A Simple, One-step, Seedless Hydrothermal Growth of ZnO Nanorods on Printed Circuit Board Substrate

2017 ◽  
Vol 33 (2) ◽  
Author(s):  
Mai Hong Hanh ◽  
Nguyễn Việt Tuyên ◽  
Pham Van Thanh ◽  
Hoang Chi Hieu
Keyword(s):  
Printed Circuit Board ◽  
Cell Structure ◽  
Zno Nanorods ◽  
Cost Effective ◽  
Circuit Board ◽  
X Ray Diffraction ◽  
High Quality ◽  
X Ray ◽  
Printed Circuit ◽  
One Step

Abstract: High quality, high density, and well-aligned zinc oxide (ZnO) nanorods have been synthesized on cost-effective printed circuit board (PCB) substrates via a simple, seedless, one-step, low-temperature hydrothermal method based galvanic cell structure. It was found that the outer diameters of the ZnO nanorods range from 50 nm to 400 nm. The as-grown ZnO nanorods prefer to grow along the c axis. The morphologies of the ZnO nanorods were investigated by scanning electron microscope (SEM) and X-ray diffraction (XRD). The crystallinity properties were characterized by Raman spectroscopy and photoluminescence (PL) spectroscopy.

EFFECT OF HYDROTHERMAL TIME ON THE GROWTH OF ZnO NANORODS

2020 ◽  
pp. 84-91
Author(s):  
Hanh
Keyword(s):  
Printed Circuit Board ◽  
Low Cost ◽  
Cell Structure ◽  
Zno Nanorods ◽  
Zinc Nitrate ◽  
Circuit Board ◽  
Nitrate Hexahydrate ◽  
Hydrothermal Time ◽  
One Step ◽  
Surface Morphologies

In this work, ZnO nanorods (NRs) were successfully grown on printed circuit board substrates (PCBs) by utilizing a one-step, seedless, low-cost hydrothermal method. It was shown that by implementing a galvanic cell structure in an aqueous solution of 80 mM of zinc nitrate hexahydrate and hexamethylenetetramine, ZnO NRs can directly grow on the PCBs substrate without the assistance of a seed layer. The effect of hydrothermal time on the surface morphologies, and the crystallinity of the as-grown ZnO nanorods (NRs) was also investigated. The as-grown ZnO NRs also exhibited a significant enhancement in vertical growth and their crystallinity with 5 hour growth.

In-Plane Electromagnetic Generator Fabricated on Printed Circuit Board Technology

2013 ◽  
Vol 479-480 ◽  
pp. 524-529
Author(s):  
C.T. Pan ◽  
F.T. Hsu ◽  
C.C. Nien ◽  
Z.H. Liu ◽  
Y.J. Chen ◽  
...  
Keyword(s):  
Printed Circuit Board ◽  
Energy Harvester ◽  
Cost Effective ◽  
Circuit Board ◽  
Outer Diameter ◽  
Magnetic Element ◽  
Induced Voltage ◽  
Element Analysis ◽  
Printed Circuit ◽  
Electromagnetic Generator

Small and efficient energy harvesters, as a renewable power supply, draw lots of attention in the last few years. This paper presents a planar rotary electromagnetic generator with copper coils fabricated by using printed circuit board (PCB) as inductance and Nd-Fe-B magnets as magnetic element. Coils are fabricated on PCB, which is presumably cost-effective and promising methods. 28-pole Nd-Fe-B magnets with outer diameter of 50 mm and thickness of 2 mm was sintered and magnetized, which can provide magnetic field of 1.44 Tesla. This harvester consists of planar multilayer with multi-pole coils and multi-pole permanent magnet, and the volume of this harvester is about 50x50x2.5 mm3. Finite element analysis is used to design energy harvesting system, and simulation model of the energy harvester is established. In order to verify the simulation, experiment data are compared with simulation result. The PCB energy harvester prototype can generate induced voltage 0.61 V and 13.29mW output power at rotary speed of 4,000 rpm.

scholarly journals CortiWatch: watch-based cortisol tracker

2019 ◽  
Vol 5 (9) ◽  
pp. FSO416 ◽  
Author(s):  
Paul Rice ◽  
Sayali Upasham ◽  
Badrinath Jagannath ◽  
Roshan Manuel ◽  
Madhavi Pali ◽  
...  
Keyword(s):  
Printed Circuit Board ◽  
Cost Effective ◽  
Circuit Board ◽  
Electrochemical Technique ◽  
Label Free ◽  
Printed Circuit ◽  
Electrochemical Testing ◽  
Testing Techniques ◽  
Small Form Factor ◽  
A Current

