scholarly journals Heat Transfer Enhancement of Plate-Fin Heat Sinks with Different Types of Winglet Vortex Generators

Energies ◽  
2020 ◽  
Vol 13 (19) ◽  
pp. 5219
Author(s):  
Jin-Cherng Shyu ◽  
Jhao-Siang Jheng
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Pressure Drop ◽  
Transfer Coefficient ◽  
Heat Sink ◽  
Heat Sinks ◽  
Vortex Generators ◽  
Airflow Velocity ◽  
Delta Winglet ◽  
The Heat Transfer Coefficient

Because the delta winglet in common-flow-down configuration has been recognized as an excellent type of vortex generators (VGs), this study aims to experimentally and numerically investigate the thermo-hydraulic performance of four different forms of winglet VGs featuring sweptback delta winglets in the channel flow in the range 200 < Re < 1000. Both Nusselt number and friction factor of plate-fin heat sinks having different forms of winglets, including delta winglet pair (DWP), rectangular winglet pair (RWP), swept delta winglet pair (SDWP), and swept trapezoid winglet pair (STWP), were measured in a standard wind tunnel without bypass in this study. Four rows of winglets with in-line arrangement were punched on each 10-mm-long, 0.2-mm-thick copper plate, and a total of 16 pieces of copper plates with spacing of 2 mm were fastened together to achieve the heat sink. The projected area, longitudinal and winglet tip spacing, height and angle of attack of those winglets were fixed. Besides that, three-dimensional numerical simulation was also performed in order to investigate the temperature and fluid flow over the plate-fin. The results showed that the longitudinal, common-flow-down vortices generated by the VGs augmented the heat transfer and pressure drop of the heat sink. At airflow velocity of 5 m/s, the heat transfer coefficient and pressure drop of plain plate-fin heat sink were 50.8 W/m2·K and 18 Pa, respectively, while the heat transfer coefficient and the pressure drop of heat sink having SDWP were 70.4 W/m2·K and 36 Pa, respectively. It was found that SDWP produced the highest thermal enhancement factor (TEF) of 1.28 at Re = 1000, followed by both RWP and STWP of similar TEF in the range 200 < Re < 1000. The TEF of DWP was the lowest and it was rapidly increased with the increase of airflow velocity.

Optimization Under Uncertainty of Manifold Microchannel Heat Sinks

2012 ◽  
Author(s):  
Suchismita Sarangi ◽  
Karthik K. Bodla ◽  
Suresh V. Garimella ◽  
Jayathi Y. Murthy
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Pressure Drop ◽  
Transfer Coefficient ◽  
Heat Sink ◽  
Heat Sinks ◽  
Optimization Under Uncertainty ◽  
Microchannel Heat Sink ◽  
Probabilistic Optimization ◽  
Manifold Microchannel

Conventional microchannel heat sinks provide good heat dissipation capability but are associated with high pressure drop and corresponding pumping power. The use of a manifold system that distributes the flow into the microchannels through multiple, alternating inlet and outlet pairs is investigated here. This manifold arrangement greatly reduces the pressure drop incurred due to the smaller flow paths, while simultaneously increasing the heat transfer coefficient by tripping the thermal boundary layers. A three-dimensional numerical model is developed and validated, to study the effect of various geometric parameters on the performance of the manifold microchannel heat sink. Apart from a deterministic analysis, a probabilistic optimization study is also performed. In the presence of uncertainties in the geometric and operating parameters of the system, this probabilistic optimization approach yields an optimal design that is also robust and reliable. Uncertainty-based optimization also yields auxiliary information regarding local and global sensitivities and helps identify the input parameters to which outputs are most sensitive. This information can be used to design improved experiments targeted at the most sensitive inputs. Optimization under uncertainty also provides a quantitative estimate of the allowable uncertainty in input parameters for an acceptable uncertainty in the relevant output parameters. The optimal geometric design parameters with uncertainties that maximize heat transfer coefficient while minimizing pressure drop for fixed input conditions are identified for a manifold microchannel heat sink. A comparison between the deterministic and probabilistic optimization results is also presented.

