Tensile Behavior and Fractography of Ti-TiAl Multi-Layered Foil Prepared by Electron Beam Physical Vapor Deposition Technology

2011 ◽  
Vol 55-57 ◽  
pp. 183-187 ◽  
Author(s):  
Zhao Hui Hu ◽  
Yi Li ◽  
Li Ma ◽  
Hong Jun Liu
Keyword(s):  
Electron Beam ◽  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Tensile Behavior ◽  
Breaking Strain ◽  
Delayed Fracture ◽  
Plastic Deformation Process ◽  
Wide Range ◽  
Vapor Deposition Technique ◽  
Physical Vapor Deposition Technique

Ti-TiAl multi-layered materials have been prepared by electron beam physical vapor deposition technique. The tensile behavior of samples at room temperature and high temperature was tested, and then the deformation mechanism at different temperature was analyzed according to the fracture surface. The results show that the tensile curves hot-pressed samples have a broad step during the plastic deformation process, and the breaking strain of the sample has been increased for a wide-range. The presence of Ti layers have led to the cracks stagger along the inter-laminar interface or the layer due to which micro laminate expresses a good characteristic of delayed fracture. With the increase of temperature, the bulk modulus and yield strength of multi-layered Ti-TiAl have been increased abnormally due to the anomalous yield strengthening behavior of TiAl intermetallic.

DEPOSITION OF THIN FILM COPPER NANOSTRUCTURES BY ELECTRON BEAM PHYSICAL VAPOR DEPOSITION TECHNIQUE ON SiO2/p-TYPE Si(100) AND STUDY OF ITS OXIDATION BEHAVIOR

2011 ◽  
Vol 25 (19) ◽  
pp. 2567-2574 ◽  
Author(s):  
M. YEGANEH ◽  
M. SAREMI
Keyword(s):  
Thin Film ◽  
Electron Beam ◽  
Integrated Circuits ◽  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Oxidation Behavior ◽  
X Ray Diffraction ◽  
Vapor Deposition Technique ◽  
Physical Vapor Deposition Technique ◽  
P Type

Electron beam physical vapor deposition (EBPVD) is being used in coating components for many applications such as for producing nanostructures and integrated circuits (ICs) coating in electronic industry. In this work, copper was deposited on the SiO 2/p-type Si (100). Thin film characteristics are investigated by scanning electron microscopy and X-ray diffraction (XRD). Then oxidation behavior of deposits was evaluated by Dektak Surface Profiler and weight gain method at 200 and 300°C. Results showed that thin film copper deposited by EBPVD has better oxidation characteristics in comparison with copper foil.

Ionic Distribution in Plasma for the Process of Electron-Beam Physical Vapor Deposition

2014 ◽  
Vol 597 ◽  
pp. 153-156
Author(s):  
Ching Yen Ho ◽  
Wen Chieh Wu
Keyword(s):  
Electron Beam ◽  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Radial Direction ◽  
State Equations ◽  
Ion Density ◽  
Ionic Distribution ◽  
Coating Efficiency ◽  
Wide Range ◽  
Coating Method

This paper investigates ionic distribution generated by electron beam (EB) during Physical Vapor Deposition (PVD). EB-PVD has a wide range of applications in thermal barrier coatings (TBCs) due to favorable characteristics compared with other coating processes. EB-PVD is an important material coating method that utilizes electron beams as heat sources to evaporate materials, which are then deposited on a substrate. Therefore EB-induced ionic distribution dominates the quality and thickness of the final coating on the substrate. Assuming the EB-generated plasma to be only a function of radial direction, the steady-state equations of continuity and motion combined with Posson’s equation were utilized to analyze the plasma distributions along the radial direction. The available experimental data are also used to validate the model. The results show that the coating efficiency can be improved by decreasing the ratio of the electron thermal energy to the initial ion energy and increasing the ratio of the initial ion density to the initial electron density. The uniformity of coating can be achieved by reducing the initial ion density.

Microstructure of Fe-Based ODS High-Temperature Alloy Sheet Prepared by EBPVD

2007 ◽  
Vol 353-358 ◽  
pp. 1637-1640 ◽  
Author(s):  
Xiu Lin ◽  
Yue Sun ◽  
Guang Pin Song ◽  
Xiao Dong He
Keyword(s):  
High Temperature ◽  
Substrate Temperature ◽  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Orientation Angle ◽  
Alloy Sheet ◽  
Columnar Microstructure ◽  
High Temperature Alloy ◽  
Vapor Deposition Technique ◽  
Physical Vapor Deposition Technique

Large-sized Fe-based ODS (Oxide Dispersive Strengthen) high-temperature alloy sheets were successfully synthesized by EBPVD (Electron Beam Physical Vapor Deposition) technique. The sheets were about 120μm thick, and having a diameter of 1000mm, whose surface roughness was less than 1μm (Ra<1μm). The microstructures were examined by SEM (Scanning Electron Microscope). The grain size was 1-4μm. When the substrate temperature was 600°C, the sheet had sharp irregular polyhedral grain, and when the substrate temperature was 700°C the sheet had quite regular grains. The morphological orientation angle increased with the distance from the center of the sheet. During the first period of deposition, the sheet was growing in a G-L-S mode, which corresponded with the corn-like microstructure in the cross-section. While during the final period, the sheet changed into a G-S growing mode, which corresponded to the smooth columnar microstructure.

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