scholarly journals Cell-Wall-Deficient Bacteria in Oral Biofilm: Association with Periodontitis

Author(s):  
Francesco Germano ◽  
Francesco Germano ◽  
Davide Testi ◽  
Luisa Campagnolo ◽  
Manuel Scimeca ◽  
...  

Cell-wall-deficient bacteria are those that lack cell walls and live in a pleomorphic state. The genus Mycoplasma and L-form bacteria are both members of this group. The aim of this study was to search cellwall-deficient bacteria in periodontal biofilm and link their presence to periodontal disease. Eighty-nine individuals were recruited and divided into three groups: periodontally healthy individuals, individuals with chronic periodontitis, and those with aggressive periodontitis. The presence of cell-wall-deficient bacteria was detected in freshly collected biofilm by light microscopy, transmission electron microscopy (TEM) with and without electron microscopy in situ hybridization, atomic force microscopy and DNA stain (Hoechst). A new dichotomic index of classification for prevalence and morphologic variants was developed to classify cell-wall-deficient bacteria in periodontal biofilm. Cell-wall-deficient bacteria were found in periodontal biofilm and classified into protoplastic, everted, filament and intracellular forms, the last one mainly associated with aggressive periodontitis. We also assessed the prevalence of periodontopathic bacteria by means of polymerase chain-reaction (PCR) and found no clear, statistically significant, correlation among periodontal pathogens tested (except T. denticola) that allowed individuals with chronic periodontitis to be distinguished from those with aggressive periodontitis. Association between cell-walldeficient bacteria and periodontal condition was: periodontally healthy, 3.3% (1/30); individuals with chronic periodontitis, 30.6% (11/36); and those with aggressive periodontitis, 100% (23/23). Cell-walldeficient bacteria were detected in periodontal biofilm and linked to aggressive periodontitis.

2020 ◽  
Author(s):  
Francesco Germano ◽  
Davide Testi ◽  
Luisa Campagnolo ◽  
Manuel Scimeca ◽  
Claudio Arcuri

AbstractCell-wall-deficient bacteria are those that lack cell walls and live in a pleomorphic state. The genus Mycoplasma and L-form bacteria are both members of this group. The aim of this study was to search cell-wall-deficient bacteria in periodontal biofilm and link their presence to periodontal disease. Eighty-nine individuals were recruited and divided into three groups: periodontally healthy individuals, individuals with chronic periodontitis, and those with aggressive periodontitis. The presence of cell-wall-deficient bacteria was detected in freshly collected biofilm by light microscopy, transmission electron microscopy (TEM) with and without electron microscopy in situ hybridization, atomic force microscopy and DNA stain (Hoechst). A new dichotomic index of classification for prevalence and morphologic variants was developed to classify cell-wall-deficient bacteria in periodontal biofilm. Cell-wall-deficient bacteria were found in periodontal biofilm and classified into Protoplastic, Everted, Filament and Intracellular forms, the last one mainly associated with aggressive periodontitis. We also assessed the prevalence of periodontopathic bacteria by means of polymerase chain-reaction (PCR) and found no clear, statistically significant, correlation among periodontal pathogens tested (except T. denticola) that allowed individuals with chronic periodontitis to be distinguished from those with aggressive periodontitis. Association between cell-wall-deficient bacteria and periodontal condition was: periodontally healthy, 3.3% (1/30); individuals with chronic periodontitis, 30.6% (11/36); and those with aggressive periodontitis, 100% (23/23). Cell-wall-deficient bacteria were detected in periodontal biofilm and linked to aggressive periodontitis.


2020 ◽  
Vol MA2020-02 (24) ◽  
pp. 1750-1750
Author(s):  
Andrea Quintero Colmenares ◽  
Patrice Gergaud ◽  
Jean-Michel Hartmann ◽  
Vincent Delaye ◽  
Nicolas Bernier ◽  
...  

2000 ◽  
Vol 648 ◽  
Author(s):  
Mridula D. Bharadwaj ◽  
Gnang-wen Zhou ◽  
Judith C. Yang

AbstractHere we report our investigations on the initial stages of Cu(OO1) oxidation in dry and moist atmosphere using in situ ultra high vacuum (UHV) transmission electron microscopy (TEM), atomic force microscopy (AFM) and scanning electron microscopy (SEM). Cu20 islands were observed to grow 3-dimensionally into the Cu film as seen through the above mentioned techniques. Further, we discuss our interpretation of the experimental observations that presence of water vapor in the oxidizing atmosphere retards the rate of Cu oxidation and Cu20 shows surprising reduction when exposed to water vapor.


NANO ◽  
2007 ◽  
Vol 02 (05) ◽  
pp. 249-271 ◽  
Author(s):  
XIAODONG HAN ◽  
ZE ZHANG ◽  
ZHONG LIN WANG

This paper provides a comprehensive review on the methodological development and technical applications of in situ microscopy, including transmission electron microscopy (TEM), scanning electron microscopy (SEM) and atomic force microscopy (AFM), developed in the last decade for investigating the structure-mechanical-property relationship of a single one-dimensional nanomaterial, such as nanotube, nanowire and nanobelt. The paper covers both the fundamental methods and detailed applications, including AFM-based static elastic and plastic measurements of a carbon nanotube, external field-induced resonance dynamic measurement of elastic modulus of a nanotube/nanowire, nano-indentation, and in situ plastic deformation process of a nanowire. Details are presented on the elastic property measurements and direct imaging of plastic to superplastic behavior of semiconductor nanowires at atomic resolution, providing quantitative information on the mechanical behavior of nanomaterials. The studies on the Si and SiC nanowires clearly demonstrated their distinct, "unexpected" and superior plastic mechanical properties. Finally, a perspective is given on the future of nanomechanics.


1995 ◽  
Vol 378 ◽  
Author(s):  
G. Kissinger ◽  
T. Morgenstern ◽  
G. Morgenstern ◽  
H. B. Erzgräber ◽  
H. Richter

AbstractStepwise equilibrated graded GexSii-x (x≤0.2) buffers with threading dislocation densities between 102 and 103 cm−2 on the whole area of 4 inch silicon wafers were grown and studied by transmission electron microscopy, defect etching, atomic force microscopy and photoluminescence spectroscopy.


1995 ◽  
Vol 403 ◽  
Author(s):  
G. Bai ◽  
S. Wittenbrock ◽  
V. Ochoa ◽  
R. Villasol ◽  
C. Chiang ◽  
...  

AbstractCu has two advantages over Al for sub-quarter micron interconnect application: (1) higher conductivity and (2) improved electromigration reliability. However, Cu diffuses quickly in SiO2and Si, and must be encapsulated. Polycrystalline films of Physical Vapor Deposition (PVD) Ta, W, Mo, TiN, and Metal-Organo Chemical Vapor Deposition (MOCVD) TiN and Ti-Si-N have been evaluated as Cu diffusion barriers using electrically biased-thermal-stressing tests. Barrier effectiveness of these thin films were correlated with their physical properties from Atomic Force Microscopy (AFM), Transmission Electron Microscopy (TEM), Secondary Electron Microscopy (SEM), and Auger Electron Spectroscopy (AES) analysis. The barrier failure is dominated by “micro-defects” in the barrier film that serve as easy pathways for Cu diffusion. An ideal barrier system should be free of such micro-defects (e.g., amorphous Ti-Si-N and annealed Ta). The median-time-to-failure (MTTF) of a Ta barrier (30 nm) has been measured at different bias electrical fields and stressing temperatures, and the extrapolated MTTF of such a barrier is > 100 year at an operating condition of 200C and 0.1 MV/cm.


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