scholarly journals A Review and Comparison of Solid, Multi-Strands and Litz Style PCB Winding

Electronics ◽  
2020 ◽  
Vol 9 (8) ◽  
pp. 1324
Author(s):  
Minh Huy Nguyen ◽  
Handy Fortin Blanchette
Keyword(s):  
High Frequency ◽  
Printed Circuit Board ◽  
Skin Resistance ◽  
Wide Frequency Range ◽  
Circuit Board ◽  
Frequency Range ◽  
Track Width ◽  
Printed Circuit ◽  
Pros And Cons ◽  
High Frequency Ac

At high frequency, AC resistance of a printed circuit board (PCB) winding becomes important and accounts for a large proportion of planar transformer losses. The winding is then influenced by both skin and proximity phenomenon, which makes the current distribution uneven resulting in an increased resistance. The study of improving AC resistance of a PCB winding has been tackled by many researchers. However, the lack of an overview and comparison among improvements has made it difficult to apply those methods to a specific winding. To overcome the above limitations, this paper investigates the pros and cons of three popular AC resistance optimizing methods: optimizing track width of a solid PCB winding, using multi-strands and using Litz style PCB winding. To verify the theoretical analysis, a total of 12 PCBs are simulated by finite element (FEM) and tested in the laboratory. Five criteria are analyzed, including skin resistance, proximity resistance, AC to DC ratio, total AC resistance and complexity are taken into consideration. The results of this study show that optimizing track width method has a significant improvement on AC resistance while the use of Litz PCB is effective for applications that need stable AC resistance in a wide frequency range. The use of parallel strands winding should be carefully considered as there is not significant benefit in both reducing the AC resistance and AC to DC ratio.

A Design of Printed Inverted-F Antenna for RFID Tag at 5.8 GHz

2013 ◽  
Vol 427-429 ◽  
pp. 1293-1296
Author(s):  
Yan Zhong Yu ◽  
Ji Zhen Ni ◽  
Xian Hui Li
Keyword(s):  
High Frequency ◽  
Printed Circuit Board ◽  
Ground Plane ◽  
Simulation Software ◽  
Circuit Board ◽  
Electromagnetic Simulation ◽  
Antenna Structure ◽  
Rfid Tag ◽  
Printed Circuit ◽  
Substrate Layer

A printed inverted-F antenna for RFID tag at 5.8 GHz is designed in this paper. The antenna structure consists of an inverted-F patch, a substrate layer, and a ground plane. To reduce costs, the FR4 is selected as the material of substrate layer, which is used commonly in PCB (Printed Circuit Board). Its relative permittivity is 4.4 and a loss tangent is 0.02. The inverted-F patch and ground plane are laid on/under the substrate layer respectively. The designed antenna is modeled, simulated and optimized by using HFSS (high frequency electromagnetic simulation software). Simulation results demonstrate that the printed inverted-F antenna can satisfy the requirements of RFID Tag applications.

scholarly journals Design of Penta-Band Antenna for Concurrent Multiband Single Chain Radio Receiver

2020 ◽  
Vol 8 (5) ◽  
pp. 2587-2590
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Slot Antenna ◽  
Radio Receiver ◽  
Frequency Range ◽  
Single Chain ◽  
Hexahedral Mesh ◽  
Printed Circuit ◽  
Radio Receivers ◽  
Frequency Agile

In this paper, penta-band antenna is presented for concurrent, multiband, and single chain radio receivers. The antenna is manufactured on a 50 × 100 mm FR4 printed circuit board, and is able to provide five concurrent, operating bands covering a frequency range from 2 to 6 GHz. The antenna bandwidth can be increased up to 280 MHz. Using hexahedral mesh the slot antenna design we can achieve more accurate concurrent bands. These five bands are having larger bandwidth than conventional antennas. Using CM-FARAD (Concurrent Multiband Frequency Agile Radio) architecture we design the antenna for achieving concurrent multiband and single chain radio receiver. Using five slots we achieve our five concurrent bands that operate over wide bands which operate at 2.4,3.0,3,7,4.5,5.6 GHz respectively.

A Novel Low Cost Package for Radio Frequency Applications

2013 ◽  
Vol 135 (2) ◽  
Author(s):  
Sandeep Chaturvedi ◽  
Shiban K. Koul
Keyword(s):  
High Frequency ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Cost Effective ◽  
Circuit Board ◽  
Test Results ◽  
Printed Circuit ◽  
Pcb Manufacturing ◽  
Manufacturing Techniques ◽  
Commercial Applications

Design, fabrication, and test results of a novel 3-layer RF package using a commonly available high frequency laminate are presented in this paper. The developed package can be manufactured using standard multilayer printed circuit board (PCB) manufacturing techniques making it cost effective for commercial applications. The package exhibits excellent RF characteristics up to 6 GHz.

scholarly journals A Double Inverted F-Shape Patch Antenna for Dual-Band Operation

2014 ◽  
Vol 2014 ◽  
pp. 1-8 ◽  
Author(s):  
M. M. Islam ◽  
M. R. I. Faruque ◽  
W. Hueyshin ◽  
J. S. Mandeep ◽  
T. Islam
Keyword(s):  
Finite Element Method ◽  
Patch Antenna ◽  
High Frequency ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Dual Band ◽  
The Finite Element Method ◽  
Microstrip Transmission Line ◽  
Printed Circuit ◽  
Measured Impedance

A double inverted F-shape patch antenna is presented for dual-band operation. The proposed antenna is comprised of circular and rectangular slots on a printed circuit board of 40 mm × 40 mm × 1.6 mm with a 50 Ω microstrip transmission line. Commercially available high frequency structural simulator (HFSS) based on the finite element method (FEM) has been adopted in this investigation. It has a measured impedance bandwidths (2 : 1 VSWR) of 18.53% on the lower band and 7.8% on the upper band, respectively. It has achieved stable radiation efficiencies of 79.76% and 80.36% with average gains of 7.82 dBi and 5.66 dBi in the operating frequency bands. Moreover, numerical simulations have been indicated as an important uniformity with measured results.

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