Effect of copper stress on photosynthesis of navel orange seedlings

2009 ◽  
Vol 17 (1) ◽  
pp. 130-134 ◽  
Author(s):  
Guo-Jun ZHANG ◽  
Hong JIANG ◽  
Li-Qin ZHENG ◽  
Juan CHEN ◽  
Dong-Liang QIU ◽  
...  
2012 ◽  
Vol 81 (3) ◽  
pp. 193-201 ◽  
Author(s):  
Janet M. León Morales ◽  
Mario Rodríguez-Monroy ◽  
Gabriela Sepúlveda-Jiménez

The effect of copper stress on betacyanin accumulation and guaiacol peroxidase (GPOD) activity in leaves of different age was evaluated in red beet (<em>Beta vulgaris </em>L. var. Crosby Egyptian) plants. In hydroponic culture, plants were treated with 0.3 μM (control), 50 μM, 100 μM, and 250 μM of CuSO<sub>4</sub> for 6 days. Copper was taken up and accumulated in old roots but was not translocated to leaves. However in young leaves, the increase of lipid peroxidation and reduction of growth were evident from day 3 of copper exposure; whereas in old leaves, the lipid peroxidation and growth were the same from either copper-treated or control plants. In response to copper exposure, the betacyanin accumulation was evident in young leaves by day 3, and continued to increase until day 6. Betacyanin only were accumulated in old leaves until day 6, but the contents were from 4 to 5 times lower than those observed in young leaves at the same copper concentrations. GPOD activity increased 3.3- and 1.4-fold in young and old leaves from day 3 of copper treatment respectively, but only in the young leaves was sustained at the same level until day 6. Old roots shown betacyanin in the control plants, but the betacyanin level and growth were reduced with the copper exposure. In contrast, young roots emerged by copper effect also accumulated copper and showed the highest betacyanin content of all plant parts assayed. These results indicate that betacyanin accumulation and GPOD activity are defense responses to copper stress in actively growing organs.


1990 ◽  
Vol 47 (6) ◽  
pp. 1122-1127 ◽  
Author(s):  
Christine M. Doucet ◽  
Edward J. Maly

Tests to determine acute copper toxicity levels demonstrated that the protozoan predator Didinium nasutum were more susceptible to copper stress than its prey Paramecium caudatum Thus we predicted that Paramecium and Didinium densities, at the equilibrium point of their interaction, would be higher at sublethal copper levels due to a decrease in the predator's efficiency. This situation is likely to produce a decrease in the stability of the system. However, isocline analysis did not support the predictions based on the acute lethality tests. Equilibrium densities of both predator and prey did not change at copper levels between 30 and 180 μg/L. The mathematical analysis suggested that the interaction became less stable with increasing copper concentrations. However, stability decreased due to hormesis in Didinium at sublethal copper levels and not due to a reduction in predator efficiency as expected. At 300 μg Cu/L, densities of both species at equilibrium were higher and the stability of the system decreased. This decrease in stability resulted from a reduction in predator efficiency, as 300 μg Cu/L is not sublethal for Didinium.


2018 ◽  
Vol 9 (1) ◽  
pp. 41-49
Author(s):  
Shabana Askari ◽  
Hina Khurshid

Present work was planned to investigate the improvement in photosynthetic pigments of Cicer arietinum by Conocarpus lancifolius growing under copper stress. Conocarpus lancifolius was chosen as a biosorbent because it is abundantly and easily available plant of Province Sindh. It does not require so much efforts or money or even water to cultivate them, moreover, it is a fast grower. Plants were grown in randomized block design in triplicates. Each pot was supplied with 1kg of soil, the control plants were supplied with distilled water only, experimental plants were supplied with different concentration of copper viz. 0, 25, 50, 75 and 100 ppm whereas treated plants were supplied with 5gm Conocarpus lancifolius leaf powder along with the different concentration of copper. Effect of Copper on Cicer arietinum and its biosorption by Conocarpus lancifolius was observed by the determination of photosynthetic pigments (chlorophyll a, b, total chlorophylls and carotenoids) and its products (glucose, sucrose and total soluble sugars). Various parameters were also analyzed to correlate and confirm our results like % germination, root and shoot lengths, leaf area and relative water content. C. lancifolius was found not only an efficient, eco-friendly and cost-effective biosorbent for heavy metal copper but it is also an effective fertilizer too.


