scholarly journals Review and Analysis of the Reasons Delaying the Entry into Service of Power-by-Wire Actuators for High-Power Safety-Critical Applications

Actuators ◽  
2021 ◽  
Vol 10 (9) ◽  
pp. 233
Author(s):  
Jean-Charles Maré

This paper deals with safety-critical, high-power actuation in aerospace applications. Using a system-level synthetic view, it identifies, explains and discusses the reasons why electrically supplied, or power-by-wire, solutions have not spread rapidly enough to become a generalized replacement of the conventional, hydraulically supplied ones. Once the actuation needs have been summarized, the drawbacks of conventional actuation and the merits of electrically supplied actuation are listed and analyzed. Then, the challenges to be met in order to mitigate the intrinsic disadvantages of power-by-wire are addressed in detail with a focus on the solutions under development or research. Numerous examples, numerical data and orders of magnitude are provided to support the discussion.

Author(s):  
Enrico Reiche ◽  
Michael Schneider

Purpose This paper aims to introduce design challenges of modern telecommunication satellite antennas. The antenna farms accommodated on a satellite are systems of high complexity. From the radio frequency (RF) point of view, the most important design issues, e.g. high power applications in space (vacuum) or typical antenna scenarios (single/multi beam antennas), and their solution are considered. Design/methodology/approach The paper presents the application of electro-magnetic (EM) field simulation in the design and optimisation process. The design of a telecommunications satellite antenna splits into several areas, for which different types of EM field solvers are used. Findings The use of EM field solvers enables an accurate and efficient design approach of modern geostationary telecommunications satellite antennas. Due to the use of EM field solvers, an excellent agreement between predictions and measurement results on feed as well as antenna system level is achieved. Originality/value This paper gives an overview of state-of-the-art telecommunications satellite antenna architectures and their efficient RF design due to the use of EM field solvers. Typical high power effects and other design issues are explained. RF engineers are encouraged to work on this exciting topic to further improve the design process and to develop new satellite antenna and feed products.


2014 ◽  
Vol 50 (3) ◽  
pp. 1717-1728 ◽  
Author(s):  
Ayman M. EL-Refaie ◽  
Manoj R. Shah ◽  
Kum-Kang Huh

2006 ◽  
Vol 129 (1) ◽  
pp. 85-94 ◽  
Author(s):  
Avinash Singh

Planetary gears are widely used in automotive and aerospace applications. Due to demands for greater power density, these gearsets often operate at extremely high stress levels. This has caused system level influences once considered secondary to become critical to the success of planetary gears. One such system level effect that has been largely overlooked is the influence of support structures like planetary needle bearings. There are interactions between the gear distributed loads and the resulting bearing loads and deflections that have implications for both gear and bearing designs. Also, double pinion planetary arrangements are increasingly becoming common. There are still greater interactions between the gear and bearing components in double pinion planetary arrangements. In this paper, we will examine the influence of the bearing deflections (tilt) on the gear load distribution and contact pattern. We will also show the influence of distributed gear loads on the bearing loads (moments) and deflections (tilts). Both, single and double pinion planetary arrangements will be considered. It will be shown that the tilting stiffnesses of the needle bearings have a major influence on gear contact pattern and consequently on contact and bending stresses. It will also be shown that the double pinion planetary arrangement is more likely to result in off-centered loading. Parametric studies will be performed to show the influence of a few design parameters. Theoretical derivations will be validated by numerical simulations. A system level gear analysis model will be used to illustrate the issues involved and quantify the results.


Author(s):  
Debabrata Pal ◽  
Mark Severson

Thermal management of high power electronics for aerospace applications frequently utilizes liquid or air-cooled cold plates with embedded fin cores. These commonly used cold plates use fin assemblies with small flow passages and large area enhancements to achieve high levels of heat transfer performance. The design of this type of cold plate is well documented in the literature, with the most common methodology utilizing “f” and “j” test data as a function of Reynolds Number. This paper presents a technique termed “network modeling” that simplifies the modeling of cold plate features within a CFD model. This technique greatly reduces model size and CPU time needed for solutions. In addition, it is inherently accurate because it allows test data to be incorporated into the model. Simplification of the performance of coldplate features within a system level CFD thermal model is a great advantage, as modeling these small coldplate features is a tedious task and often unnecessary. The methodology presented uses a convective resistance network with mass flow links and convective links to describe the overall thermal behavior of the coldplate. This simplified network model can be used within a detailed thermal model of the electronics assembly to provide an accurate simplification of the coldplate performance for temperature and heat flow prediction. Since the network technique simplifies the flow boundary conditions, the detailed thermal model can contain as much internal details of an electronics assembly as desired, while still keeping the overall model size manageable and CPU times minimal. This network-based method of modeling coldplate should be very accurate because it is based upon established test data of “f” and “j” as the basis of the model. This network method has significant advantages over the other methods of heat exchanger simplification such as coarse mesh, effective thermal conductivity, source-sink, etc. This paper describes the creation of such a network, integration in an ICEPAK thermal model, discussion of the advantages, and results.


Author(s):  
M. Ying ◽  
S. M. L. Nai ◽  
P. Shi ◽  
J. Wei ◽  
C. K. Cheng ◽  
...  

Light-emitting diode (LED) street lamp has gained its acceptance rapidly in the lighting system as one of choices for low power consumption, high reliability, dimmability, high operation hours, and good color rendering applications. However, as the LED chip temperature strongly affects the optical extraction and the reliability of the LED lamps, LED street lamp performance is heavily relied on a successful thermal management, especially when applications require LED street lamp to operate at high power and hash environment to obtain the desired brightness. As such, a well-designed thermal management, which can lower the LED chip operation temperature, becomes one of the necessities when developing LED street lamp system. The current study developed an effective heat dissipation method for the high power LED street lamp with the consideration of design for manufacturability. Different manufacturable structure designs were proposed for the high power street lamp. The thermal contact conductance between aluminum interfaces was measured in order to provide the system assembly guidelines. The module level thermal performance was also investigated with thermocouples. In addition, finite element (FE) models were established for the temperature simulation of both the module and lamp system. The coefficient of natural convection of the heat sink surface was determined by the correlation of the measurement and simulation results. The system level FE model was employed to optimize and verify the heat dissipation concepts numerically. An optimized structure design and prototype has shown that the high power LED street lamp system can meet the thermal performance requirements.


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