scholarly journals Thermal Expansion and Microstructure Behavior at Elevated Temperature of various {Ni, Co}-based Cast Superalloys

2020 ◽  
pp. 17-24
Author(s):  
Patrice Berthod ◽  
Jean-Paul Gomis ◽  
Lionel Aranda ◽  
Pierre-Jean Panteix

This paper aims to investigate the thermal expansion behavior, up to an elevated temperature, of superalloys based on nickel and cobalt with various proportions and designed to be strengthened by tantalum carbides. The as-cast microstructures of these superalloys and their evolutions at two very high temperatures were also of interest. All results are discussed by considering the Ni/Co repartition in the base element position. It appears that when the Ni content is higher than the Co one: 1/the thermal expansion is slower, 2/the as-cast microstructures as well as the ones stabilized at high temperature contain not only TaC but also chromium carbides, and 3/the hardness in as-cast or aged state is lower.

Author(s):  
William J. O’Donnell ◽  
Amy B. Hull ◽  
Shah Malik

Since the 1980s, the ASME Code has made numerous improvements in elevated-temperature structural integrity technology. These advances have been incorporated into Section II, Section VIII, Code Cases, and particularly Subsection NH of Section III of the Code, “Components in Elevated Temperature Service.” The current need for designs for very high temperature and for Gen IV systems requires the extension of operating temperatures from about 1400°F (760°C) to about 1742°F (950°C) where creep effects limit structural integrity, safe allowable operating conditions, and design life. Materials that are more creep and corrosive resistant are needed for these higher operating temperatures. Material models are required for cyclic design analyses. Allowable strains, creep fatigue and creep rupture interaction evaluation methods are needed to provide assurance of structural integrity for such very high temperature applications. Current ASME Section III design criteria for lower operating temperature reactors are intended to prevent through-wall cracking and leaking and corresponding criteria are needed for high temperature reactors. Subsection NH of Section III was originally developed to provide structural design criteria and limits for elevated-temperature design of Liquid-Metal Fast Breeder Reactor (LMFBR) systems and some gas-cooled systems. The U.S. Nuclear Regulatory Commission (NRC) and its Advisory Committee for Reactor Safeguards (ACRS) reviewed the design limits and procedures in the process of reviewing the Clinch River Breeder Reactor (CRBR) for a construction permit in the late 1970s and early 1980s, and identified issues that needed resolution. In the years since then, the NRC, DOE and various contractors have evaluated the applicability of the ASME Code and Code Cases to high-temperature reactor designs such as the VHTGRs, and identified issues that need to be resolved to provide a regulatory basis for licensing. The design lifetime of Gen IV Reactors is expected to be 60 years. Additional materials including Alloy 617 and Hastelloy X need to be fully characterized. Environmental degradation effects, especially impure helium and those noted herein, need to be adequately considered. Since cyclic finite element creep analyses will be used to quantify creep rupture, creep fatigue, creep ratcheting and strain accumulations, creep behavior models and constitutive relations are needed for cyclic creep loading. Such strain- and time-hardening models must account for the interaction between the time-independent and time-dependent material response. This paper describes the evolving structural integrity evaluation approach for high temperature reactors. Evaluation methods are discussed, including simplified analysis methods, detailed analyses of localized areas, and validation needs. Regulatory issues including weldment cracking, notch weakening, creep fatigue/creep rupture damage interactions, and materials property representations for cyclic creep behavior are also covered.


2014 ◽  
Vol 1693 ◽  
Author(s):  
Dean P. Hamilton ◽  
Michael R. Jennings ◽  
Craig A. Fisher ◽  
Yogesh K. Sharma ◽  
Stephen J. York ◽  
...  

ABSTRACTSilicon carbide power devices are purported to be capable of operating at very high temperatures. Current commercially available SiC MOSFETs from a number of manufacturers have been evaluated to understand and quantify the aging processes and temperature dependencies that occur when operated up to 350°C. High temperature constant positive bias stress tests demonstrated a two times increase in threshold voltage from the original value for some device types, which was maintained indefinitely but could be corrected with a long negative gate bias. The threshold voltages were found to decrease close to zero and the on-state resistances increased quite linearly to approximately five or six times their room temperature values. Long term thermal aging of the dies appears to demonstrate possible degradation of the ohmic contacts. This appears as a rectifying response in the I-V curves at low drain-source bias. The high temperature capability of the latest generations of these devices has been proven independently; provided that threshold voltage management is implemented, the devices are capable of being operated and are free from the effects of thermal aging for at least 70 hours cumulative at 300°C.


1999 ◽  
Vol 14 (3) ◽  
pp. 715-728 ◽  
Author(s):  
P. Zhao ◽  
D. G. Morris ◽  
M. A. Morris Munoz

High-temperature forging experiments have been carried out by axial compression testing on a Fe–41Al–2Cr alloy in order to determine the deformation systems operating under such high-speed, high-temperature conditions, and to examine the textures produced by such deformation and during subsequent annealing to recrystallize. Deformation is deduced to take place by the operation of 〈111〉 {110} and 〈111〉{112} slip systems at low temperatures and by 〈100〉{001} and 〈100〉{011} slip systems at high temperatures, with the formation of the expected strong 〈111〉 textures. The examination of the weak 〈100〉 texture component is critical to distinguishing the operating slip system. Both texture and dislocation analyses are consistent with the operation of these deformation systems. Recrystallization takes place extremely quickly at high temperatures (above 800 °C), that is within seconds after deformation and also dynamically during deformation itself. Recrystallization changes the texture such that 〈100〉 textures superimpose on the deformation texture. The flow stress peak observed during forging is found at a very high temperature. Possible origins of the peak are examined in terms of the operating slip systems.


