The Design and Validation of DFT System for Mixed-Signal Circuits Based on JTAG

2013 ◽  
Vol 427-429 ◽  
pp. 636-639
Author(s):  
Guo Gang Liao ◽  
Jun Li

Nowadays with the increases of the density of large scale integrated circuits, researches of Design for Test (DFT) become more and more important, JTAG (JTAG: Joint Test Action Group, also called Boundary Scan ) has been widely used in test area , which improves the testability and reliability of mixed-signal circuits. This paper puts forward a scheme to design a Built-in Test System (BITS) based on boundary scan technology. The BITS is realized in a weapon electronic control system, which is composed of mixed-signal circuits including ARM, AD/DA, FPGA, etc. With this method, several test experiments are carried out in the BITS, which include infrastructure integrity test, interconnect test, cluster test, AD/DA test and so on. The results of experiments show that the Built-in Test System based on JTAG can work normally, which is able to reduce effectively the complexity and the time of test. In a word, the capability of BITS is viable and the system is a virtual tool in the process of DFT design and application.

2013 ◽  
Vol 313-314 ◽  
pp. 1239-1242
Author(s):  
Xun Zhou ◽  
Xiao Li Wang

In terms of the developing actuality of mixed-signal circuits, several familiar diagnosis methods are introduced in the paper including the basis principle, the merits and demerits for each method. At the same time, the design for testability based on Boundary scan is discussed. At last, the developing trends of this field is predicted.


2009 ◽  
Vol 6 (1) ◽  
pp. 38-41
Author(s):  
Lewis Dove

Mixed-signal Application Specific Integrated Circuits (ASICs) have traditionally been used in test and measurement applications for a variety of functions such as data converters, pin electronics circuitry, drivers, and receivers. Over the past several years, the complexity, power density, and bandwidth of these chips has increased dramatically. This has necessitated dramatic changes in the way these chips have been packaged. As the chips have become true VLSI (Very Large Scale Integration) ICs, the number of I/Os have become too large to interconnect with wire bonds. Thus, it has become necessary to utilize flip chip interconnects. Also, the bandwidth of the high-speed signal paths and clocks has increased into the multi Gbit or GHz ranges. This requires the use of packages with good high-frequency performance which are designed using microwave circuit techniques to optimize signal integrity and to minimize signal crosstalk and noise.


2004 ◽  
Vol 14 (02) ◽  
pp. 353-366 ◽  
Author(s):  
W. T. HOLMAN

Modern semiconductor processes can provide significant intrinsic hardness against radiation effects in digital and analog circuits. Current design techniques using commercial processes for radiation-tolerant integrated circuits are summarized, with an emphasis on their application in high performance mixed-signal circuits and systems. Examples of "radiation hardened by design" (RHBD) methodologies are illustrated for reducing the vulnerability of circuits and components to total dose, single-event, and dose-rate effects.


2009 ◽  
Vol 17 (10) ◽  
pp. 1405-1418 ◽  
Author(s):  
E. Salman ◽  
R. Jakushokas ◽  
E.G. Friedman ◽  
R.M. Secareanu ◽  
O.L. Hartin

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