Finned Metal Foam Heat Sinks for Electronics Cooling in Forced Convection

2002 ◽  
Vol 124 (3) ◽  
pp. 155-163 ◽  
Author(s):  
A. Bhattacharya ◽  
R. L. Mahajan
Keyword(s):  
Heat Transfer ◽  
Porous Medium ◽  
Heat Transfer Coefficient ◽  
Pressure Drop ◽  
Transfer Coefficient ◽  
Forced Convection ◽  
Metal Foam ◽  
Experimental Results ◽  
Heat Sinks ◽  
The Heat Transfer Coefficient

In this paper, we present recent experimental results on forced convective heat transfer in novel finned metal foam heat sinks. Experiments were conducted on aluminum foams of 90 percent porosity and pore size corresponding to 5 PPI (200 PPM) and 20 PPI (800 PPM) with one, two, four and six fins, where PPI (PPM) stands for pores per inch (pores per meter) and is a measure of the pore density of the porous medium. All of these heat sinks were fabricated in-house. The forced convection results show that heat transfer is significantly enhanced when fins are incorporated in metal foam. The heat transfer coefficient increases with increase in the number of fins until adding more fins retards heat transfer due to interference of thermal boundary layers. For the 20 PPI samples, this maximum was reached for four fins. For the 5 PPI heat sinks, the trends were found to be similar to those for the 20 PPI heat sinks. However, due to larger pore sizes, the pressure drop encountered is much lower at a particular air velocity. As a result, for a given pressure drop, the heat transfer coefficient is higher compared to the 20 PPI heat sink. For example, at a Δp of 105 Pa, the heat transfer coefficients were found to be 1169W/m2-K and 995W/m2-K for the 5 PPI and 20 PPI 4-finned heat sinks, respectively. The finned metal foam heat sinks outperform the longitudinal finned and normal metal foam heat sinks by a factor between 1.5 and 2, respectively. Finally, an analytical expression is formulated based on flow through an open channel and incorporating the effects of thermal dispersion and interfacial heat transfer between the solid and fluid phases of the porous medium. The agreement of the proposed relation with the experimental results is promising.

Microchannel Size Effects on Two-Phase Local Heat Transfer and Pressure Drop in Silicon Microchannel Heat Sinks With a Dielectric Fluid

2007 ◽  
Author(s):  
Tannaz Harirchian ◽  
Suresh V. Garimella
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Pressure Drop ◽  
Transfer Coefficient ◽  
Flow Boiling ◽  
Heat Sinks ◽  
Dielectric Fluid ◽  
Two Phase ◽  
Microchannel Heat Sinks ◽  
The Heat Transfer Coefficient

Two-phase heat transfer in microchannels can support very high heat fluxes for use in high-performance electronics-cooling applications. However, the effects of microchannel cross-sectional dimensions on the heat transfer coefficient and pressure drop have not been investigated extensively. In the present work, experiments are conducted to investigate the local flow boiling heat transfer in microchannel heat sinks. The effect of channel size on the heat transfer coefficient and pressure drop is studied for mass fluxes ranging from 250 to 1600 kg/m2s. The test sections consist of parallel microchannels with nominal widths of 100, 250, 400, 700, and 1000 μm, all with a depth of 400 μm, cut into 12.7 mm × 12.7 mm silicon substrates. Twenty-five microheaters embedded in the substrate allow local control of the imposed heat flux, while twenty-five temperature microsensors integrated into the back of the substrates enable local measurements of temperature. The dielectric fluid Fluorinert FC-77 is used as the working fluid. The results of this study serve to quantify the effectiveness of microchannel heat transport while simultaneously assessing the pressure drop trade-offs.