2019 ◽  
Vol 187 (1) ◽  
pp. 17-20
Author(s):  
Andrew Villanueva ◽  
Braden Goddard

Abstract While it is known that temperatures above 100°C have an effect on the reported dose of a TLD, it is less widely known what the susceptibility is to temperatures below 100°C, temperatures humans could reasonably expect to be exposed to. With the expanding nuclear industry in climates with more extreme temperatures, (e.g. United Arab Emirates and Saudi Arabia) the effect on a TLD if left on a dashboard of a car need to be evaluated. This research experimentally determined the extent of this thermal susceptibility by testing a range of high temperatures, 40°C – 90°C. The experimental results found that there is a statistically significant reduction in TLD-100H (natLiF:Mg,Cu,P) light output for TLDs there were exposed to temperatures as low as 40°C for 8 hour durations and 50°C for 2 hour durations. There is statistical difference in TLD-100H light output for elevated temperature durations of 8 hours compared to 24 hours.


1997 ◽  
Vol 172 (1-2) ◽  
pp. 93-102 ◽  
Author(s):  
Y. Tachibana ◽  
S. Shiozawa ◽  
J. Fukakura ◽  
F. Matsumoto ◽  
T. Araki

1982 ◽  
Vol 75 (1) ◽  
pp. 53-55
Author(s):  
George Knill ◽  
George Fawceti

Everyone knows that wood bums at a very high temperature. This burning is a chemical process that combines oxygen and carbon. The process occurs at very low temperatures as well as at very high ones. At high temperatures the process is spectacular-fire. At low temperatures (room temperature) you won’t even notice it, although it is still going on. Wood is always burning.


2008 ◽  
Vol 22 (31n32) ◽  
pp. 6016-6021 ◽  
Author(s):  
K. A. LEE ◽  
J. NAMKUNG ◽  
M. C. KIM

The effect of high temperature deformation on the low thermal expansion property of Fe -29 Ni -17 Co alloy was investigated in the compressive temperature range of 900~1300°C at a strain rate range of 25 ~ 0.01 sec. -1. The thermal expansion coefficient (α30~400) generally increased with increasing compressive temperature. In particular, α30~400 increased remarkably as the strain rate decreased at temperatures above 1100°C. Note, however, that α30~400 at low compressive temperatures (900°C and 1000°C) increased abnormally at high strain rates. Based on the investigation of various possibilities of change in low thermal expansion behavior, the experimental results indicated that both the appearance of the α phase and evolution of grain size due to hot compression clearly influenced the low thermal expansion behavior of this invar-type alloy. The correlation between the microstructural cause and invar phenomena and theoretical explanation for the low thermal expansion behavior of Fe -29% Ni -17% Co were also suggested.


2013 ◽  
Author(s):  
Pauli Salminen ◽  
Esa Ahlgren ◽  
Petri Kuosmanen

Solid Oxide Fuel Cell (SOFC) systems achieve high electrical efficiency and can utilize many types of fuels such as methanol or biogas. These systems operate at high temperatures up to 600–1000 °C. Due to high temperatures, mechanical engineering must be combined with thermal engineering through the design work. System design for SOFC systems should take into account several functions such as mechanical support of components, thermal insulation, instrumentation, compensation for thermal expansion and heat recovery as well as conduction of gases through channels, piping or open cavities. One should note that many of these functions have strong interactions and cannot be designed without an effect on the system as a whole. When a system is designed to fulfill all the expectations, it will have a compact size, good thermal properties, small pressure losses and good overall performance together with a competitive price, long system lifetime and easy maintenance. This article aims to improve the mechanical structure of SOFC systems. In addition, our aim is to give sophisticated recommendations for a system design. To achieve this, we have used systematic concept development tools and methodologies to investigate the interactions and relative importance of system requirements and functions. Our key result from this study is that engineers must use a holistic approach when designing a high temperature system with strong interactions between system functions and components. Contrary to our former expectations, these systems could not be designed well by methods that are based on reductionism. In practice, this means that thermal engineering must be utilized from the very beginning. Thermal insulation concept should be selected during the first design steps since this has a great effect on system layout. Mechanical engineering is needed in system layout design in order to solve problems related to the thermal expansion and support of components. Combined thermal and structural analysis utilizing finite element methods can be used to develop or optimize mechanical key components and system layout. The best results can be achieved by using a holistic approach during the design process. In addition, it is beneficial to keep the system as simple and compact as possible. To achieve this, the integration of functions and components must be increased. Thus, SOFC system performance is greatly dependent on system design, not only of its components alone. Findings obtained from this study can be used by researchers designing experimental apparatuses or by companies manufacturing full scale SOFC systems.


2015 ◽  
Vol 40 (45) ◽  
pp. 15672-15678 ◽  
Author(s):  
R. Shukla ◽  
K. Vasundhara ◽  
P.S.R. Krishna ◽  
A.B. Shinde ◽  
S.K. Sali ◽  
...  

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