High-reliability flexible optical printed circuit board for opto-electric interconnections

2009 ◽  
Vol 48 (1) ◽  
pp. 015401 ◽  
Author(s):  
Byung Sup Rho
Keyword(s):  
Printed Circuit Board ◽  
High Reliability ◽  
Circuit Board ◽  
Printed Circuit

Advanced Materials for Printed Circuit Boards

1987 ◽  
Vol 108 ◽  
Author(s):  
David Wei Wang
Keyword(s):  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
High Reliability ◽  
Circuit Board ◽  
Advanced Materials ◽  
Impregnation Method ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Worldwide Production ◽  
Board Industry

The printed circuit board is an integral part of the electronic packaging hierarchy. Its use began more than 40 years ago, and the demand for printed circuit boards has increased in parallel with the growth of the electronics industry.[1] According to a recent forecast, the worldwide production of printed circuit boards will reach to over 19 billion U.S. dollars' worth by 1990.[2] With continuing demands for more interconnections, the multilayer circuit board industry is experiencing its fastest growth rate. Boards with more than 20 inner planes of circuitry are being manufactured with high reliability.Based on dollar values, more than 90% of the circuit boards produced are in the rigid board category, where starting materials are based on thermosetting prepregs produced by a solution impregnation method. This article is a review of materials currently used in rigid composites.

Heat transfer and deformation analysis of flexible printed circuit board under thermal and flow effects

Circuit World ◽  
2020 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Chong Hooi Lim ◽  
M.Z. Abdullah ◽  
I. Abdul Azid ◽  
C.Y. Khor ◽  
M.S. Abdul Aziz ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Printed Circuit Board ◽  
High Reliability ◽  
Circuit Board ◽  
Deformation Analysis ◽  
Content Type ◽  
Printed Circuit ◽  
Bga Packages ◽  
Flexible Printed Circuit ◽  
Flow Effects

Purpose The purpose of this study is to investigate heat transfer and deformation of flexible printed circuit board (FPCB) under thermal and flow effects by using fluid structure interaction. This study simulate the electronic cooling process when electronic devices are generating heat during operation at FPCB under force convection. Design/methodology/approach The thermal and flow effects on FPCB with attached ball grid array (BGA) packages have been investigated in the simulation. Effects of Reynolds number (Re), number of BGA packages attached, power supplied to the BGA packages and size of FPCB were studied. The responses in the present study are the deflection/length of FPCB (δ/L) and Nusselt number (Nu). Findings It is important to consider both thermal and flow effects at the same time for understanding the characteristic of FPCB attached with BGA under operating condition. Empirical correlation equations of Re, Prandtl number (Pr), δ/L and Nu have been established, in which the highest effect is of Re, followed by Pr and δ/L. The δ/L and Nu¯ were found to be significantly affected by most of the parametric factors. Practical implications This study provides a better understanding of the process control in FPCB assembly. Originality/value This study provides fundamental guidelines and references for the thermal coupling modelling to address reliability issues in FPCB design. It also increases the understanding of FPCB and BGA joint issues to achieve high reliability in microelectronic design.

Print Copper on Ceramic for High Reliability Electronics

2015 ◽  
Vol 2015 (1) ◽  
pp. 000330-000335
Author(s):  
Ryan Persons ◽  
Paul Gundel
Keyword(s):  
Screen Printing ◽  
Printed Circuit Board ◽  
High Reliability ◽  
Dielectric Materials ◽  
Circuit Board ◽  
Printed Circuit ◽  
Design Flexibility ◽  
Higher Power ◽  
Power Densities ◽  
Primary Substrate

In the power electronics world, Direct Bonded Copper (DBC) is the primary substrate technology. In this paper, we will discuss an alternative technology utilizing screen printable copper pastes (Thick Printed Copper - TPC) on a variety of substrate technologies including Alumina (Al2O3) and Aluminum Nitride (AlN). These materials when processed, look and perform similar to DBC, but exhibit superior reliability and excellent design flexibility. DBC has drawbacks when it comes to thermal mechanical reliability and lacks the flexibility to have multiple copper thicknesses for power and signal circuits within the same design, which is easily achieved via screen printing. The benefits of this TPC system will be demonstrated through data generated on passive thermal shock tests in comparison to high end DBC. Furthermore, this Thick Print Copper technology has the excellent potential for replacing high end Metal Core Printed Circuit Board (MCPCB) technology due to utilization of higher thermal conductive dielectric materials like Al2O3 and AlN. This will allow for designers to drive their LED's harder and effectively producing LED modules with higher power densities.

Characteristics of Radiated Emission from a Printed Circuit Board with a Slit

2012 ◽  
Vol 132 (6) ◽  
pp. 404-410 ◽  
Author(s):  
Kenichi Nakayama ◽  
Kenichi Kagoshima ◽  
Shigeki Takeda
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Radiated Emission

Confirming the Signal Integrity in Transmission of Digital Signals on Microstrip Straight Circuits via the Eye Diagrams

2014 ◽  
Vol 5 (1) ◽  
pp. 737-741
Author(s):  
Alejandro Dueñas Jiménez ◽  
Francisco Jiménez Hernández
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Signal Integrity ◽  
High Volume ◽  
Information Storage ◽  
Circuit Board ◽  
Electromagnetic Simulation ◽  
Electronic Systems ◽  
Digital Signals ◽  
Printed Circuit

Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book “2-D Electromagnetic Simulation of Passive Microstrip Circuits” from the corresponding author of this paper.

