scholarly journals Special Issue on Application of Electronic Devices on Intelligent System

Electronics ◽  
2021 ◽  
Vol 10 (13) ◽  
pp. 1506
Author(s):  
Teen-Hang Meen ◽  
Cheng-Chien Kuo

In a modern technological society, electronic engineering and design innovations are both academic and practical engineering fields that involve systematic technological materialization through scientific principles and engineering designs [...]

Electronics ◽  
2019 ◽  
Vol 8 (7) ◽  
pp. 757
Author(s):  
Teen-Hang Meen ◽  
Wenbing Zhao

Electronic Engineering and Design Innovations are both academic and practical engineering fields that involve systematic technological materialization through scientific principles and engineering designs [...]


2020 ◽  
Vol 10 (3) ◽  
pp. 964
Author(s):  
Teen-Hang Meen ◽  
Shoou-Jinn Chang ◽  
Stephen D. Prior

This Special Issue on “Selected Papers from IEEE ICASI 2018” includes excellent papers presented at the IEEE ICASI 2018 regarding the “applied system innovation” topic. Mechanical engineering and design innovations are both academic and practical engineering fields, which involve systematic technological materialization through scientific principles and engineering designs. Technological innovations in mechanical engineering include IT-based intelligent mechanical systems, mechanics and design innovations, and applied materials in nanosciences and nanotechnology. The aim is to encourage the attendees at the IEEE ICASI 2018 to publish their experimental and theoretical research relating to applied system innovation.


Electronics ◽  
2020 ◽  
Vol 9 (4) ◽  
pp. 645
Author(s):  
Teen-Hang Meen ◽  
Wenbing Zhao ◽  
Cheng-Fu Yang

The second IEEE International Conference on Knowledge Innovation and Invention 2019 (IEEE ICKII 2019) was held in Seoul, South Korea, 12–15 July 2019. This special issue “Intelligent Electronic Devices” selects 13 excellent papers form 260 papers presented in IEEE ICKII 2019 conference about the topics of Intelligent Electronic Devices. The main goals of this special issue are to encourage scientists to publish their experimental and theoretical results in as much detail as possible, and to discover new scientific knowledge relevant to the topics of electronics.


2020 ◽  
Vol 2020 ◽  
pp. 1-6 ◽  
Author(s):  
Guangfu Chen ◽  
Liangchao Zou ◽  
Qing Wang ◽  
Guodong Zhang

Anti-slide pile is one of the most frequently used measures in landslide control globally. Pile-spacing has always been determined by the load capacity of single piles or according to engineering empirical experience. Many engineering practices and laboratory experiments show that the soil arching effect exists in landslide control with anti-slide piles. In this study, we aim to calculate pile-spacing in terms of the soil arching effect. We investigated the pile-soil interaction mechanism and propose that, at the limit, the pile-back soil arch resists landslide thrust only. According to Mohr–Coulomb strength theory and limit equilibrium theories, we derived a new pile-spacing calculation equation. We verified the derived pile-spacing calculation equation with real projects. The calculated results are similar to those of practical engineering designs, in which the difference is within 10%. The equation can be used in anti-slide pile preliminary design. This study can be a reference for pile-spacing calculation based on the soil arching effect.


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