Thin Film Thermocouple Sensors on CMC Capable of Measuring 1500 °C High Surface Temperatures

Author(s):  
Zhonglin Ji ◽  
Franklin L. Duan ◽  
Zhiliang Hong ◽  
Wang Chao
1997 ◽  
Vol 503 ◽  
Author(s):  
Yongxia Zhang ◽  
Yanwei Zhang ◽  
Juliana Blaser ◽  
T. S. Sriiram ◽  
R. B. Marcus

ABSTRACTA thermal microprobe has been designed and built for high resolution temperature sensing. The thermal sensor is a thin-film thermocouple junction at the tip of an Atomic Force Microprobe (AFM) silicon probe needle. Only wafer-stage processing steps are used for the fabrication. The thermal response over the range 25–s 4.5–rovolts per degree C and is linear.


Author(s):  
Lukas Seeholzer ◽  
Stefan Süssmaier ◽  
Fabian Kneubühler ◽  
Konrad Wegener

AbstractEspecially for slicing hard and brittle materials, wire sawing with electroplated diamond wires is widely used since it combines a high surface quality with a minimum kerf loss. Furthermore, it allows a high productivity by machining multiple workpieces simultaneously. During the machining operation, the wire/workpiece interaction and thus the material removal conditions with the resulting workpiece quality are determined by the material properties and the process and tool parameters. However, applied to machining of carbon fibre reinforced polymers (CFRP), the process complexity potentially increases due to the anisotropic material properties, the elastic spring back potential of the material, and the distinct mechanical wear due to the highly abrasive carbon fibres. Therefore, this experimental study analyses different combinations of influencing factors with respect to process forces, workpiece surface temperatures at the wire entrance, and the surface quality in wire sawing unidirectional CFRP material. As main influencing factors, the cutting and feed speeds, the density of diamond grains on the wire, the workpiece thickness, and the fibre orientation of the CFRP material are analysed and discussed. For the tested parameter settings, it is found that while the influence of the grain density is negligible, workpiece thickness, cutting and feed speeds affect the process substantially. In addition, higher process forces and workpiece surface temperatures do not necessarily deteriorate the surface quality.


2002 ◽  
Vol 408 (1-2) ◽  
pp. 270-274 ◽  
Author(s):  
Helin Zou ◽  
D.M. Rowe ◽  
S.G.K. Williams

1997 ◽  
Vol 488 ◽  
Author(s):  
J. Collet ◽  
O. Tharaud ◽  
C. Legrand ◽  
A. Chapoton ◽  
D. Vuillaume

AbstractHigh performance thin-film transistors (TFT) made of conducting oligomers are obtained when the organic films are well ordered at a molecular level. Highly ordered films are obtained provided that oligomers have a sufficient mobility on the substrate surface during film formation. One possible way to fulfill such a condition is to evaporate oligomers on heated substrates [1,2]. In this work, we suggest that a high surface mobility is obtained by a chemical functionalization of the silicon dioxide surface, and the corresponding improvements of the TFT performances are evidenced. A self-assembled monolayer of octadecyltrichlorosilane (OTS) was deposited on the SiO2 by chemisorption from solution before the evaporation of sexithiophene film. Room temperature current-voltage measurements indicate that the presence of the OTS monolayer improves TFT performances : threshold voltage is decreased, subthreshold slope is decreased, a high current ratio Ion/Ioff is obtained for a reduced gate voltage excursion, the fieldeffect mobility is slightly increased. We have also fabricated and characterized a nanometer scale organic FET (gate length = 50 nm) made of 6T films and only with a self-assembled monolayer as the insulating film between the degenerated silicon substrate (gate) and the conducting channel (no thick SiO2, we call it « oxide-free » organic FET). Performances of this nanometer size organic FETs are the following : subthreshold slope of 0.35V/dec, threshold voltage of −1.3V, effective mobility of 2×10−4 cm2/V.s.


2003 ◽  
Vol 43 (11) ◽  
pp. 1351 ◽  
Author(s):  
V. Kempster ◽  
S. Charwat

Three species of land snails, Theba pisana (Müller, 1774), Cernuella virgata (Da Costa, 1778) and Cochlicella acuta (Müller, 1774), introduced to Australia from the Mediterranean region, cause significant economic problems in harvested crops in southern Australia. One of the strategies for post-harvest control of these snails involves stubble management to knock the snails onto the hot ground during summer. Farmers report variable results with this strategy, which could be due to varying heat tolerances between the 3 species. In a series of laboratory experiments, field-collected snails of the 3 species were tested for their ability to survive high surface temperatures for varying periods of time. The results reported here indicate differences between the 3 species in their tolerance of soil surface temperatures, and suggest that the variable results noted in the field are due at least in part to the differing heat tolerances of the 3 species. When adult snails were placed in incubators at a constant temperature, all T. pisana died after 3 h at 55°C, while C. virgata and C. acuta survived longer, with 100% mortality only after 2 successive 6-h exposures at 55°C. Weight loss of snails was measured after heat treatment to estimate water loss under these conditions. Recommendations are made for more effective mechanical control strategies for snails in the field during summer.


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