Accelerated reliability - thermal and mechanical fatigue solder joints methodologies

2003 ◽  
Author(s):  
N. Strifas ◽  
C. Vaughan ◽  
M. Ruzzene
Keyword(s):  
Solder Joints ◽  
Mechanical Fatigue

scholarly journals Effect of Ni3Sn4 on the Thermo-Mechanical Fatigue Life of Solder Joints in 3D IC

2021 ◽  
Vol 8 ◽  
Author(s):  
Liang Zhang ◽  
Su-Juan Zhong
Keyword(s):  
Shear Stress ◽  
Diffusion Coefficient ◽  
Fatigue Life ◽  
Solder Joints ◽  
Fe Simulation ◽  
Transient Liquid Phase ◽  
Bonding Time ◽  
3D Integration ◽  
Mechanical Fatigue ◽  
Tlp Bonding

In this article, the 3D integration with Ni/Sn/Ni joints was conducted using transient liquid phase (TLP) bonding (250°C, 0.2 N) with different bonding time. After TLP bonding, plane-type Ni3Sn4 intermetallic compound (IMC) was observed, and when the bonding time is 180 min, complete Ni3Sn4 was found. The diffusion coefficient D was determined to be 32.4 μm2/min. Based on the finite element (FE) simulation, the results demonstrated that the shear stress and equivalent creep strain increased obviously with an increase in the IMC thickness; the results calculated show that the IMC thickness impacts the fatigue life of solder joints significantly, and the fatigue life decreases notably with an increase in the Ni3Sn4 thickness.

Microstructure coarsening during thermo-mechanical fatigue of Pb-Sn solder joints

1997 ◽  
Vol 26 (7) ◽  
pp. 774-782 ◽  
Author(s):  
P. L. Hacke ◽  
A. F. Sprecher ◽  
H. Conrad
Keyword(s):  
Solder Joints ◽  
Mechanical Fatigue
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