scholarly journals The Green Logistics Idea Using Vacuum Insulation Panels (VIPs) For Freezer Logistics Box in Normal Truck

2020 ◽  
Vol 21 (1) ◽  
pp. 15-21
Author(s):  
Piyanut Saengsikhiao ◽  
Juntakan Taweekun ◽  
Kittinan Maliwan ◽  
Somchai Sae-ung ◽  
Thanansak Theppaya
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Polyurethane Foam ◽  
Ice Cream ◽  
Fuel Saving ◽  
Distribution Centers ◽  
Green Logistics ◽  
Vacuum Insulation ◽  
Cold Room ◽  
Electricity Saving

This research presents the green logistics using vacuum insulation panels (VIPs) for freezer logistics box in normal trucks. The materials were Vacuum Insulation Panels (VIPs) with polyurethane foam box compared to polyurethane foam box that thermal conductivity for polyurethane foam and Vacuum Insulation Panels (VIPs) at > 20 and < 7 mW/m.K. The vacuum Insulation Panels (VIPs) with polyurethane foam box design with VIP inside the polyurethane foam protect some impact from losing vacuum that loss thermal resistance. According to the result, after 24 hours, the ice-cream temperature of polyurethane foam box that lost 6 Degree Celsius, calculated as 30.00%. Besides, the ice-cream temperature of that vacuum Insulation Panels (VIPs) with a polyurethane foam box has lost 1.5 Degrees Celsius, counted as 7.5%, and compared with stating temperature at -20 Degrees Celsius. The result represents ice-cream quality after testing that shows the ice-cream condition in VIP Box still freezing, and ice cream condition in the normal box is melt. This research can be applied to a cold room or freezer room in supermarkets, factories, distribution centers, and VIPs that can result from electricity saving for compressors or cold trucks and freezer trucks that can get the result of fuel-saving for engines.

Determining the thermal resistance of a highly insulated wall containing vacuum insulation panels through experimental, calculation and numerical simulation methods

2020 ◽  
pp. 174425912098003
Author(s):  
Travis V Moore ◽  
Cynthia A. Cruickshank ◽  
Ian Beausoleil-Morrison ◽  
Michael Lacasse
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Effective Thermal Conductivity ◽  
Edge Effect ◽  
3D Simulation ◽  
Simulation Methods ◽  
Zone Method ◽  
Vacuum Insulation ◽  
Thermal Bridges ◽  
Wall Assembly

The purpose of this paper is to investigate the potential for calculation methods to determine the thermal resistance of a wall system containing vacuum insulation panels (VIPs) that has been experimentally characterised using a guarded hot box (GHB) apparatus. The VIPs used in the wall assembly have not been characterised separately to the wall assembly, and therefore exact knowledge of the thermal performance of the VIP including edge effect is not known. The calculations and simulations are completed using methods found in literature as well as manufacturer published values for the VIPs to determine the potential for calculation and simulation methods to predict the thermal resistance of the wall assembly without the exact characterisation of the VIP edge effect. The results demonstrate that disregarding the effect of VIP thermal bridges results in overestimating the thermal resistance of the wall assembly in all calculation and simulation methods, ranging from overestimates of 21% to 58%. Accounting for the VIP thermal bridges using the manufacturer advertised effective thermal conductivity of the VIPs resulted in three methods predicting the thermal resistance of the wall assembly within the uncertainty of the GHB results: the isothermal planes method, modified zone method and the 3D simulation. Of these methods only the 3D simulation can be considered a potential valid method for energy code compliance, as the isothermal planes method requires too drastic an assumption to be valid and the modified zone method requires extrapolating the zone factor beyond values which have been validated. The results of this work demonstrate that 3D simulations do show potential for use in lieu of guarded hot box testing for predicting the thermal resistance of wall assemblies containing both VIPs and steel studs. However, knowledge of the VIP effective thermal conductivity is imperative to achieve reasonable results.

scholarly journals Weathering of Roofing Insulation Materials under Multi-Field Coupling Conditions