Sweat-based analytics have recently caught the attention of researchers and medical professionals alike because they do not require professionally trained personnel or invasive collection techniques to obtain a sample. The following presents a small form-factor biosensor for reporting physiological ranges of cortisol present in ambient sweat (8–151 ng/ml). This device obtains cortisol measurements through low volumes of unstimulated sweat from the user’s wrist. We designed a potentiostatic circuit on a printed circuit board to perform electrochemical testing techniques. The detection modality developed for quantifying sensor response to varying cortisol concentrations is a current based electrochemical technique, chronoamperometry (CA). From the results, the sensor can detect cortisol in the physiologically relevant ranges of cortisol; thus, the sensor is a noninvasive, label free, cost-effective solution for tracking cortisol levels for circadian diagnostics.

Printed Circuit Board Propagating Faults

2004 ◽  
Author(s):  
Daren T. Slee
Keyword(s):  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Fault Tree Analysis ◽  
Circuit Board ◽  
Circuit Boards ◽  
Visual Examination ◽  
X Ray ◽  
Printed Circuit ◽  
Root Cause ◽  
X Ray Imaging

Abstract This paper is a review of propagating faults in printed circuit boards (PCBs) from the perspective of using the resulting burn and melted copper patterns to identify likely locations of fault initiation. Visual examination and x-ray imaging are the main techniques for examining PCB propagating faults. Once the likely fault initiation location has been identified, fault tree analysis can be used to determine the root cause for fault initiation. The paper discusses the mechanisms by which PCB propagating faults occur. The method of determining the likely area of initiation of the fault using visual examination of the PCB burn pattern, x-ray imaging, and the layout artwork for the PCB is discussed. The paper then goes on to discuss possible root-causes for the initiation of PCB propagating faults and some of their considerations.

Development of Advanced Non Destructive Techniques for Failure Analysis of PCBs and PCBAs

2012 ◽  
Author(s):  
Julien Perraud ◽  
Shaïma Enouz-Vedrenne ◽  
Jean-Claude Clement ◽  
Arnaud Grivon
Keyword(s):  
Failure Analysis ◽  
Printed Circuit Board ◽  
Acoustic Microscopy ◽  
Circuit Board ◽  
Printed Circuit Board Assembly ◽  
X Ray ◽  
Printed Circuit ◽  
Advanced Analysis ◽  
Non Destructive ◽  
Non Destructive Techniques

Abstract The continuous miniaturization trends followed by a vast majority of electronic applications results in always denser PCBs (Printed Circuit Board) designs and PCBAs (Printed Circuit Board Assembly) with increasing solder joint densities. Current high-end designs feature high layer count sequential build-up PCBs with fine lines/spaces and numerous stacked filled microvias, as well as closely spaced BGA/QFN components with pitches down to 0.4mm. In recent years, several 3D packaging approaches have emerged to further increase system integration by enabling the stacking of several dies or packages. This has translated for example into the advent of highly integrated complex System in Package (SiP) modules, Package-on-Package (PoP) assemblies or chips embedded in PCBs [1]. From a failure analysis (FA) perspective, this deep technology evolution is setting extreme challenges for accurately locating a failure site, especially when destructive techniques are not desired. The few conventional non-destructive techniques like optical or x-ray inspection are now practically becoming useless for high density PCB designs. This paper reviews several advanced analysis techniques that could be used to overcome these limitations. It will be shown through several examples how three non-destructive methods usually dedicated to package analyses can be efficiently adapted to PCBs and PCBAs: • Scanning Acoustic Microscopy (SAM) • 3D X-ray Computed Tomography (CT) • Infrared Thermography A case study of a flex-rigid board FA is presented to show the efficiency of these three techniques over classical techniques. In this example, not only the defect localization has been possible, but also the defect characterization without using destructive analysis.

A Novel Low Cost Package for Radio Frequency Applications

2013 ◽  
Vol 135 (2) ◽  
Author(s):  
Sandeep Chaturvedi ◽  
Shiban K. Koul
Keyword(s):  
High Frequency ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Cost Effective ◽  
Circuit Board ◽  
Test Results ◽  
Printed Circuit ◽  
Pcb Manufacturing ◽  
Manufacturing Techniques ◽  
Commercial Applications

Design, fabrication, and test results of a novel 3-layer RF package using a commonly available high frequency laminate are presented in this paper. The developed package can be manufactured using standard multilayer printed circuit board (PCB) manufacturing techniques making it cost effective for commercial applications. The package exhibits excellent RF characteristics up to 6 GHz.

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