2012 ◽  
Vol 84 ◽  
pp. 341-346 ◽  
Author(s):  
Hiromitsu Nakajima ◽  
Kenjiro Fujimoto ◽  
Azusa Yoshitani ◽  
Yoshikazu Yamamoto ◽  
Haruka Sakurai ◽  
...  

mBio ◽  
2014 ◽  
Vol 5 (6) ◽  
Author(s):  
Ren-Mao Tian ◽  
Yong Wang ◽  
Salim Bougouffa ◽  
Zhao-Ming Gao ◽  
Lin Cai ◽  
...  

ABSTRACT Marine sponges are the most primitive metazoan and host symbiotic microorganisms. They are crucial components of the marine ecological system and play an essential role in pelagic processes. Copper pollution is currently a widespread problem and poses a threat to marine organisms. Here, we examined the effects of copper treatment on the composition of the sponge-associated bacterial community and the genetic features that facilitate the survival of enriched bacteria under copper stress. The 16S rRNA gene sequencing results showed that the sponge Haliclona cymaeformis harbored symbiotic sulfur-oxidizing Ectothiorhodospiraceae and photosynthetic Cyanobacteria as dominant species. However, these autotrophic bacteria decreased substantially after treatment with a high copper concentration, which enriched for a heterotrophic-bacterium-dominated community. Metagenomic comparison revealed a varied profile of functional genes and enriched functions, including bacterial motility and chemotaxis, extracellular polysaccharide and capsule synthesis, virulence-associated genes, and genes involved in cell signaling and regulation, suggesting short-period mechanisms of the enriched bacterial community for surviving copper stress in the microenvironment of the sponge. Microscopic observation and comparison revealed dynamic bacterial aggregation within the matrix and lysis of sponge cells. The bacteriophage community was also enriched, and the complete genome of a dominant phage was determined, implying that a lytic phage cycle was stimulated by the high copper concentration. This study demonstrated a copper-induced shift in the composition of functional genes of the sponge-associated bacterial community, revealing the selective effect of copper treatment on the functions of the bacterial community in the microenvironment of the sponge. IMPORTANCE This study determined the bacterial community structure of the common sponge Haliclona cymaeformis and examined the effect of copper treatment on the community structure and functional gene composition, revealing that copper treatment had a selective effect on the functions of the bacterial community in the sponge. These findings suggest that copper pollution has an ecological impact on the sponge symbiont. The analysis showed that the untreated sponges hosted symbiotic autotrophic bacteria as dominant species, and the high-concentration copper treatment enriched for a heterotrophic bacterial community with enrichment for genes important for bacterial motility, supplementary cellular components, signaling and regulation, and virulence. Microscopic observation showed obvious bacterial aggregation and a reduction of sponge cell numbers in treated sponges, which suggested the formation of aggregates to reduce the copper concentration. The enrichment for functions of directional bacterial movement and supplementary cellular components and the formation of bacterial aggregates and phage enrichment are novel findings in sponge studies.


2010 ◽  
Vol 2010 (DPC) ◽  
pp. 000774-000802 ◽  
Author(s):  
Rozalia Beica ◽  
Paul Siblerud ◽  
Dave Erickson

Robust and manufacturable processes are needed to enable a smoother and faster transfer of TSV technology from development to production. There are several steps involved with TSV technology application. Either if it is done before or after thinning the wafer, as a via first, middle or via last approach, the main steps are: via etching, lining with insulator/barrier and copper seed, deep via fill and chemical mechanical planarization (CMP), chip dicing and stacking. Deep via fill is one of thee most critical steps in forming the TSV electrodes, and copper electrodeposition process has been identified to be the most appropriate and cost effective method of filling the vias. Various critical factors with significant effect on the process performance were found: seed layer uniformity, via profile and size, stability and performance of the chemicals and equipment design. The amount and quality of the copper at the top of the vias and over the entire surface of the wafer is very important for the CMP processing. A more uniform deposition and lower overburden could significantly decrease the complexity and cost of the CMP step. The copper thickness profile between deposition and CMP can be cross-optimized to reduce dishing, increase throughput and reduce cost. This paper will focus on the deep via fill, the critical factors associated with this step and integration aspects of Cu TSV deposition step that need to be taken in consideration for successful application of this technology. A significant amount of work has been performed to develop processes that can successfully fill features of various sizes in a cost effective way. Some of the chemistries available commercially today, although have very good super-fill characteristics, have the disadvantage of forming nodular and high-stress deposits which could have a negative impact on CMP processing. An innovative process with strong bottom-up capability that significantly reduces the overburden while increasing the speed of deposition has been developed at Semitool and the characteristics of this process and advantages over previous generation processes will be presented. The effect of copper stress and copper extrusion observed during annealing step as well as approaches taken to minimize this effect will be described.


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