Materials ◽  
2019 ◽  
Vol 12 (20) ◽  
pp. 3348 ◽  
Author(s):  
Shuangxi Zhou ◽  
Yang Ding ◽  
Zhongping Wang ◽  
Jingliang Dong ◽  
Anming She ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Mass Loss ◽  
Polyurethane Foam ◽  
Thermal Insulation ◽  
Rigid Polyurethane Foam ◽  
Foam Concrete ◽  
Insulation Materials ◽  
Field Coupling ◽  
Vacuum Insulation

Rigid polyurethane foam, foam concrete, and vacuum insulation board are common roofing insulation materials. Their weathering performance under long-term multi-field coupling determines the overall service life of the roof. The weathering properties of rigid polyurethane foam, foam concrete and vacuum insulation panels were studied under freeze thaw, humid-heat, dry-wet, high-low temperature, and multi-field coupling cycles, respectively. The heat transfer and construction process of roof panels was simulated base on upper loading and moisture transfer factors. The result indicates that the mass loss of the foam concrete and the rigid polyurethane foam in the weathering test was significant, which led to the gradual increase of thermal conductivity. Meanwhile, the thermal conductivity and mass loss of vacuum insulation panels did not change due to the lack of penetration under external pressure, therefore, it is necessary to construct composite thermal–insulation materials to alleviate the adverse effects of the service environment on a single material and realize the complementary advantages and disadvantages of the two materials. The results of the numerical simulations indicated that the roof structure must be waterproofed, and its weatherproof performance index should be the same as that of the thermal insulation material. Considering structural deformation, the overall heat transfer performance of the product was increased by around 5%.

scholarly journals Thermal Conductivity of Unidirectionally Aligned SiC Whisker Reinforced Al Alloy Matrix Composite with Interfacial Thermal Resistance

2005 ◽  
Vol 46 (2) ◽  
pp. 148-151 ◽  
Author(s):  
Yibin Xu ◽  
Yoshihisa Tanaka ◽  
Masaharu Murata ◽  
Kazushige Kamihira ◽  
Yukihiro Isoda ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Matrix Composite ◽  
Interfacial Thermal Resistance ◽  
Al Alloy ◽  
Alloy Matrix

Characterizing Bulk Thermal Conductivity and Interface Contact Resistance Effects of Thermal Interface Materials in Electronic Cooling Applications

2003 ◽  
Author(s):  
Vadim Gektin ◽  
Sai Ankireddi ◽  
Jim Jones ◽  
Stan Pecavar ◽  
Paul Hundt
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Contact Resistance ◽  
Thermal Performance ◽  
Electronic Cooling ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Interface Contact ◽  
Interface Materials ◽  
Bulk Thermal Conductivity

Thermal Interface Materials (TIMs) are used as thermally conducting media to carry away the heat dissipated by an energy source (e.g. active circuitry on a silicon die). Thermal properties of these interface materials, specified on vendor datasheets, are obtained under conditions that rarely, if at all, represent real life environment. As such, they do not accurately portray the material thermal performance during a field operation. Furthermore, a thermal engineer has no a priori knowledge of how large, in addition to the bulk thermal resistance, the interface contact resistances are, and, hence, how much each influences the cooling strategy. In view of these issues, there exists a need for these materials/interfaces to be characterized experimentally through a series of controlled tests before starting on a thermal design. In this study we present one such characterization for a candidate thermal interface material used in an electronic cooling application. In a controlled test environment, package junction-to-case, Rjc, resistance measurements were obtained for various bondline thicknesses (BLTs) of an interface material over a range of die sizes. These measurements were then curve-fitted to obtain numerical models for the measured thermal resistance for a given die size. Based on the BLT and the associated thermal resistance, the bulk thermal conductivity of the TIM and the interface contact resistance were determined, using the approach described in the paper. The results of this study permit sensitivity analyses of BLT and its effect on thermal performance for future applications, and provide the ability to extrapolate the results obtained for the given die size to a different die size. The suggested methodology presents a readily adaptable approach for the characterization of TIMs and interface/contact resistances in the industry.

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