In-Situ Study of Electrochemical Migration of Tin in The Presence of Bromide Ion

Abstract The miniaturization of electronic devices and the consequent decrease in the distance between conductive lines have increased the risk of short circuit failure due to electrochemical migration (ECM). The presence of ionic contaminants in the devices can accelerate the ECM process. This work systematically investigates the ECM of tin (Sn) in the presence of bromide ions (Br−) in the range of 10-6 M to 1.0 M. Water drop test (WDT) was conducted in the two-probe semiconductor characterization system under an optical microscope for in-situ observations. Anodic polarization test (APT) was carried out to study the correlation between corrosion properties of Sn and its ECM behaviour. The products of ECM were characterized by scanning electron microscope coupled with an energy dispersive X-rays spectrometer (SEM/ EDX) and X-ray photoelectron spectrometer (XPS). The results confirm that the rate of anodic dissolution of Sn monotonously increases with Br− concentration. However, the probability of ECM failure follows a normal distribution initially, but later increases with the Br− concentration. The main products of the ECM reactions are identified as Sn dendrites and tin hydroxide precipitates. The mechanism of the ECM process of Sn in the presence of Br− is also suggested.

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In-situ study of electrochemical migration of tin in the presence of bromide ion

Scientific Reports ◽

10.1038/s41598-021-95276-0 ◽

2021 ◽

Vol 11 (1) ◽

Author(s):

Ee Lynn Lee ◽

A. S. M. A. Haseeb ◽

Wan Jeffrey Basirun ◽

Yew Hoong Wong ◽

Mohd Faizul Mohd Sabri ◽

...

Keyword(s):

Water Drop ◽

Short Circuit ◽

Optical Microscope ◽

In Situ Observation ◽

Electrochemical Migration ◽

X Rays ◽

Corrosion Properties ◽

Bromide Ion ◽

Ionic Contaminants

AbstractThe miniaturization of electronic devices and the consequent decrease in the distance between conductive lines have increased the risk of short circuit failure due to electrochemical migration (ECM). The presence of ionic contaminants affects the ECM process. This work systematically investigates the ECM of tin (Sn) in the presence of bromide ions (Br−) in the range of 10−6 M to 1.0 M. Water drop test (WDT) was conducted in the two-probe semiconductor characterization system under an optical microscope as an in-situ observation. Polarization test was carried out to study the correlation between the corrosion properties of Sn and its ECM behaviour. The products of ECM were characterized by scanning electron microscope coupled with an energy dispersive X-rays spectrometer (SEM/EDX) and X-ray photoelectron spectrometer (XPS). The results confirm that the rate of anodic dissolution of Sn monotonously increases with the Br− concentration. However, the probability of ECM failure follows a normal distribution initially, but later increases with the Br− concentration. The main products of the ECM reactions are identified as Sn dendrites and tin hydroxide precipitates. The mechanisms of the ECM process of Sn in the presence of Br− are also suggested.

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In-situ observation on electrochemical migration of lead-free solder joints under water drop test

2008 International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2008.4607147 ◽

2008 ◽

Cited By ~ 3

Author(s):

Y.H. Xia ◽

W. Jillek ◽

E. Schmitt

Keyword(s):

Solder Joints ◽

Water Drop ◽

Drop Test ◽

Lead Free ◽

In Situ Observation ◽

Electrochemical Migration ◽

Lead Free Solder ◽

Water Drop Test ◽

Free Solder

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Evaluation Method for Sensitivity of Electrochemical Migration by Quantity of Electricity for Electrochemical Reaction in Water Drop Test.

QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY ◽

10.2207/qjjws.18.146 ◽

2000 ◽

Vol 18 (1) ◽

pp. 146-152

Author(s):

Kozo FUJIMOTO ◽

Kazumi TANAKA ◽

Shuji NAKATA

Keyword(s):

Evaluation Method ◽

Electrochemical Reaction ◽

Water Drop ◽

Drop Test ◽

Electrochemical Migration ◽

Water Drop Test ◽

Reaction In Water

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Effect of Phosphorus and Nickel on Electrochemical Migration of Sn-3Ag-0.7Cu Solder Paste in Simulated Body Fluid

Solid State Phenomena ◽

10.4028/www.scientific.net/ssp.273.61 ◽

2018 ◽

Vol 273 ◽

pp. 61-65 ◽

Cited By ~ 2

Author(s):

Norinsan Kamil Othman ◽

Emee Marina Salleh ◽

C. Sarveswaran ◽

Fakhrozi Che Ani

Keyword(s):

Corrosion Resistance ◽

Simulated Body Fluid ◽

Body Fluid ◽

Water Drop ◽

Electrochemical Migration ◽

Time To Failure ◽

Solder Paste ◽

Water Drop Test ◽

Sbf Solution ◽

Mean Time

Electrochemical migration (ECM) behaviour of Sn-3Ag-0.7Cu and Sn-3Ag-0.7Cu-0.03P-0.005Ni solder alloys were investigated using simulated body fluid (SBF) solution. In electronic devices, ECM phenomenon potentially leads to incompetence or failure of the whole devices. According to water drop test (WDT), mean-time-to-failure (MTTF) of commercially used Sn-3Ag-0.7Cu solder alloy was prolonged with addition of phosphorus (P) and nickel (Ni) as alloying elements. According to microstructure of each solder paste alloy which was observed using field emission scanning electron microscope (FESEM), dendrite structure in Sn-3Ag-0.7Cu-0.03P-0.005 Ni solder was lesser than in plain the Sn-3Ag-0.7Cu. This phenomenon suggested that presence of P and Ni retarded the growth of dendritic thus improved its corrosion resistance. Therefore, Sn-3Ag-0.7Cu-0.03P-0.005Ni possessed a good corrosion resistance in SBF medium.

