scholarly journals Pelarutan Selektif Tembaga dari Limbah Printed Circuit Board dengan Hidrogen Peroksida

2018 ◽  
Vol 14 (1) ◽  
pp. 51
Author(s):  
Gatut Ari Wardani ◽  
Rokiy Alfanaar ◽  
Sri Juari Santosa
Keyword(s):  
Hydrogen Peroxide ◽  
Copper Content ◽  
Printed Circuit Board ◽  
Volume Ratio ◽  
Absorption Spectrometry ◽  
Circuit Board ◽  
Copper Metal ◽  
X Ray ◽  
Printed Circuit ◽  
Optimal Separation

<p>Pelarutan selektif tembaga dari limbah <em>printed circuit board</em> (PCB) telah berhasil dilakukan. Logam tembaga yang terkandung di dalam papan PCB dapat dipisahkan menggunakan campuran hidrogen peroksida dan asam sulfat dengan variasi perbandingan volume 0 : 1, 1 : 1, 2 : 1, 3 : 1, 4 : 1, dan 5 : 1. Pemisahan optimal dilakukan dengan sistem perendaman selama 3 hari dengan campuran H<sub>2</sub>O<sub>2</sub>/H<sub>2</sub>SO<sub>4</sub> = 3 : 1 (v/v). Jumlah tembaga yang terkandung di dalam papan PCB dianalisis menggunakan <em>X-ray fluorescense</em>. Tembaga yang terkandung di dalam PCB sebesar 57,7%. Pelarutan selektif dapat menurunkan kadar tembaga sehingga tembaga yang masih tersisa adalah sebesar 7,7 x 10<sup>-4 </sup>%. Penurunan kadar tembaga yang terkandung di dalam PCB mencapai 99,999%. Analisis spektrometri serapan atom dilakukan untuk mengetahui jumlah tembaga yang terlarut yaitu sebesar 25,415 mg/kg PCB.</p><p><strong>Leaching of Copper from Printed Circuit Board Waste with Hydrogen Peroxide</strong><strong>. </strong>Leaching of copper from printed circuit board (PCB) waste has been successfully performed. The copper metal contained in the PCB can be separated using a mixture of hydrogen peroxide and sulfuric acid with a variation of volume ratio is 0 : 1, 1 : 1, 2 : 1, 3 : 1, 4 : 1, and 5 : 1. Optimal separation is carried out by the immersion system for 3 days using H<sub>2</sub>O<sub>2</sub>/H<sub>2</sub>SO<sub>4</sub> = 3:1 (v/v). The amount of copper contained in the PCB was analyzed using X-ray fluorescence. The copper contained in the printed circuit board is 57.7%. The leaching process can decrease the copper content so that the remaining copper is 7.7 x 10<sup>-4</sup>%. The decrease of copper content contained in PCB reaches 99.999%. Analysis of atomic absorption spectrometry was conducted to determine the amount of dissolved copper that is 25.415 mg/kg PCB.</p>

Printed Circuit Board Propagating Faults

2004 ◽  
Author(s):  
Daren T. Slee
Keyword(s):  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Fault Tree Analysis ◽  
Circuit Board ◽  
Circuit Boards ◽  
Visual Examination ◽  
X Ray ◽  
Printed Circuit ◽  
Root Cause ◽  
X Ray Imaging

Abstract This paper is a review of propagating faults in printed circuit boards (PCBs) from the perspective of using the resulting burn and melted copper patterns to identify likely locations of fault initiation. Visual examination and x-ray imaging are the main techniques for examining PCB propagating faults. Once the likely fault initiation location has been identified, fault tree analysis can be used to determine the root cause for fault initiation. The paper discusses the mechanisms by which PCB propagating faults occur. The method of determining the likely area of initiation of the fault using visual examination of the PCB burn pattern, x-ray imaging, and the layout artwork for the PCB is discussed. The paper then goes on to discuss possible root-causes for the initiation of PCB propagating faults and some of their considerations.

