scholarly journals High-density thermoplastic vulcanizates based on LLDPE/NR for truck floor mats application

2021 ◽  
Vol 37 (2) ◽  
pp. 95
Author(s):  
Dwi Wahini Nurhajati ◽  
Umi Reza Lestari
Keyword(s):  
High Density ◽  
Thermoplastic Vulcanizates

Strengthening effect of Mullins effect of high- density polyethylene/ethylene–propylene–diene terpolymer thermoplastic vulcanizates under compression mode

2017 ◽  
Vol 31 (10) ◽  
pp. 1310-1322 ◽  
Author(s):  
Qingqing Liu ◽  
Kai Zhang ◽  
Xingshuo Zhang ◽  
Zhaobo Wang
Keyword(s):  
High Density Polyethylene ◽  
Residual Deformation ◽  
High Density ◽  
Mullins Effect ◽  
Strengthening Effect ◽  
Compression Stress ◽  
Dynamic Vulcanization ◽  
Ethylene Propylene ◽  
Thermoplastic Vulcanizates ◽  
Ethylene Propylene Diene Terpolymer

Thermoplastic vulcanizates (TPVs) based on high-density polyethylene (HDPE)/ethylene–propylene–diene terpolymer (EPDM) were prepared via dynamic vulcanization. The mechanical properties and strengthening effect of Mullins effect under compression mode were investigated systematically. Experimental results indicated that the compression strength of TPVs was enhanced greatly compared with that of EPDM vulcanizate. Mullins effect could be observed obviously in the compression stress–strain curves of the TPVs while it was hardly to obverse in that of EPDM vulcanizate during the uniaxial loading–unloading cycles. The maximum compression stress and internal friction loss at specific strain were decreased after the first loading–unloading while only decreased slightly at the later loading–unloading cycles; however, the residual deformation increased with the increasing of the cycle times of compression. Mullins effect could be significantly enhanced with increasing compression strain and HDPE content in TPV.

Formulations for thermoplastic vulcanizates based on high density polyethylene, ethylene-propylene-diene monomer, and ground tyre rubber

2011 ◽  
Vol 45 (11) ◽  
pp. 1189-1200 ◽  
Author(s):  
J. Cañavate ◽  
P. Casas ◽  
X. Colom ◽  
F. Nogués
Keyword(s):  
Mechanical Properties ◽  
High Density Polyethylene ◽  
Thermoplastic Elastomers ◽  
High Density ◽  
Ethylene Propylene Diene Monomer ◽  
Good Balance ◽  
Ethylene Propylene ◽  
Thermoplastic Vulcanizates ◽  
Ground Tyre Rubber ◽  
Rubber Phase

Thermoplastic vulcanizates (TPVs) are a specific group of the so called thermoplastic elastomers. The main characteristic is the existence of a crosslinked rubber phase obtained by dynamic vulcanization in the presence of the thermoplastic matrix. This article studies TPVs based on ground tyre rubber (GTR), high-density polyethylene, and ethylene propylene diene monomer rubber. Vulcanization is performed by a new peroxide developed to resist high temperatures and an standard one. The aim of this study is optimize the formulation in order to include GTR, while maintaining a good balance of properties in the final TPV material. The use of GTR would improve the possibilities of recovering tyre waste. A detailed study regarding the influence of each component in the final mechanical properties has been carried out. The swelling properties, ATR infrared spectroscopy, TGA, and DSC analysis indicated a high degree of crosslink and good adhesion between the matrix and the rubber phase. Morphology of the composites was assessed by scanning electron microscopy. A composite containing a combination of peroxides and 40/30/30 of HDPE, EPDM, and GTR was found to show a good balance of characteristics regarding mechanical properties, crosslinking, and adhesion between phases.

Planar defects in ordered (Ga,In)P

1988 ◽  
Vol 46 ◽  
pp. 902-903
Author(s):  
S. McKernan ◽  
C. B. Carter ◽  
D. Bour ◽  
J. R. Shealy
Keyword(s):  
Electron Diffraction ◽  
Vapor Phase ◽  
Growth Direction ◽  
High Density ◽  
Ordered Structure ◽  
Planar Defects ◽  
Diffraction Patterns ◽  
Ternary Semiconductors ◽  
Anion Species ◽  
Metallic Vapor

The growth of ternary III-V semiconductors by organo-metallic vapor phase epitaxy (OMVPE) is widely practiced. It has been generally assumed that the resulting structure is the same as that of the corresponding binary semiconductors, but with the two different cation or anion species randomly distributed on their appropriate sublattice sites. Recently several different ternary semiconductors including AlxGa1-xAs, Gaxln-1-xAs and Gaxln1-xP1-6 have been observed in ordered states. A common feature of these ordered compounds is that they contain a relatively high density of defects. This is evident in electron diffraction patterns from these materials where streaks, which are typically parallel to the growth direction, are associated with the extra reflections arising from the ordering. However, where the (Ga,ln)P epilayer is reasonably well ordered the streaking is extremely faint, and the intensity of the ordered spot at 1/2(111) is much greater than that at 1/2(111). In these cases it is possible to image relatively clearly many of the defects found in the ordered structure.

Quantitative defect studies in semiconductor TEM samples prepared by low angle ion milling

1995 ◽  
Vol 53 ◽  
pp. 512-513
Author(s):  
L. Mulestagno ◽  
J.C. Holzer ◽  
P. Fraundorf
Keyword(s):  
Sample Preparation ◽  
Milling Time ◽  
High Density ◽  
Low Density ◽  
Ion Milling ◽  
High Quality ◽  
Variable Angle ◽  
Major Disadvantage ◽  
Induced Defects

Due to the wealth of information, both analytical and structural that can be obtained from it TEM always has been a favorite tool for the analysis of process-induced defects in semiconductor wafers. The only major disadvantage has always been, that the volume under study in the TEM is relatively small, making it difficult to locate low density defects, and sample preparation is a somewhat lengthy procedure. This problem has been somewhat alleviated by the availability of efficient low angle milling.Using a PIPS® variable angle ion -mill, manufactured by Gatan, we have been consistently obtaining planar specimens with a high quality thin area in excess of 5 × 104 μm2 in about half an hour (milling time), which has made it possible to locate defects at lower densities, or, for defects of relatively high density, obtain information which is statistically more significant (table 1).

Using the scanning electron microscope for failure analysis of high density magnetic media

1987 ◽  
Vol 45 ◽  
pp. 392-393
Author(s):  
Evelyn R. Ackerman ◽  
Gary D. Burnett
Keyword(s):  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
Failure Analysis ◽  
High Density ◽  
Magnetic Media ◽  
Specific Data ◽  
Retrieval Systems ◽  
Operating Environments ◽  
The Media ◽  
Scanning Electron

Advancements in state of the art high density Head/Disk retrieval systems has increased the demand for sophisticated failure analysis methods. From 1968 to 1974 the emphasis was on the number of tracks per inch. (TPI) ranging from 100 to 400 as summarized in Table 1. This emphasis shifted with the increase in densities to include the number of bits per inch (BPI). A bit is formed by magnetizing the Fe203 particles of the media in one direction and allowing magnetic heads to recognize specific data patterns. From 1977 to 1986 the tracks per inch increased from 470 to 1400 corresponding to an increase from 6300 to 10,800 bits per inch respectively. Due to the reduction in the bit and track sizes, build and operating environments of systems have become critical factors in media reliability.Using the Ferrofluid pattern developing technique, the scanning electron microscope can be a valuable diagnostic tool in the examination of failure sites on disks.

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