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In-situ observation of graphene using an optical microscope

Applied Surface Science Advances ◽

10.1016/j.apsadv.2021.100138 ◽

2021 ◽

Vol 6 ◽

pp. 100138

Author(s):

Mikihiro Kato ◽

Sujun Guan ◽

Xinwei Zhao

Keyword(s):

Optical Microscope ◽

In Situ Observation

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In-Situ Measurement of Power Loss for Crystalline Silicon Modules Undergoing Thermal Cycling and Mechanical Loading Stress Testing

Energies ◽

10.3390/en14010072 ◽

2020 ◽

Vol 14 (1) ◽

pp. 72

Author(s):

Sergiu Spataru ◽

Peter Hacke ◽

Dezso Sera

Keyword(s):

Thermal Cycling ◽

Power Loss ◽

Stress Testing ◽

Series Resistance ◽

Short Circuit ◽

In Situ Measurement ◽

Mechanical Degradation ◽

Model Parameters ◽

The Impact

An in-situ method is proposed for monitoring and estimating the power degradation of mc-Si photovoltaic (PV) modules undergoing thermo-mechanical degradation tests that primarily manifest through cell cracking, such as mechanical load tests, thermal cycling and humidity freeze tests. The method is based on in-situ measurement of the module’s dark current-voltage (I-V) characteristic curve during the stress test, as well as initial and final module flash testing on a Sun simulator. The method uses superposition of the dark I-V curve with final flash test module short-circuit current to account for shunt and junction recombination losses, as well as series resistance estimation from the in-situ measured dark I-Vs and final flash test measurements. The method is developed based on mc-Si standard modules undergoing several stages of thermo-mechanical stress testing and degradation, for which we investigate the impact of the degradation on the modules light I-V curve parameters, and equivalent solar cell model parameters. Experimental validation of the method on the modules tested shows good agreement between the in-situ estimated power degradation and the flash test measured power loss of the modules, of up to 4.31 % error (RMSE), as the modules experience primarily junction defect recombination and increased series resistance losses. However, the application of the method will be limited for modules experiencing extensive photo-current degradation or delamination, which are not well reflected in the dark I-V characteristic of the PV module.

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Effect of in situ tempering on the mechanical, microstructural and corrosion properties of 316L stainless steel laser-cladded coating on mild steel

The International Journal of Advanced Manufacturing Technology ◽

10.1007/s00170-021-07886-7 ◽

2021 ◽

Author(s):

Rizwan Abdul Rahman Rashid ◽

Muhammed Awais Javed ◽

Cameron Barr ◽

Suresh Palanisamy ◽

Neil Matthews ◽

...

Keyword(s):

Stainless Steel ◽

Mild Steel ◽

316L Stainless Steel ◽

Corrosion Properties

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In Situ Testing and X Rays Radiation Effects of Pt/Bi3.15Nd0.85Ti3O12/Pt Ferroelectric Capacitors

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.712-715.293 ◽

2013 ◽

Vol 712-715 ◽

pp. 293-297

Author(s):

Li Li

Keyword(s):

Radiation Effects ◽

Hysteresis Loops ◽

Electrical Performance ◽

Hysteresis Curve ◽

X Rays ◽

Shanghai Synchrotron Radiation Facility ◽

X Ray ◽

In The Beginning ◽

Ferroelectric Capacitors

Pt/Bi3.15Nd0.85Ti3O12(BNT)/Pt ferroelectric capacitors were monitored using in situ X-ray irradiation with 10 keV at BL14B1 beamline (Shanghai Synchrotron Radiation Facility). BL14B1 combined with a ferroelectric analyzer enabled measurements in situ of electrical performance. The hysteresis curve (PE) of distortion depended on the polarization during irradiation, but the diffracted intensities of the (117) peak did not change in the beginning. ThePEcurve had a negligible change from 2.09×109Gy to 4.45×109Gy. Finally, bothPrandPr+very rapidly increased, but the intensities of (117) decreased. The hysteresis loops were remarkably deformed at the maximum total dose of 4.87×109Gy.

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Applications of High-Resolution Powder X-Ray Diffraction

Solid State Phenomena ◽

10.4028/www.scientific.net/ssp.130.7 ◽

2007 ◽

Vol 130 ◽

pp. 7-14 ◽

Cited By ~ 4

Author(s):

Andrew N. Fitch

Keyword(s):

High Resolution ◽

Synchrotron Radiation ◽

Powder Diffraction ◽

X Rays ◽

X Ray Diffraction ◽

Crystalline Materials ◽

X Ray ◽

Structural Characterisation ◽

Pdf Analysis

The highly-collimated, intense X-rays produced by a synchrotron radiation source can be harnessed to build high-resolution powder diffraction instruments with a wide variety of applications. The general advantages of using synchrotron radiation for powder diffraction are discussed and illustrated with reference to the structural characterisation of crystalline materials, atomic PDF analysis, in-situ and high-throughput studies where the structure is evolving between successive scans, and the measurement of residual strain in engineering components.

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