the poor mechanical properties and the difficulty and cost of fabricating a single crystal. It is highly desirable to improve the properties of polycrystalline SnSe whose TE properties are still not near to that of single crystal SnSe. In this study, in order to control the TE properties of polycrystalline SnSe, polycrystalline SnSe–SnTe solid solutions were fabricated, and the effect of the solid solution on the electrical transport and TE properties was investigated. The SnSe1−xTex samples were fabricated using mechanical alloying and spark plasma sintering. X-ray diffraction (XRD) analyses revealed that the solubility limit of Te in SnSe1−xTex is somewhere between x = 0.3 and 0.5. With increasing Te content, the electrical conductivity was increased due to the increase of carrier concentration, while the lattice thermal conductivity was suppressed by the increased amount of phonon scattering. The change of carrier concentration and electrical conductivity is explained using the measured band gap energy and the calculated band structure. The change of thermal conductivity is explained using the change of lattice thermal conductivity from the increased amount of phonon scattering at the point defect sites. A ZT of ~0.78 was obtained at 823 K from SnSe0.7Te0.3, which is an ~11% improvement compared to that of SnSe.

Alloy scattering of phonons

2020 ◽  
Vol 7 (6) ◽  
pp. 1452-1456 ◽  
Author(s):  
Ramya Gurunathan ◽  
Riley Hanus ◽  
G. Jeffrey Snyder
Keyword(s):  
Thermal Conductivity ◽  
Solid Solution ◽  
Lattice Thermal Conductivity ◽  
Solid Solution Alloy ◽  
Alloy Scattering

Solid-solution alloy scattering of phonons is a demonstrated mechanism to reduce the lattice thermal conductivity.

Thermoelectric performance of Cu1−x−δAgxInTe2 diamond-like materials with a pseudocubic crystal structure

2016 ◽  
Vol 3 (9) ◽  
pp. 1167-1177 ◽  
Author(s):  
Ruiheng Liu ◽  
Yuting Qin ◽  
Nian Cheng ◽  
Jiawei Zhang ◽  
Xun Shi ◽  
...  
Keyword(s):  
Crystal Structure ◽  
Thermal Conductivity ◽  
Solid Solution ◽  
Electrical Transport ◽  
Lattice Thermal Conductivity ◽  
Thermoelectric Performance ◽  
Valence Bands

In a tetragonal chalcopyrite solid solution Cu1−xAgxInTe2 (x = 0–0.5), a pseudocubic structure is realized at x ≈ 0.2. The degenerate valence bands influence electrical transport and lattice thermal conductivity. The highest ZT of 1.24 was obtained at x = 0.2 and δ = 0.05.

scholarly journals SnTe–AgBiTe2 as an efficient thermoelectric material with low thermal conductivity

2014 ◽  
Vol 2 (48) ◽  
pp. 20849-20854 ◽  
Author(s):  
Gangjian Tan ◽  
Fengyuan Shi ◽  
Hui Sun ◽  
Li-Dong Zhao ◽  
Ctirad Uher ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Solid Solution ◽  
Seebeck Coefficient ◽  
Thermoelectric Material ◽  
Lattice Thermal Conductivity ◽  
Alloying Effect ◽  
Low Thermal Conductivity ◽  
Interface Scattering

SnTe–AgBiTe2 is not only a solid solution but a nanocomposite. The alloying effect coupled with intense interface scattering leads to considerably decreased lattice thermal conductivity. Bi is much more powerful in neutralizing holes than Sb, giving rise to a much higher Seebeck coefficient. A high ZT was then obtained.

Effects of Melting Process on the Microstructure and Thermal Conductivity of Cu-10Ni-5Mo Alloy

2011 ◽  
Vol 415-417 ◽  
pp. 289-292
Author(s):  
Bai Ping Lu ◽  
Hui Xu ◽  
Can Cheng Liu
Keyword(s):  
Thermal Conductivity ◽  
Solid Solution ◽  
Injection Moulding ◽  
Melting Process ◽  
Induction Melting ◽  
Melting Points ◽  
Arc Melting ◽  
Coefficient Of Thermal Conductivity

Cu-10Ni-5Mo alloys have been prepared by arc-melting and induction melting injection moulding. The effects of melting processes on the microstructure and thermal conductivity of Cu-10Ni-5Mo alloys were studied. The results show that the grain of Cu-10Ni-5Mo alloy prepared by arc-melting is coarse and the structure includes α solid solution and Mo-Ni phase. The grain of Cu-10Ni-5Mo alloy prepared by induction melting injection moulding is superfine and the structure is α solid solution. Under this experiment condition, the coefficient of thermal conductivity of Cu-10Ni-5Mo alloy prepared by arc-melting is 56.9 W/(m•K)，while that of Cu-10Ni-5Mo alloy prepared by induction melting injection moulding is 35.7 W/(m•K). The melting points of Cu-10Ni-5Mo alloy prepared by two methods all increase and are little different.

Lattice thermal conductivity of the Cu3SbSe4-Cu3SbS4 solid solution

2011 ◽  
Vol 110 (2) ◽  
pp. 023501 ◽  
Author(s):  
Eric J. Skoug ◽  
Jeffrey D. Cain ◽  
Donald T. Morelli ◽  
Melanie Kirkham ◽  
Paul Majsztrik ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Solid Solution ◽  
Lattice Thermal Conductivity

Thermoelectric Properties of Some Cobalt Phosphide-Arsenide Compounds

2000 ◽  
Vol 626 ◽  
Author(s):  
Anucha Watcharapasorn ◽  
Robert C. DeMattei ◽  
Robert S. Feigelson ◽  
Thierry Caillat ◽  
Alexander Borshchevsky ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Solid Solution ◽  
Thermoelectric Properties ◽  
Phonon Scattering ◽  
Substantial Reduction ◽  
Essential Information ◽  
Seebeck Coefficients ◽  
Three Samples ◽  
Binary Compounds ◽  
Increasing Temperature

ABSTRACTSamples of CoP3, CoAs3 and CoP1.5As1.5 have been synthesized and their thermoelectric properties measured. All three samples show semiconducting behavior. The Seebeck coefficients of CoP3 and CoAs3 are weakly dependent on temperature and are relatively small with maximum values of about 40 and 50 μV/K, respectively. The Seebeck coefficient of the solid solution gradually decreases with increasing temperature and the values are larger than those of CoP3 and CoAs3 in the temperature range investigated, with a maximum value of about 89 μV/K near room temperature. The thermal conductivity of CoP3 and CoAs3 are higher than that of CoSb3, as can be expected from the effect of anionic size on lattice vibration. A substantial reduction in thermal conductivity was observed for the solid solution compared to the constituent binary compounds due to additional phonon scattering from lattice disorder and other possible point defects such as vacancies. Other compositions in the CoP3-xAsx system have also been synthesized and their thermoelectric properties are currently being investigated to provide essential information about lattice thermal conductivity reduction by point defect scattering and to further develop strategies for optimizing the thermoelectric properties of skutterudite materials.

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