Reliability of Hermetic RF MEMS Wafer Level Packaging Using Au-Sn Eutectic Bonding
2006 ◽
Vol 35
(3)
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pp. 425-432
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Keyword(s):
2003 ◽
Vol 16
(12S)
◽
pp. 1237-1241
2009 ◽
Vol 60-61
◽
pp. 325-329
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Keyword(s):