Research of Reliable Design of Printed Circuit Board Suited for Smart Grid

2012 ◽  
Vol 229-231 ◽  
pp. 1503-1506
Author(s):  
Chuan Liu ◽  
Zai Chao Huang ◽  
Peng Wu ◽  
Zhi Gang Wu ◽  
Lei Chen
Keyword(s):  
Smart Grid ◽  
Communication System ◽  
Energy Demand ◽  
Printed Circuit Board ◽  
High Reliability ◽  
Circuit Board ◽  
Self Healing ◽  
Stage Of Development ◽  
Pcb Design ◽  
Smart Grid Communication

Electric utilities faced with the prospect of increasing customer rates are seeking solutions to challenges presented by rising global energy demand, aging infrastructure, increasing fuel costs and renewable portfolio standards in light of climate change. Many consider Smart Grid to be one such solution. The most two significant characteristics of Smart Grid are self-healing ability and high reliability. As the bottom stage of development of Smart Grid communication system, the signal quality and self reliability of PCB design directly influence the entire performance of the communication system. This article focuses on analyzing reliable PCB design suited for Smart Grid communication system from power supply, thermal dispersion and trace routing.

Design of Equivalent Sampling Based on Printed Circuit Board Suited for Power Communication System

2013 ◽  
Vol 333-335 ◽  
pp. 465-471
Author(s):  
Chuan Liu ◽  
Zhi Chao Huang ◽  
Peng Wu ◽  
Lei Chen ◽  
Wei Wang
Keyword(s):  
Time Delay ◽  
Communication System ◽  
High Speed ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Transmission Time ◽  
Clock Signal ◽  
Signal Delay ◽  
Printed Circuit ◽  
Sequential Logic

Many applications in Power communication system have a demand of adjustable transmission time delay of high-speed signal. In sequential logic circuit, the control of transmission time delay of high-speed signal can effectively improve the accuracy of clock sampling, as a result, satisfy the constraints between clock signal and periodic data. A method of equivalent sampling based on printed circuit board (PCB) is provided in the article, it realizes equivalent sampling of the data by fixing a group of clock signal delay, thus, increase the accuracy of sampling.

scholarly journals A survey on smart grid communication system

2015 ◽  
Vol 4 ◽  
Author(s):  
Miles H.F. Wen ◽  
Ka-Cheong Leung ◽  
Victor O.K. Li ◽  
Xingze He ◽  
C.-C. Jay Kuo
Keyword(s):  
Smart Grid ◽  
Information And Communication Technologies ◽  
Communication System ◽  
Communication Systems ◽  
Communication Technologies ◽  
Power Electronic ◽  
Recent Developments ◽  
Information And Communication ◽  
Smart Grid Communication ◽  
Generation Power

Concerns with global warming prompted many governments to mandate increased proportion of electricity generation from renewable sources. This, together with the desire to have more efficient and secure power generation and distribution, has driven research in the next-generation power grid, namely, the smart grid. Through integrating advanced information and communication technologies with power electronic and electric power technologies, smart grid will be highly reliable, efficient, and environmental-friendly. A key component of smart grid is the communication system. This paper explores the design goals and functions of the smart grid communication system, followed by an in-depth investigation on the communication requirements. Discussions on some of the recent developments related to smart grid communication systems are also introduced.

Experimental Study on PCB Micro Drilling Force

2012 ◽  
Vol 246-247 ◽  
pp. 1017-1021 ◽  
Author(s):  
Feng Gong ◽  
Bai Qiang Chen ◽  
Ji Bin Li
Keyword(s):  
Experimental Study ◽  
Cutting Force ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Drilling Machine ◽  
Drilling Force ◽  
Printed Circuit ◽  
Market Competitiveness ◽  
Pcb Design ◽  
Micro Drilling

With the development of high density, multi-functions, miniaturization and multi-layer on printed circuit board (PCB) design, great challenges have been presented to the miniaturization of drilling on PCB. In order to meet the hole precision, quality and improve the performance, efficiency of mechanical drilling, further research should be done on the cutting state. Kistler high-precision micro-force platform was used in this paper to test and analyze the cutting force, investigate the general laws of micro drilling, and optimize the parameters for HANS PCB drilling machine. Thereby, to improve the efficiency and precision of the drilling, range of processing, and increasing market competitiveness.

