SOLDER JOINTS RELIABILITY PREDICTION THERMO-MECHANICAL FATIGUE: THE MODELS BASED ON PLASTIC DEFORMATION

2017 ◽  
Vol 2 ◽  
pp. 164-172
Author(s):  
K. Tikhomirov ◽  
S. Alekseev
Keyword(s):  
Plastic Deformation ◽  
Solder Joints ◽  
Reliability Prediction ◽  
Mechanical Fatigue

scholarly journals Effect of Ni3Sn4 on the Thermo-Mechanical Fatigue Life of Solder Joints in 3D IC

2021 ◽  
Vol 8 ◽  
Author(s):  
Liang Zhang ◽  
Su-Juan Zhong
Keyword(s):  
Shear Stress ◽  
Diffusion Coefficient ◽  
Fatigue Life ◽  
Solder Joints ◽  
Fe Simulation ◽  
Transient Liquid Phase ◽  
Bonding Time ◽  
3D Integration ◽  
Mechanical Fatigue ◽  
Tlp Bonding

In this article, the 3D integration with Ni/Sn/Ni joints was conducted using transient liquid phase (TLP) bonding (250°C, 0.2 N) with different bonding time. After TLP bonding, plane-type Ni3Sn4 intermetallic compound (IMC) was observed, and when the bonding time is 180 min, complete Ni3Sn4 was found. The diffusion coefficient D was determined to be 32.4 μm2/min. Based on the finite element (FE) simulation, the results demonstrated that the shear stress and equivalent creep strain increased obviously with an increase in the IMC thickness; the results calculated show that the IMC thickness impacts the fatigue life of solder joints significantly, and the fatigue life decreases notably with an increase in the Ni3Sn4 thickness.

437 Strength reliability prediction for solder joints of electronics products using response surface methodology

2001 ◽  
Vol 2001.14 (0) ◽  
pp. 477-478
Author(s):  
Kenji HIROHATA ◽  
Minoru MUKAI ◽  
Noriyasu KAWAMURA ◽  
Takashi KAWAKAMI ◽  
Kei MATSUOKA ◽  
...  
Keyword(s):  
Response Surface Methodology ◽  
Response Surface ◽  
Solder Joints ◽  
Reliability Prediction
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