РЕЗУЛЬТАТЫ ПРИМЕНЕНИЯ ОТЕЧЕСТВЕННОГО ОБОРУДОВАНИЯ ДЛЯ РЕАЛИЗАЦИИ КЛЮЧЕВЫХ ТЕХНОЛОГИЧЕСКИХ ОПЕРАЦИЙ ПРИ ИЗГОТОВЛЕНИИ СВЧ ЭКБ НА ОСНОВЕ GAN И GAAS

2020 ◽  
Vol 96 (3s) ◽  
pp. 494-497
Author(s):  
А.Н. Алексеев ◽  
С.И. Петров

Показаны результаты применения отечественного оборудования (ЗАО «НТО») для разработки и проведения ключевых технологических операций при изготовлении мощных полевых транзисторов и МИС СВЧ-диапазона на основе GaN и GaAs. Обсуждаются особенности и результаты оптимизации технологических установок для таких операций, как выращивание гетероструктур методом МЛЭ, нанесение контактной и затворной металлизации при помощи электронно-лучевого напыления, отжиг омических контактов, травление меза-изоляции и нанесение диэлектрика при помощи плазмохимических методов. Кроме того, представлены особенности установок и технологических процессов глубокого плазмохимического травления для формирования сквозных металлизированных отверстий в SiC и GaAs, а также прецизионного травления GaN и GaAs. Продемонстрированы технологические результаты использования оборудования ЗАО «НТО» в производственном цикле АО «Светлана-Рост». The paper highlights the results of using domestic equipment (SemiTEq JSC) for the development and implementation of key technological operations for producing GaN and GaAs based power microwave transistors. Features and results of optimization of the technological equipment have also been discussed for such operations as: MBE growth of heterosructures, deposition of the contacts and gate metallization using electron beam evaporation and ohmic contacts annealing, plasma etching of mesa isolation and PECVD of the dielectric. In addition, the features of systems for deep plasma etching of SiC and GaAs as well as GaN and GaAs precision etching have been presented. The technological results of using SemiTEq equipment in the production cycle of Svetlana-Rost JSC have been demonstrated.

2020 ◽  
Vol 96 (3s) ◽  
pp. 343-346
Author(s):  
А.Н. Алексеев ◽  
С.И. Петров

Представлены результаты разработки базовых технологических процессов, используемых при получении мощных полевых транзисторов и МИС СВЧ-диапазона на основе GaN и GaAs, таких как: выращивание гетероструктур методом МЛЭ, металлизация и отжиг омических контактов, травление мезаизоляции, затворная металлизация, пассивация диэлектриком и др. Обсуждаются основные проблемы и пути их решения, в том числе особенности технологических процессов глубокого плазмохимического травления для формирования сквозных металлизированных отверстий в SiC и GaAs. Отдельное внимание уделено вопросам обеспечения однородности и воспроизводимости и их влиянию на выход годных структур. Продемонстрированы результаты использования ряда технологических процессов в производственном цикле АО «Светлана-Рост» и других предприятий радиоэлектронной промышленности. The paper presents the results of the development of basic technological processes used in the production of microwave high-power field-effect transistors based on GaN and GaAs such as: MBE growth, metallization and annealing of ohmic contacts, etching of mesa insulation, gate metallization, passivation by dielectric etc. The main problems and solutions including features of technological processes of deep plasma-chemical etching in SiC and GaAs have been discussed. Special attention is paid to the issues of uniformity and reproducibility and their impact on the yield of structures. The results of the use of technological processes in the production cycle of Svetlana-Rost JSC and other enterprises of the radio-electronic industry have been demonstrated.


Author(s):  
K. L. Enisherlova ◽  
B. K. Medvedev ◽  
E. M. Temper ◽  
V. I. Korneev

Abstract. In this paper are considers the effect of the microrelief, dislocation structure and other defects of the epitaxial layers of the source and drain regions of the nitride HEMT transistors on the parameters of the formed ohmic contacts. The studies were carried out directly on high−power microwave transistors made of GaN/AlGaN/GaN/SiC heterostructures. Ohmic burning contacts were formed using the compositions Ti—Al—Mo—Au and Ti—Al—Ni—Au. To estimation the structural features of the contact areas, the surface microrelief at the interface of the burned contact/AlGaN and the defects formed on its surface was studied. It is shown that the resistance of the source and drain regions is largely determined by the surface microstructure at the boundary. Experimentally shown is the formation of a conducting layer in AlGaN under the ohmic contacts. The possibility of the formation of a new type of structural defects with a high aspect ratio in the contact and active areas of the devices during the formation of ohmic burned contacts is demonstrated. It is shown that the appearance of high densities of such defects leads to an increase of the device leakage currents.


2002 ◽  
Vol 743 ◽  
Author(s):  
H. P. Hall ◽  
M. A. Awaah ◽  
A. Kumah ◽  
K. Das ◽  
F. Semendy

ABSTRACTElectrical contacts to both n and p-type GaN films have been investigated using electron-beam evaporated and sputtered films of metals such as Al, Au, Cr, Cu, Ni, Pt, and Ti. Films deposited by electron-beam evaporation for the n-type films with doping levels of 1 × 1018/cm3 and lower showed rectifying characteristics with all the metals studied with the exception of Al. Aluminum contact diodes were ohmic in the as-deposited state. The Pt rectifying contact was near-ideal with an ideality factor close to 1.0. Ideality factors for the other metals were much greater than 1. This deviation from thermionic behavior was interpreted as space charge limited current conduction in the presence of deep-level states. Sputtered films showed very similar characteristics to electron-beam deposited films, with the exception of Ti. The Ti contact was ohmic in the as-deposited state. Non-linear Cu contacts to n-type films became ohmic on annealing. However, for p-type films, Ar ion sputter-cleaning prior to metal deposition by sputtering created ohmic contacts with Cu and Pt. Low resistance ohmic contacts were achieved by ion implantation and anneal of Si in n-type and Mg in p-type films, prior to metallization. The implant parameters and anneal temperatures are currently being optimized.


1985 ◽  
Vol 131 (3-4) ◽  
pp. 261-266 ◽  
Author(s):  
M. Denhoff ◽  
B. Heinrich ◽  
A.E. Curzon ◽  
S. Gygax

2007 ◽  
Vol 201 (13) ◽  
pp. 6078-6083 ◽  
Author(s):  
C. Rebholz ◽  
M.A. Monclus ◽  
M.A. Baker ◽  
P.H. Mayrhofer ◽  
P.N. Gibson ◽  
...  

1990 ◽  
Vol 29 (5) ◽  
pp. 1068-1073 ◽  
Author(s):  
G. A. Ozin ◽  
Mark P. Andrews ◽  
C. G. Francis ◽  
H. X. Huber ◽  
K. Molnar

2005 ◽  
Vol 239 (3-4) ◽  
pp. 327-334 ◽  
Author(s):  
Ming Zhu ◽  
Peng Chen ◽  
Ricky K.Y. Fu ◽  
Weili Liu ◽  
Chenglu Lin ◽  
...  

1989 ◽  
Vol 136 (9) ◽  
pp. 2736-2740 ◽  
Author(s):  
Ken‐ichi Onisawa ◽  
Kazuo Taguchi ◽  
Moriaki Fuyama ◽  
Katsumi Tamura ◽  
Yoshio Abe ◽  
...  

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