Damage and Failures of CGA/BGA Assemblies Under Thermal Cycling and Dynamic Loadings

2013 ◽  
Author(s):  
Reza Ghaffarian
Keyword(s):  
Thermal Cycling ◽  
Mechanical Loading ◽  
Test Data ◽  
Printed Circuit Board ◽  
High Reliability ◽  
Circuit Board ◽  
Design Parameters ◽  
Mechanical Shock ◽  
Space Applications ◽  
High Processing

Commercial-off-the-shelf column/ball grid array packaging (COTS CGA/BGA) technologies in high-reliability versions are now being considered for use in high-reliability electronic systems. For space applications, these packages are prone to early failure due to the severe thermal cycling in ground testing and during flight, mechanical shock and vibration of launch, as well as other less severe conditions, such as mechanical loading during descent, rough terrain mobility, handling, and ground tests. As the density of these packages increases and the size of solder interconnections decreases, susceptibility to thermal, mechanical loading and cycling fatigue grows even more. This paper reviews technology as well as thermo-mechanical reliability of field programmable gate array (FPGA) IC packaging developed to meet demands of high processing powers. The FPGAs that generally come in CGA/PBGA packages now have more than thousands of solder balls/columns under the package area. These packages need not only to be correctly joined onto printed circuit board (PCB) for interfacing; they also should show adequate system reliability for meeting thermo-mechanical requirements of the electronics hardware application. Such reliability test data are rare or none for harsher environmental applications, especially for CGAs having more than a thousand of columns. The paper also presents significant test data gathered under thermal cycling and drop testing for high I/O PBGA/CGA packages assembled onto PCBs. Damage and failures of these assemblies after environmental exposures are presented in detail. Understanding the key design parameters and failure mechanisms under thermal and mechanical conditions is critical to developing an approach that will minimize future failures and will enable low-risk insertion of these advanced electronic packages with high processing power and in-field re-programming capability.

Advanced Materials for Printed Circuit Boards

1987 ◽  
Vol 108 ◽  
Author(s):  
David Wei Wang
Keyword(s):  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
High Reliability ◽  
Circuit Board ◽  
Advanced Materials ◽  
Impregnation Method ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Worldwide Production ◽  
Board Industry

The printed circuit board is an integral part of the electronic packaging hierarchy. Its use began more than 40 years ago, and the demand for printed circuit boards has increased in parallel with the growth of the electronics industry.[1] According to a recent forecast, the worldwide production of printed circuit boards will reach to over 19 billion U.S. dollars' worth by 1990.[2] With continuing demands for more interconnections, the multilayer circuit board industry is experiencing its fastest growth rate. Boards with more than 20 inner planes of circuitry are being manufactured with high reliability.Based on dollar values, more than 90% of the circuit boards produced are in the rigid board category, where starting materials are based on thermosetting prepregs produced by a solution impregnation method. This article is a review of materials currently used in rigid composites.

scholarly journals Smart Grid Communication System based on OTN Technology

2021 ◽  
Vol 692 (2) ◽  
pp. 022028
Author(s):  
Zhanghuang Zhang ◽  
Yuanchun Tang ◽  
Zhaozheng Zhou ◽  
Bingsen Xia
Keyword(s):  
Smart Grid ◽  
Communication System ◽  
Smart Grid Communication

FIDOE: A Framework for Intelligent Distributed Ontologies in Engineering

2008 ◽  
Author(s):  
Paul Witherell ◽  
Sundar Krishnamurty ◽  
Ian R. Grosse ◽  
Jack Wileden
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Distributed Environment ◽  
Design Problems ◽  
Design Changes ◽  
Pcb Design ◽  
Common Domain ◽  
Distributed Process ◽  
Solid Foundation ◽  
Future Work

This paper presents FIDOE, a Framework for Intelligent Distributed Ontologies in Engineering. FIDOE consists of a suite of logic rules and templates for interactively developing relationships between properties of linked ontologies. The logical rules embedded in FIDOE automatically operate on various discipline-specific ontologies to systematically identify influences, direct and indirect, of proposed design modifications on other aspects of the design through common domain concepts. Once potential influences are identified, FIDOE enables the user to precisely define the domain relationships, using predefined templates, between the identified domain concepts that enumerate influence types. This tool, thus, provides a pervasive, real time awareness of the implications of design changes during the design process in a distributed environment. The application of FIDOE to distributed and multidisciplinary design problems is detailed with the aid of an industry-provided printed circuit board (PCB) design. Here, commonalities among indirectly connected domain ontologies (electrical, mechanical and thermal domains) are identified using the developed query method and subsequent relationships are defined. These relationships are then applied to provide a collaborative understanding and awareness of the distributed process, all while demonstrating the effectiveness of this approach. This awareness was successfully able to address some previously identified industry concerns, returning promising results while laying a solid foundation for future work.

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