Timing Problems Due to Spacer Bridging in a Sub-100 nm Product

2008 ◽  
Author(s):  
Jan van Hassel
Keyword(s):  
Atomic Force Microscope ◽  
Yield Loss ◽  
Silicide Formation ◽  
Process Stability ◽  
Time Resolved ◽  
Atomic Force ◽  
Defect Localization ◽  
Lightly Doped Drain ◽  
Modified Test ◽  
Comprehensive Study

Abstract In this paper, a comprehensive study to find a memory related yield loss in 90 nm technology will be discussed. The loss was related to spacer bridging, blocking silicide formation and Lightly Doped Drain (LDD), source/drain implant. Soft Defect Localization (SDL) techniques [1], sub-micron Atomic Force Microscope (AFM) probing [2] and Time Resolved Emission (TRE) measurements were necessary to obtain an accurate understanding of the problem and the mechanism. Electrical results were compared to simulations. Modified test structures were implemented to monitor the process stability with respect to bridging failures.

Nanoprobe Characterization of Soft SRAM bit Fails in Advanced Technologies

2019 ◽  
Author(s):  
Satish Kodali ◽  
Chen Zhe ◽  
Chong Khiam Oh
Keyword(s):  
Yield Loss ◽  
Performance Metrics ◽  
Root Cause ◽  
Advanced Technologies ◽  
Capacitance Voltage ◽  
Defect Localization ◽  
Cv Measurements ◽  
Lightly Doped Drain ◽  
Dc Characterization

Abstract Nanoprobing is one of the key characterization techniques for soft defect localization in SRAM. DC transistor performance metrics could be used to identify the root cause of the fail mode. One such case report where nanoprobing was applied to a wafer impacted by significant SRAM yield loss is presented in this paper where standard FIB cross-section on hard fail sites and top down delayered inspection did not reveal any obvious defects. The authors performed nanoprobing DC characterization measurements followed by capacitance-voltage (CV) measurements. Two probe CV measurement was then performed between the gate and drain of the device with source and bulk floating. The authors identified valuable process marginality at the gate to lightly doped drain overlap region. Physical characterization on an inline split wafer identified residual deposits on the BL contacts potentially blocking the implant. Enhanced cleans for resist removal was implemented as a fix for the fail mode.

Product Debug: Speed Problem Related to Unexpected RC Delay

2010 ◽  
Author(s):  
J.G. van Hassel ◽  
F. Zachariasse
Keyword(s):  
Failure Analysis ◽  
Failure Mechanisms ◽  
Audio Signal ◽  
New Product ◽  
Analysis Method ◽  
Standard Analysis ◽  
Time Resolved ◽  
Defect Localization ◽  
Rc Delay ◽  
Comprehensive Study

Abstract In new product designs increasing effort is needed to observe and prove failure mechanisms or process marginalities. For advanced failure analysis Soft Defect Localization (SDL) [1] and Time Resolved Emission (TRE) [2,3] have now become a standard analysis method. Both techniques require a close co-operation between designers and analysts. In this paper we will discuss a comprehensive study to find the mechanism behind a speed problem in the digital part of an audio signal processor. The additional delay was related to unwanted routing through poly-silicide in timing critical circuitry.

Characterization of photosystem II with the atomic-force microscope

1992 ◽  
Vol 50 (2) ◽  
pp. 1146-1147
Author(s):  
Kathleen M. Marr ◽  
Mary K. Lyon
Keyword(s):  
Photosystem Ii ◽  
Atomic Force Microscope ◽  
Three Dimensional ◽  
Biologically Active ◽  
Atomic Force ◽  
Freeze Etching ◽  
Image Averaging ◽  
Oxygen Evolving ◽  
Averaging Techniques

Photosystem II (PSII) is different from all other reaction centers in that it splits water to evolve oxygen and hydrogen ions. This unique ability to evolve oxygen is partly due to three oxygen evolving polypeptides (OEPs) associated with the PSII complex. Freeze etching on grana derived insideout membranes revealed that the OEPs contribute to the observed tetrameric nature of the PSIl particle; when the OEPs are removed, a distinct dimer emerges. Thus, the surface of the PSII complex changes dramatically upon removal of these polypeptides. The atomic force microscope (AFM) is ideal for examining surface topography. The instrument provides a topographical view of individual PSII complexes, giving relatively high resolution three-dimensional information without image averaging techniques. In addition, the use of a fluid cell allows a biologically active sample to be maintained under fully hydrated and physiologically buffered conditions. The OEPs associated with PSII may be sequentially removed, thereby changing the surface of the complex by one polypeptide at a time.