Flow Boiling in a Heat Sink Embedded With Hexagonally Linked Minichannels

2016 ◽  
Vol 138 (8) ◽  
Author(s):  
Shubhankar Chakraborty ◽  
Omprakash Sahu ◽  
Prasanta Kr. Das
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Transfer Coefficient ◽  
Heat Sink ◽  
Flow Boiling ◽  
Heat Sinks ◽  
Vapor Quality ◽  
Maximum Heat ◽  
Maximum Heat Transfer ◽  
The Heat Transfer Coefficient

The thermal hydraulic performance of a miniature heat sink during flow boiling of distilled water is presented in this article. The unique design of the heat sink contains a number of microchannels of 1 mm × 1 mm cross section arranged in a regular hexagonal array. The design facilitates repeated division and joining of individual streams from different microchannels and thereby can enhance heat transfer. Individual slug bubble experiences a typical route of break up, coalescence, and growth. The randomness of these processes enhances the transport of heat. With the increase of vapor quality the heat transfer coefficient increases, reaches the maximum value, and then drops. The maximum heat transfer coefficient occurs at an exit vapor quality much higher than that observed in conventional parallel microchannel heat sinks. Repeated redistribution of the coolant in the interlinked channels and the restricted growth of the slug bubbles may be responsible for this trend.

A Study on the Fluid Flow and Heat Transfer for a Porous Architected Heat Sink Using the Idea of CFD Modelling

2019 ◽  
Author(s):  
Mohamed I. Hassan Ali ◽  
Oraib Al-Ketan ◽  
Nada Baobaid ◽  
Kamran Khan ◽  
Rashid K. Abu Al-Rub
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Fluid Flow ◽  
Transfer Coefficient ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Heat Sinks ◽  
Cooling Power ◽  
Cfd Modelling ◽  
The Heat Transfer Coefficient

Abstract The drive for small and compact electronic components with higher processing capabilities is limited by their ability to dissipate the associated heat generated during operations. Therefore, these components are equipped with heat sinks to facilitate the dissipation of thermal energy. The emergence of additive manufacturing (AM) allowed for new degrees of freedom in terms of design and eliminated the need for excessive tooling that is associated with the conventional manufacturing processes. As such, AM facilitated the development of geometrically complex heat sinks that are capable of capitalizing on topological aspects to enhance their performance. The main objective of this study is to propose and develop architected heat sinks. We propose the use of heat sinks with topologies based on triply periodic minimal surfaces (TPMS). 3D CFD models are developed using Starccm+ platform for three architected heat sinks to study the heat transfer coefficient and surface temperature in free convection heat transfer domains. The heat dissipation versus the input heat sources as well as the heat transfer coefficient will be used for measuring the heat sink performance. The required fluid flow rate and pressure drop will be used to measure the required cooling power for the proposed heat sinks.

scholarly journals Optimization of Fin Spacing of Vertical Plate Fin Heat Sink in Natural Convection

2019 ◽  
Vol 9 (1) ◽  
pp. 1020-1024
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Transfer Coefficient ◽  
Surface Area ◽  
Heat Sink ◽  
Vertical Plate ◽  
Heat Sinks ◽  
Geometrical Parameters ◽  
Fin Spacing ◽  
The Heat Transfer Coefficient

Heat sinks are frequently used in the cooling of electrical and electronics devices If the heat sink have very close fin spacing, it increases the surface area but reduces the heat transfer coefficient. On the other hand, if heat sink has wide fin spacing, it reduces the surface area but increases the heat transfer coefficient. Therefore, there is need to optimize the fin spacing that enhanced the heat transfer from the heat sink. A properly selected heat sink may reduced the operating temperature and reduce the risk of failure of components. A steady state natural convective heat transfer from aluminum plate fin heat sink was examined experimentally. The length and thickness of fin was kept constant while height were varied from 5mm to 25mm and spacing varied between 5.5mm to 17mm.After experimentation, it was observed that fin spacing plays important role than any other geometrical parameters. Response surface methodology is used for optimization of fin spacing. It is observed that optimum fin spacing of heat sink is 8.28mm.The error analysis is done with the help of ANN and flow visualization were done using CFD

Flow Boiling Heat Transfer in a Silicon Microchannel Heat Sink Using Liquid Crystal Thermography

