New Pneumatic Rubber Leg Mechanism for Omnidirectional Locomotion

2014 ◽  
Vol 8 (2) ◽  
pp. 222-230 ◽  
Author(s):  
Mohamed Najib Ribuan ◽  
◽  
Koichi Suzumori ◽  
Shuichi Wakimoto

This paper describes a new pneumatic rubber leg mechanism for omnidirectional locomotion. The new mechanism was adopted from a pneumatic balloon actuator where translation and bending motions are produced as a result of balloon deformation. It was constructed using five chambers: one on the top and centered over four bottom chambers arranged in a square. Several possible designs were simulated to achieve the optimal design using a non-linear finite element analysis that considered the design parameters and the geometrical and material non-linearity of the elements. Prototyping was then performed using a rapid and efficient silicone rubber molding fabrication process based on computer-aided design and manufacturing. The experimental results were in good agreement with the analytical results. In conclusion, we have established a new rubber leg mechanism with a high degree of freedom to realize omnidirectional locomotion for a soft robot base, delicate object conveyance, and / or microscope stage applications.

2021 ◽  
Author(s):  
Nikolaos Skampardonis ◽  
SOTIRIOS TSIRKAS ◽  
Spyridon Grammatikopoulos

Abstract Nowadays, many components which were earlier cast or machined have now been replaced by steel metal stampings. Material economy and the resultant reduction in weight and cost, high productivity and a high degree of possible precision have made press-work essential for many mass-produced products such as electronic appliances, utensils and car parts. Although, laser-cut technology is widely developed and more flexible in terms of variety of produced components, it cannot reach the extremely high productivity rates of a progressive die. Progressive die can perform a sequence of operations, in different stations at a single stroke of press. In this work, an innovative progressive die consists of two stations was designed, in order to produce a complex metal part with three different manufacturing processes. The components of the die have been calculated by mathematical formulas and empirical data, designed with Computer Aided Design software and analyzed by Finite Element Analysis tool.


Author(s):  
L Q Tang ◽  
D N Moreton

The timing scroll is an important feeding mechanism on packaging lines. As packaging line speeds have increased and the shape of containers has become more diverse, the techniques used for the design and manufacture of such timing scrolls have become critical for successful packaging line performance. Since 1980, various techniques have evolved to improve scroll design, manufacture and the associated line performance. In recent years, as CAD (computer aided design), CAM (computer aided manufacture) and CNC (computer numerical control) techniques have evolved, scroll design and manufacturing techniques began to be linked with computer techniques. In this paper, a scroll design and manufacturing package is presented which can be run on a minicomputer, such as a μ-VAX on an IBM PC clone. This scroll package can produce a timing scroll for any type of container with a correct pocket shape and good dynamic characteristic. Tests using carefully chosen containers have been made using this package and the results indicate that the scrolls obtained by this package have the correct pocket shape and good line performance. However, the design of a good pick-up geometry for some container shapes remains a problem.


2015 ◽  
Vol 645-646 ◽  
pp. 70-74 ◽  
Author(s):  
Min Zhong ◽  
Yu Hang Zhao ◽  
Shou Mian Chen ◽  
Ming Li ◽  
Shao Hai Zeng ◽  
...  

An embedded SiGe layer was applied in the source/drain areas (S/D) of a field-effect transistor to boost the performance in the p channels. Raised SiGe S/D plays a critical role in strain engineering. In this study, the relationship between the SiGe overfilling and the enhancement of channel stress was investigated. Systematic technology computer aided design (TCAD) simulations of the SiGe overfill height in a 40 nm PMOS were performed. The simulation results indicate that a moderate SiGe overfilling induces the highest stress in the channel. Corresponding epitaxial growth experiments were done and the obtained experimental data was in good agreement with the simulation results. The effect of the SiGe overfilling is briefly discussed. The results and conclusions presented within this paper might serve as useful references for the optimization of the embedded SiGe stressor for 40 nm logic technology node and beyond.


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