Failure Analysis Case Study of Inductively Coupled Cross-Chip Signals

2016 ◽  
Author(s):  
Steven Loveless ◽  
Zhihong You ◽  
Tathagata Chatterjee ◽  
Badarish Subbannavar
Keyword(s):  
Failure Analysis ◽  
Failure Mechanism ◽  
Individual Data ◽  
Cause Analysis ◽  
Inductively Coupled ◽  
Root Cause ◽  
Specific Device ◽  
Data Points ◽  
On Chip

Abstract This paper discusses a failure analysis case study in a highly integrated mixed signal device caused by inductive coupling of on-chip signals. The techniques utilized and the approach to root cause analysis are discussed in depth. The interactions between the device design and failure mechanism are identified in detail. Focus is placed on drawing conclusions from the sum of individual data points, and the discussion provides an analytical path by which similar failures can be isolated and specific device sensitivities can be identified.

A Logical Problem Solving Process for High Via Resistance Root Cause Analysis

2008 ◽  
Author(s):  
K. Li ◽  
P. Liu ◽  
J. Teong ◽  
M. Lee ◽  
H. L. Yap
Keyword(s):  
Problem Solving ◽  
Failure Analysis ◽  
Failure Mechanism ◽  
High Resistance ◽  
Cause Analysis ◽  
Logical Problem ◽  
Root Cause ◽  
Analysis Process ◽  
Problem Solving Process

Abstract This paper presents a case study on via high resistance issue. A logical failure analysis process EDCA (Effect, Defect, Cause, and Action) is successfully applied to find out the failure mechanism, pinpoint the root cause and solve the problem. It sets up a very good example of how to do tough failure analysis in a controllable way.

Root Cause Analysis for Pin Leakage

2016 ◽  
Author(s):  
Zhigang Song ◽  
Jochonia Nxumalo ◽  
Manuel Villalobos ◽  
Sweta Pendyala
Keyword(s):  
Failure Analysis ◽  
Root Cause Analysis ◽  
Advanced Technology ◽  
Process Step ◽  
Cause Analysis ◽  
Hard Mask ◽  
Technology Node ◽  
Root Cause ◽  
Tools And Techniques

Abstract Pin leakage continues to be on the list of top yield detractors for microelectronics devices. It is simply manifested as elevated current with one pin or several pins during pin continuity test. Although many techniques are capable to globally localize the fault of pin leakage, root cause analysis and identification for it are still very challenging with today’s advanced failure analysis tools and techniques. It is because pin leakage can be caused by any type of defect, at any layer in the device and at any process step. This paper presents a case study to demonstrate how to combine multiple techniques to accurately identify the root cause of a pin leakage issue for a device manufactured using advanced technology node. The root cause was identified as under-etch issue during P+ implantation hard mask opening for ESD protection diode, causing P+ implantation missing, which was responsible for the nearly ohmic type pin leakage.

Tri-Directional TEM Failure Analysis on Sample Prepared by In-Situ Lift-Out FIB and Flipstage

2014 ◽  
Author(s):  
Jie Zhu ◽  
An Yan Du ◽  
Bing Hai Liu ◽  
Eddie Er ◽  
Si Ping Zhao ◽  
...  
Keyword(s):  
Sample Preparation ◽  
Failure Analysis ◽  
Cross Section ◽  
Root Cause Analysis ◽  
Wafer Surface ◽  
Tem Analysis ◽  
Cause Analysis ◽  
Root Cause

Abstract In this paper, we report an advanced sample preparation methodology using in-situ lift-out FIB and Flipstage for tridirectional TEM failure analysis. A planar-view and two cross-section TEM samples were prepared from the same target. Firstly, a planar-view lamellar parallel to the wafer surface was prepared using in-situ lift-out FIB milling. Upon TEM analysis, the planar sample was further milled in the along-gate and cross-gate directions separately. Eventually, a pillar-like sample containing a single transistor gate was obtained. Using this technique, we are able to analyze the defect from three perpendicular directions and obtain more information on the defect for failure root-cause analysis. A MOSFETs case study is described to demonstrate the procedure and advantages of this technique.

