scholarly journals Structural and bonding characteristics of Ga-containing polar intermetallics

2018 ◽  
Author(s):  
Asa Toombs
2018 ◽  
Vol 20 (41) ◽  
pp. 26372-26385 ◽  
Author(s):  
I. P. Rusinov ◽  
P. Golub ◽  
I. Yu. Sklyadneva ◽  
A. Isaeva ◽  
T. V. Menshchikova ◽  
...  

Surface electronic spectra, surface and bulk properties as well as the underlying chemical bonding characteristics in topological insulators with complex bonding patterns are considered for the example of cubic, polar intermetallics KNa2Bi, K3Bi and Rb3Bi (with the general formula A3Bi, A – alkali metal).


Author(s):  
Nilanjan Roy ◽  
Sucharita Giri ◽  
Harshit ◽  
Partha P. Jana

Abstract The site preference and atomic ordering of the ternary Rh5Ga2As have been investigated using first-principles density functional theory (DFT). An interesting atomic ordering of two neighboring elements Ga and As reported in the structure of Rh5Ga2As by X-ray diffraction data only is confirmed by first-principles total-energy calculations. The previously reported experimental model with Ga/As ordering is indeed the most stable in the structure of Rh5Ga2As. The calculation detected that there is an obvious trend concerning the influence of the heteroatomic Rh–Ga/As contacts on the calculated total energy. Interestingly, the orderly distribution of As and Ga that is found in the binary GaAs (Zinc-blende structure type), retained to ternary Rh5Ga2As. The density of states (DOS) and Crystal Orbital Hamiltonian Population (COHP) are calculated to enlighten the stability and bonding characteristics in the structure of Rh5Ga2As. The bonding analysis also confirms that Rh–Ga/As short contacts are the major driving force towards the overall stability of the compound.


Fuel ◽  
2016 ◽  
Vol 184 ◽  
pp. 799-807 ◽  
Author(s):  
Bin Zhou ◽  
Lei Shi ◽  
Qingya Liu ◽  
Zhenyu Liu

2017 ◽  
Vol 23 (44) ◽  
pp. 10516-10521 ◽  
Author(s):  
Qisheng Lin ◽  
Kaiser Aguirre ◽  
Scott M. Saunders ◽  
Timothy A. Hackett ◽  
Yong Liu ◽  
...  

1980 ◽  
Vol 59 (2) ◽  
pp. 124-128 ◽  
Author(s):  
Y. Galindo ◽  
K. McLachlan ◽  
Z. Kasloff

A silver-plating technique was developed in an effort to produce good mechanical bonding characteristics between stainless steelpins and amalgam. Metallographic microscope and scanning electron microscope (SEM) studies were made to assess the presence, or otherwise, of such a bond between (a) the silver layer plating and the surface of the stainless steel pins, and (b) and silver plating and the amalgam. Unplated stainless steel and sterling silver pins were used as a control and as a comparison, respectively. A "rubbing" technique of condensation was devised to closely adapt amalgam to the pins. It is concluded that there is strong evidence for the existence of a good bond between the plated pins and amalgam. The mechanical performance of the bond is discussed elsewhere. 1.


1989 ◽  
Vol 41 (11) ◽  
pp. 1146-1153 ◽  
Author(s):  
Roy S. Marlow

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