Root Cause Analysis of a Connector Time-Delayed Fracture

2015 ◽  
Author(s):  
Prabjit Singh ◽  
Ying Yu ◽  
Robert E. Davis
Keyword(s):  
Printed Circuit Board ◽  
Ceramic Substrate ◽  
Circuit Board ◽  
Delayed Fracture ◽  
Ceramic Substrates ◽  
Printed Circuit ◽  
Root Cause ◽  
Chip Carrier ◽  
Electrical Connections ◽  
Grain Boundary Grooves

Abstract A land-grid array connector, electrically connecting an array of plated contact pads on a ceramic substrate chip carrier to plated contact pads on a printed circuit board (PCB), failed in a year after assembly due to time-delayed fracture of multiple C-shaped spring connectors. The land-grid-array connectors analyzed had arrays of connectors consisting of gold on nickel plated Be-Cu C-shaped springs in compression that made electrical connections between the pads on the ceramic substrates and the PCBs. Metallography, fractography and surface analyses revealed the root cause of the C-spring connector fracture to be plating solutions trapped in deep grain boundary grooves etched into the C-spring connectors during the pre-plating cleaning operation. The stress necessary for the stress corrosion cracking mechanism was provided by the C-spring connectors, in the land-grid array, being compressed between the ceramic substrate and the printed circuit board.

Application of Lock-in Thermography on PCB for Fault Localization and Validation of Failure Mechanism Due to External Discrete Component Variation

2010 ◽  
Author(s):  
William Ng ◽  
Kevin Weaver ◽  
Zachary Gemmill ◽  
Herve Deslandes ◽  
Rudolf Schlangen
Keyword(s):  
Failure Mechanism ◽  
Integrated Circuit ◽  
Printed Circuit Board ◽  
Hot Spot ◽  
Circuit Board ◽  
Discrete Component ◽  
Printed Circuit ◽  
Thermal Signature ◽  
Lock In

Abstract This paper demonstrates the use of a real time lock-in thermography (LIT) system to non-destructively characterize thermal events prior to the failing of an integrated circuit (IC) device. A case study using a packaged IC mounted on printed circuit board (PCB) is presented. The result validated the failing model by observing the thermal signature on the package. Subsequent analysis from the backside of the IC identified a hot spot in internal circuitry sensitive to varying value of external discrete component (inductor) on PCB.

Temperature and Humidity Dependent Reliability Analysis of RGB LED Chips

2006 ◽  
Author(s):  
Jun-Xian Fu ◽  
Shukri Souri ◽  
James S. Harris
Keyword(s):  
Reliability Analysis ◽  
Printed Circuit Board ◽  
Light Emitting Diode ◽  
Circuit Board ◽  
Light Emitting ◽  
Printed Circuit ◽  
Root Cause ◽  
Micro Cracks ◽  
Temperature And Humidity

Abstract Temperature and humidity dependent reliability analysis was performed based on a case study involving an indicator printed-circuit board with surface-mounted multiple-die red, green and blue light-emitting diode chips. Reported intermittent failures were investigated and the root cause was attributed to a non-optimized reflow process that resulted in micro-cracks and delaminations within the molding resin of the chips.

Materials Characterization of Lead Free Compositions for Minimum Temperature SMT Processes at the SLI-Second Level Interconnect Solder Joint

2004 ◽  
Author(s):  
Norman J. Armendariz ◽  
Prawin Paulraj
Keyword(s):  
Solder Joint ◽  
Printed Circuit Board ◽  
Gold Surface ◽  
Circuit Board ◽  
Lead Free ◽  
Processing Temperature ◽  
The European Union ◽  
Printed Circuit ◽  
Higher Temperature ◽  
Tin Silver Copper

Abstract The European Union is banning the use of Pb in electronic products starting July 1st, 2006. Printed circuit board assemblies or “motherboards” require that planned CPU sockets and BGA chipsets use lead-free solder ball compositions at the second level interconnections (SLI) to attach to a printed circuit board (PCB) and survive various assembly and reliability test conditions for end-use deployment. Intel is pro-actively preparing for this anticipated Pb ban, by evaluating a new lead free (LF) solder alloy in the ternary Tin- Silver-Copper (Sn4.0Ag0.5Cu) system and developing higher temperature board assembly processes. This will be pursued with a focus on achieving the lowest process temperature required to avoid deleterious higher temperature effects and still achieve a metallurgically compatible solder joint. One primary factor is the elevated peak reflow temperature required for surface mount technology (SMT) LF assembly, which is approximately 250 °C compared to present eutectic tin/lead (Sn37Pb) reflow temperatures of around 220 °C. In addition, extended SMT time-above-liquidus (TAL) and subsequent cooling rates are also a concern not only for the critical BGA chipsets and CPU BGA sockets but to other components similarly attached to the same PCB substrate. PCBs used were conventional FR-4 substrates with organic solder preservative on the copper pads and mechanical daisychanged FCBGA components with direct immersion gold surface finish on their copper pads. However, a materials analysis method and approach is also required to characterize and evaluate the effect of low peak temperature LF SMT processing on the PBA SLI to identify the absolute limits or “cliffs” and determine if the minimum processing temperature and TAL could be further lowered. The SLI system is characterized using various microanalytical techniques, such as, conventional optical microscopy, scanning electron microscopy, energy dispersive spectroscopy and microhardness testing. In addition, the SLI is further characterized using macroanalytical techniques such as dye penetrant testing (DPT) with controlled tensile testing for mechanical strength in addition to disbond and crack area mapping to complete the analysis.

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