Humidity-Bias Driven Shorts in Multilayer Circuits: A Case Study in Failure Analysis

2000 ◽  
Author(s):  
Hei-Ruey Harry Jen ◽  
Gerald S. D’Urso ◽  
Harold Andrews
Keyword(s):  
Failure Analysis ◽  
Failure Mechanism ◽  
Layer Structure ◽  
Molding Compound ◽  
Plastic Molding ◽  
Root Cause ◽  
Plastic Package ◽  
Processing Procedure ◽  
Failure Site

Abstract When a failure analysis (FA) involves a multiple layer structure separated by a polymeric material such as Benzocyclobutene (BCB), in a plastic package, it becomes a very challenging task to find out where the failure site is and how it failed. This is due to the fact that the chemical de-processing procedure removes BCB as well as the plastic molding compound. This paper outlines the studies carried out to determine the failure site and the root cause of the failure mechanism in a multilayer circuit and the steps taken to fix the problems. The methodology and results of this study are applicable to many other types of circuits.

Wire-Wound Resistor Investigation—A Case Study

2016 ◽  
Author(s):  
Jason Wheeler ◽  
John Wolfgong
Keyword(s):  
Failure Analysis ◽  
Root Cause Analysis ◽  
Interesting Case ◽  
Cause Analysis ◽  
Root Cause ◽  
Resistive Element ◽  
Primary Driver ◽  
Mission Critical ◽  
Corrective Actions

Abstract The focus of this paper is to present an interesting case study involving Vishay wire-wound (WSC model) resistor failures, which affected a significant number of production and fielded assemblies. The failures were considered “mission critical”, which was the primary driver necessitating root cause analysis. A disciplined approach to the failure analysis effort was established, which resulted in root cause determination and the generation of appropriate corrective actions. This paper will highlight a non-conventional decapsulation method used to preserve the integrity of the fragile resistive element and a “lucky break” that was instrumental in linking the supplier’s actions to the failures.

Case Study in Fault Isolation of a Metal Short for Yield Enhancement

2010 ◽  
Author(s):  
Sarven Ipek ◽  
David Grosjean
Keyword(s):  
Failure Analysis ◽  
Failure Mechanism ◽  
Photon Emission ◽  
Fault Isolation ◽  
Yield Enhancement ◽  
Analysis Technique ◽  
Laser Signal ◽  
Signal Injection ◽  
Microscopy Techniques

Abstract The application of an individual failure analysis technique rarely provides the failure mechanism. More typically, the results of numerous techniques need to be combined and considered to locate and verify the correct failure mechanism. This paper describes a particular case in which different microscopy techniques (photon emission, laser signal injection, and current imaging) gave clues to the problem, which then needed to be combined with manual probing and a thorough understanding of the circuit to locate the defect. By combining probing of that circuit block with the mapping and emission results, the authors were able to understand the photon emission spots and the laser signal injection microscopy (LSIM) signatures to be effects of the defect. It also helped them narrow down the search for the defect so that LSIM on a small part of the circuit could lead to the actual defect.

Case Study—Failure Analysis of a Multiplexer

2016 ◽  
Author(s):  
Michael Woo ◽  
Marcos Campos ◽  
Luigi Aranda
Keyword(s):  
Failure Analysis ◽  
High Reliability ◽  
Component Failure ◽  
Root Cause ◽  
Knowing That ◽  
Cause Of Failure ◽  
The Cost

Abstract A component failure has the potential to significantly impact the cost, manufacturing schedule, and/or the perceived reliability of a system, especially if the root cause of the failure is not known. A failure analysis is often key to mitigating the effects of a componentlevel failure to a customer or a system; minimizing schedule slips, minimizing related accrued costs to the customer, and allowing for the completion of the system with confidence that the reliability of the product had not been compromised. This case study will show how a detailed and systemic failure analysis was able to determine the exact cause of failure of a multiplexer in a high-reliability system, which allowed the manufacturer to confidently proceed with production knowing that the failure was not a systemic issue, but rather that it was a random “one time” event.

Root cause analysis of primary reformer catastrophic failure: A case study

2010 ◽  
Vol 30 (1) ◽  
pp. 62-65
Author(s):  
Naveed Ramzan ◽  
Shahid Naveed ◽  
Muhammad Rizwan ◽  
Werner Witt
Keyword(s):  
Root Cause Analysis ◽  
Catastrophic Failure ◽  
Cause Analysis ◽  
Root Cause
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