2008 ◽  
Author(s):  
Ayman Megahed ◽  
Ibrahim Hassan ◽  
Tariq Ahmad
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Pressure Drop ◽  
Transfer Coefficient ◽  
Heat Sink ◽  
Boiling Heat Transfer ◽  
Flow Boiling ◽  
Heat Fluxes ◽  
Working Fluid ◽  
Microchannel Heat Sink

The present study focuses on the experimental investigation of boiling heat transfer characteristics and pressure drop in a silicon microchannel heat sink. The microchannel heat sink consists of a rectangular silicon chip in which 45 rectangular microchannels were chemically etched with a depth of 295 μm, width of 254 μm, and a length of 16 mm. Un-encapsulated Thermochromic liquid Crystals (TLC) are used in the present work to enable nonintrusive and high spatial resolution temperature measurements. This measuring technique is used to provide accurate full and local surface-temperature and heat transfer coefficient measurements. Experiments are carried out for mass velocities ranging between 290 to 457 kg/m2.s and heat fluxes from 6.04 to 13.06 W/cm2 using FC-72 as the working fluid. Experimental results show that the pressure drop increases as the exit quality and the flow rate increase. High values of heat transfer coefficient can be obtained at low exit quality (xe < 0.2). However, the heat transfer coefficient decreases sharply and remains almost constant as the quality increases for an exit quality higher than 0.2.

scholarly journals Studies on the Heat Transfer Coefficient and Pressure Drop of Several Kinds of Plate Heat Exchanger

1968 ◽  
Vol 32 (11) ◽  
pp. 1127-1132,a1 ◽  
Author(s):  
Katsuto Okada ◽  
Minobu Ono ◽  
Toshio Tomimum ◽  
Hirotaka Konno ◽  
Shigemori Ohtani
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Heat Exchanger ◽  
Pressure Drop ◽  
Transfer Coefficient ◽  
Plate Heat Exchanger ◽  
Plate Heat ◽  
The Heat Transfer Coefficient

scholarly journals Experimental and Simulation Study of Micro-Channel Backplane Heat Pipe Air Conditioning System in Data Center

2020 ◽  
Vol 10 (4) ◽  
pp. 1255
Author(s):  
Liping Zeng ◽  
Xing Liu ◽  
Quan Zhang ◽  
Jun Yi ◽  
Xiaohua Li ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Pressure Drop ◽  
Transfer Coefficient ◽  
Heat Transfer Performance ◽  
Outlet Temperature ◽  
Transfer Performance ◽  
Micro Channel ◽  
Heat Transfer Capacity ◽  
The Heat Transfer Coefficient

This paper mainly studies the heat transfer performance of backplane micro-channel heat pipes by establishing a steady-state numerical model. Compared with the experimental data, the heat transfer characteristics under different structure parameters and operating parameters were studied, and the change of heat transfer coefficient inside the system, the air outlet temperature of the back plate and the influence of different environmental factors on the heat transfer performance of the system were analyzed. The results show that the overall error between simulation results and experimental data is less than 10%. In the range of the optimal filling rate (FR = 64.40%–73.60%), the outlet temperature at the lowest point and the highest point of the evaporation section is 22.46 °C and 19.60 °C, the temperature difference does not exceed 3 °C, and the distribution gradient in vertical height is small and the air outlet temperature is uniform. The heat transfer coefficient between the evaporator and the condenser is larger than the heat transfer coefficient under the conditions of low and high liquid charge rate. It increases gradually along the flow direction, and decreases gradually with the flow rate of the condenser. When the width of the flat tube of the evaporator increases from 20 mm to 28 mm, the internal pressure drop of the evaporator decreases by 45.83% and the heat exchange increases by 18.34%. When the number of evaporator slices increases from 16 to 24, the heat transfer increases first and then decreases, with an overall decrease of 2.86% and an increase of 87.67% in the internal pressure drop of the evaporator. The inclination angle of the corrugation changes from 30° to 60°, and the heat transfer capacity and pressure drop increase. After the inclination angle is greater than 60°, the heat transfer capacity and resistance decrease. The results are of great significance to system optimization design and engineering practical application.

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