Development of Advanced Non Destructive Techniques for Failure Analysis of PCBs and PCBAs

2012 ◽  
Author(s):  
Julien Perraud ◽  
Shaïma Enouz-Vedrenne ◽  
Jean-Claude Clement ◽  
Arnaud Grivon
Keyword(s):  
Failure Analysis ◽  
Printed Circuit Board ◽  
Acoustic Microscopy ◽  
Circuit Board ◽  
Printed Circuit Board Assembly ◽  
X Ray ◽  
Printed Circuit ◽  
Advanced Analysis ◽  
Non Destructive ◽  
Non Destructive Techniques

Abstract The continuous miniaturization trends followed by a vast majority of electronic applications results in always denser PCBs (Printed Circuit Board) designs and PCBAs (Printed Circuit Board Assembly) with increasing solder joint densities. Current high-end designs feature high layer count sequential build-up PCBs with fine lines/spaces and numerous stacked filled microvias, as well as closely spaced BGA/QFN components with pitches down to 0.4mm. In recent years, several 3D packaging approaches have emerged to further increase system integration by enabling the stacking of several dies or packages. This has translated for example into the advent of highly integrated complex System in Package (SiP) modules, Package-on-Package (PoP) assemblies or chips embedded in PCBs [1]. From a failure analysis (FA) perspective, this deep technology evolution is setting extreme challenges for accurately locating a failure site, especially when destructive techniques are not desired. The few conventional non-destructive techniques like optical or x-ray inspection are now practically becoming useless for high density PCB designs. This paper reviews several advanced analysis techniques that could be used to overcome these limitations. It will be shown through several examples how three non-destructive methods usually dedicated to package analyses can be efficiently adapted to PCBs and PCBAs: • Scanning Acoustic Microscopy (SAM) • 3D X-ray Computed Tomography (CT) • Infrared Thermography A case study of a flex-rigid board FA is presented to show the efficiency of these three techniques over classical techniques. In this example, not only the defect localization has been possible, but also the defect characterization without using destructive analysis.

Microfocus X-ray printed circuit board inspection system

Optik ◽  
2014 ◽  
Vol 125 (17) ◽  
pp. 4929-4931 ◽  
Author(s):  
Yu Wang ◽  
Mingquan Wang ◽  
Zhijie Zhang
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Inspection System ◽  
X Ray ◽  
Printed Circuit

Leaching of metals from printed circuit board powder by an Aspergillus niger culture supernatant and hydrogen peroxide

RSC Advances ◽  
2016 ◽  
Vol 6 (49) ◽  
pp. 43442-43452 ◽  
Author(s):  
U. Jadhav ◽  
C. Su ◽  
H. Hocheng
Keyword(s):  
Hydrogen Peroxide ◽  
Aspergillus Niger ◽  
Sodium Hydroxide ◽  
Printed Circuit Board ◽  
Culture Supernatant ◽  
Sodium Hydroxide Solution ◽  
Circuit Board ◽  
Printed Circuit ◽  
Hydroxide Solution ◽  
P Removal

Removal of chemical coating of PCB powder using 0.1 M sodium hydroxide solution.

A Simple, One-step, Seedless Hydrothermal Growth of ZnO Nanorods on Printed Circuit Board Substrate

2017 ◽  
Vol 33 (2) ◽  
Author(s):  
Mai Hong Hanh ◽  
Nguyễn Việt Tuyên ◽  
Pham Van Thanh ◽  
Hoang Chi Hieu
Keyword(s):  
Printed Circuit Board ◽  
Cell Structure ◽  
Zno Nanorods ◽  
Cost Effective ◽  
Circuit Board ◽  
X Ray Diffraction ◽  
High Quality ◽  
X Ray ◽  
Printed Circuit ◽  
One Step

Abstract: High quality, high density, and well-aligned zinc oxide (ZnO) nanorods have been synthesized on cost-effective printed circuit board (PCB) substrates via a simple, seedless, one-step, low-temperature hydrothermal method based galvanic cell structure. It was found that the outer diameters of the ZnO nanorods range from 50 nm to 400 nm. The as-grown ZnO nanorods prefer to grow along the c axis. The morphologies of the ZnO nanorods were investigated by scanning electron microscope (SEM) and X-ray diffraction (XRD). The crystallinity properties were characterized by Raman spectroscopy and photoluminescence (PL) spectroscopy.

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