Imaging polymers, proteins and dna in aqueous solutions with the atomic force microscope

1989 ◽  
Vol 47 ◽  
pp. 32-33
Author(s):  
S.A.C. Gould ◽  
B. Drake ◽  
C.B. Prater ◽  
A.L. Weisenhorn ◽  
S.M. Lindsay ◽  
...  
Keyword(s):  
Amino Acids ◽  
Dna Sequencing ◽  
Aqueous Solutions ◽  
Atomic Force Microscope ◽  
Piezoelectric Crystal ◽  
Atomic Force ◽  
Structure Of Molecules ◽  
Optical Lever

The atomic force microscope (AFM) is an instrument that can be used to image many samples of interest in biology and medicine. Images of polymerized amino acids, polyalanine and polyphenylalanine demonstrate the potential of the AFM for revealing the structure of molecules. Images of the protein fibrinogen which agree with TEM images demonstrate that the AFM can provide topographical data on larger molecules. Finally, images of DNA suggest the AFM may soon provide an easier and faster technique for DNA sequencing.The AFM consists of a microfabricated SiO2 triangular shaped cantilever with a diamond tip affixed at the elbow to act as a probe. The sample is mounted on a electronically driven piezoelectric crystal. It is then placed in contact with the tip and scanned. The topography of the surface causes minute deflections in the 100 μm long cantilever which are detected using an optical lever.

The atomic-force microscope and its future in biology

1993 ◽  
Vol 51 ◽  
pp. 704-705
Author(s):  
Jean-Paul Revel
Keyword(s):  
Silicon Nitride ◽  
Laser Beam ◽  
Atomic Force Microscope ◽  
Scanning Tunneling Microscope ◽  
Point Of View ◽  
Scanning Tunneling ◽  
Close Relative ◽  
Tunneling Microscope ◽  
Atomic Force ◽  
Sharp Point

The last few years have been marked by a series of remarkable developments in microscopy. Perhaps the most amazing of these is the growth of microscopies which use devices where the place of the lens has been taken by probes, which record information about the sample and display it in a spatial from the point of view of the context. From the point of view of the biologist one of the most promising of these microscopies without lenses is the scanned force microscope, aka atomic force microscope.This instrument was invented by Binnig, Quate and Gerber and is a close relative of the scanning tunneling microscope. Today's AFMs consist of a cantilever which bears a sharp point at its end. Often this is a silicon nitride pyramid, but there are many variations, the object of which is to make the tip sharper. A laser beam is directed at the back of the cantilever and is reflected into a split, or quadrant photodiode.

The application of atomic force microscope in microbiological research

2014 ◽  
Vol 5 (1) ◽  
pp. 27-30
Author(s):  
Małgorzata Tokarska-Rodak ◽  
Maria Kozioł-Montewka ◽  
Jolanta Paluch-Oleś ◽  
Dorota Plewik ◽  
Grażyna Olchowik ◽  
...  
Keyword(s):  
Atomic Force Microscope ◽  
Atomic Force ◽  
Microbiological Research

Failure Analysis of Laser Blown Metal Fuse Failures in Submicron Technology by C-AFM

2006 ◽  
Author(s):  
Liang-Feng Wen ◽  
Chien-Hui Chen ◽  
Allen Timothy Chang
Keyword(s):  
Failure Analysis ◽  
Atomic Force Microscope ◽  
Laser Cutting ◽  
Spot Size ◽  
Repair Rate ◽  
Atomic Force ◽  
Measurement Laser

Abstract This paper presents a method of using a conductive atomic force microscope (C-AFM) to characterize a submicron metal fuse that has been blown open inadequately by laser. In order to obtain a proper I-V curve measured using the C-AFM without affecting the incompletely opened fuse, the paper proposes a method of preserving the fuse by coating its surface with spin-on glass. The paper explains how differences in laser cutting machines resulted in the high failure repair rate of customer product despite equivalent energy and spot size settings. Analysis of the fuse bank circuitry on wafers helped to find the critical physical differences between a fully blown and a poorly blown fuse. By overcoming difficulties in preserving the blown fuse failure sites for C-AFM measurement, laser settings could be easily optimized to ensure proper fuse opening.

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