scholarly journals Comparative Study of Chloride and Fluoride Induced Aluminum Pad Corrosion in Wire-Bonded Device Packaging Assembly

2021 ◽  
Vol 2 (3) ◽  
pp. 447-460
Author(s):  
Goutham Issac Ashok Kumar ◽  
Alexander Lambert ◽  
Joshua Caperton ◽  
Muthappan Asokan ◽  
William Yi ◽  
...  
Keyword(s):  
Copper Wire ◽  
Vital Role ◽  
Wire Bonding ◽  
Striking Difference ◽  
Corrosion Morphology ◽  
Copper Wire Bonding ◽  
Aluminum Corrosion ◽  
Edx Analyses ◽  
Acidic Conditions ◽  
Copper Aluminum

The introduction of copper as wire bonding material brings about a new challenge of aluminum bond pad bimetallic corrosion at the copper/aluminum galvanic interface. Aluminum is well known to undergo pitting corrosion under halide-contaminated environments, even in slightly acidic conditions. This paper aims to study the corrosion morphology and progression of aluminum influenced by different halide contaminations in the presence and absence of galvanic contact with copper. We used a new corrosion characterization platform of the micropattern corrosion screening to simulate the copper wire bonding on the aluminum bond pad. The corrosion screening data and subsequent SEM–EDX analyses showed a striking difference in morphology and progression between chloride-induced and fluoride-induced aluminum corrosion. The corrosion products formed play a vital role in the resulting morphology and in sustaining further aluminum corrosion.

Failure Analysis on Power Trench MOSFET Devices with Copper Wire Bonds

2011 ◽  
Author(s):  
Huixian Wu ◽  
Arthur Chiang ◽  
David Le ◽  
Win Pratchayakun
Keyword(s):  
Failure Analysis ◽  
Copper Wire ◽  
New Technology ◽  
Analytical Techniques ◽  
Wire Bonding ◽  
Bonding Process ◽  
Wire Bonds ◽  
Copper Wire Bonding ◽  
Wet Chemical ◽  
Microelectronic Components

Abstract With gold prices steadily going up in recent years, copper wire has gained popularity as a means to reduce cost of manufacturing microelectronic components. Performance tradeoff aside, there is an urgent need to thoroughly study the new technology to allay any fear of reliability compromise. Evaluation and optimization of copper wire bonding process is critical. In this paper, novel failure analysis and analytical techniques are applied to the evaluation of copper wire bonding process. Several FA/analytical techniques and FA procedures will be discussed in detail, including novel laser/chemical/plasma decapsulation, FIB, wet chemical etching, reactive ion etching (RIE), cross-section, CSAM, SEM, EDS, and a combination of these techniques. Two case studies will be given to demonstrate the use of these techniques in copper wire bonded devices.

scholarly journals Development of high reliability semiconductor devices by copper wire bonding.

1988 ◽  
Vol 27 (4) ◽  
pp. 299-301
Author(s):  
J. Hirota ◽  
Y. Shibutani ◽  
T. Sugimura ◽  
K. Machida ◽  
T. Okuda
Keyword(s):  
High Reliability ◽  
Copper Wire ◽  
Semiconductor Devices ◽  
Wire Bonding ◽  
Copper Wire Bonding

Direct Palladium-Gold on copper as a Surface Finish for next generation Packages.

2013 ◽  
Vol 2013 (DPC) ◽  
pp. 001145-001184
Author(s):  
Mustafa Ozkok ◽  
Sven Lamprecht ◽  
Gustavo Ramos ◽  
Arnd Kilian
Keyword(s):  
Surface Finish ◽  
Copper Wire ◽  
Environmental Issues ◽  
Wire Bonding ◽  
Gold Layer ◽  
Test Results ◽  
Fine Line ◽  
Surface Finishes ◽  
Copper Wire Bonding ◽  
Bond Tests

A new surface finish is entering the market. The need for this finish comes from needs for new assembly technologies like copper wire bonding or chip assembly by thermo compression bond. Furthermore Nickel an element, which is the base of many surface finishes like ENIG or ENEPIG, is more and more regarded as an unpleasant element as of several disadvantages, such as for high frequency applications, for environmental issues or for fine line applications were a 5 μm Ni Layer is just simply too thick. All these concerns supporting the introduction of a new surface finish, a direct EP and direct EPAG finish. In particular, its suitability for copper wire bonding and its fine line capability makes it very attractive from a cost standpoint of view. In addition, the mentioned technological handicaps of nickel based finishes could be solved by applying a revolutionary surface finish – A Direct Palladium with an optional gold layer. The direct deposition of palladium on copper with an optional gold layer does have further technological, environmental and economical advantages. The suggested paper will describe and discuss the advantages and chances using this new surface finish, as well as demonstrate soldering on various wire bond tests on the Direct EP and EPAG finishes as well as soldering test results.

scholarly journals Corrosion Study and Intermetallics Formation in Gold and Copper Wire Bonding in Microelectronics Packaging

Crystals ◽  
2013 ◽  
Vol 3 (3) ◽  
pp. 391-404 ◽  
Author(s):  
Chwee Goh ◽  
Wee Chong ◽  
Teck Lee ◽  
Christopher Breach
Keyword(s):  
Copper Wire ◽  
Wire Bonding ◽  
Microelectronics Packaging ◽  
Corrosion Study ◽  
Copper Wire Bonding

Reliability of copper wire bonding in humidity environment

2011 ◽  
Author(s):  
Hai Liu ◽  
Zhenqing Zhao ◽  
Qiang Chen ◽  
Jianwei Zhou ◽  
Maohua Du ◽  
...  
Keyword(s):  
Copper Wire ◽  
Wire Bonding ◽  
Copper Wire Bonding ◽  
Humidity Environment
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